High Power Infrared Emitter (850 nm) Version 1.6/ OS-IN SFH 4258

Transcription

1 High Power Infrared Emitter (85 nm) Version 1.6/ OS-IN SFH 4258 Features: High Power Infrared LED Half angle: ± 15 High forward current allowed at high temperature Short switching times The product qualification test plan is based on the guidelines of AEC-Q11-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. Applications Infrared Illumination for cameras IR data transmission Sensor technology Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC and IEC Ordering Information Type: Radiant Intensity Ordering Code I e [mw/sr] I F = 1 ma, t p = 2 ms SFH ( 5) Q6511A2975 SFH 4258-VAW Q6511A7277 Note: Measured at a solid angle of Ω =.1 sr

2 Version 1.6/ OS-IN SFH 4258 Maximum Ratings (T A = 25 C) Parameter Symbol Values Unit Operation and storage temperature range T op ; T stg C Reverse voltage V R 5 V Forward current I F 1 ma Surge current (t p 1 µs, D = ) I FSM 1 A Power consumption P tot 18 mw ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-1 - HBM) V ESD 2 kv Thermal resistance junction - ambient 1) page 12 R thja 3 K / W Thermal resistance junction - soldering point 2) page 12 R thjs 14 K / W Characteristics (T A = 25 C) Parameter Symbol Values Unit Peak wavelength (I F = 1 ma, t p = 2 ms) Centroid wavelength (I F = 1 ma, t p = 2 ms) Spectral bandwidth at 5% of I max (I F = 1 ma, t p = 2 ms) (typ) λ peak 86 nm (typ) λ centroid 85 nm (typ) λ 3 nm Half angle (typ) ϕ ± 15 Dimensions of active chip area (typ) L x W.3 x.3 mm x mm Rise and fall time of I e ( 1% and 9% of I e max ) (I F = 1 ma, R L = 5 Ω) Forward voltage (I F = 1 ma, t p = 2 ms) Forward voltage (I F = 1 A, t p = 1 µs) Reverse current (V R = 5 V) Total radiant flux (I F =1 ma, t p =2 ms) (typ) t r, t f 12 ns (typ (max)) V F 1.5 ( 1.8) V (typ (max)) V F 2.4 ( 3) V I R not designed for reverse operation µa (typ) Φ e 7 mw

3 Version 1.6/ OS-IN SFH 4258 Parameter Symbol Values Unit Temperature coefficient of I e or Φ e (I F = 1 ma, t p = 2 ms) Temperature coefficient of V F (I F = 1 ma, t p = 2 ms) Temperature coefficient of wavelength (I F = 1 ma, t p = 2 ms) Grouping (T A = 25 C) (typ) TC I -.5 % / K (typ) TC V -.7 mv / K (typ) TC λ.3 nm / K Group Min Radiant Intensity Max Radiant Intensity Typ Radiant Intensity I F = 1 ma, t p = 2 ms I F = 1 ma, t p = 2 ms I F = 1 A, t p = 25 µs I e, min [mw / sr] I e, max [mw / sr] I e, typ [mw / sr] SFH 4258-U SFH 4258-V SFH 4258-AW SFH 4258-BW Note: measured at a solid angle of Ω =.1 sr Only one group in one packing unit (variation lower 2:1)

4 Version 1.6/ OS-IN SFH 4258 Relative Spectral Emission I rel = f(λ), T A = 25 C 1 I rel % 8 6 3) page 12 OHF4132 3) page 12 Radiant Intensity I e / I e (1 ma) = f(i F ), single pulse, t p = 25 µs, T A = 25 C I I e 1 1 e (1 ma) 1 5 OHL Max. Permissible Forward Current I F, max = f(t A ), R thja = 3 K / W I F 12 ma 1 8 nm λ OHL ma 1 3) page 12 Forward Current I F = f(v F ), single pulse, t p = 1 µs, T A = 25 C I F 1 A I F OHL C 12 T A V 3 V F

5 Version 1.6/ OS-IN SFH 4258 Permissible Pulse Handling Capability I F = f(t p ), T A = 25 C, duty cycle D = parameter OHF t P A I t F D P = IF T 1. T D = Permissible Pulse Handling Capability I F = f(t p ), T A = 85 C, duty cycle D = parameter OHF t A P I t F D P = IF T T D = t p s t p s 1 2 Radiation Characteristics I rel = f(ϕ), T A = 25 C 3) page OHL21 ϕ

6 Version 1.6/ OS-IN SFH 4258 Package Outline.8 (.31).6 (.24) 3. (.118) 2.6 (.12) 2.3 (.91) 2.1 (.83) (.15) max. 2.1 (.83) 1.7 (.67).9 (.35).7 (.28) 3.4 (.134) 3. (.118) (2.4) (.95) 3.7 (.146) 3.3 (.13) 4 ±1.1 (.4) typ ø2.6 (.12) ø2.55 (.1) 2 1 Package marking 1.1 (.43).5 (.2).6 (.24).4 (.16).18 (.7).13 (.5) GPLY6127 Dimensions in mm (inch). Pinning Pin Description 1 Cathode 2 Anode 3 Anode 4 Anode Package Power TOPLED with Lens Approximate Weight: 37 mg

7 Version 1.6/ OS-IN SFH 4258 Recommended Solder Pad Dimensions in mm. Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-2D.1 3 C T C 217 C t P t L T p OHA C 15 t S C s 3 t

8 Version 1.6/ OS-IN SFH 4258 Profil-Charakteristik Profile Feature Ramp-up Rate to Preheat* ) 25 C to 15 C Time t S T Smin to T Smax Ramp-up Rate to Peak* ) T Smax to T P Liquidus Temperature Time above Liquidus temperature Symbol Symbol t S T L t L Minimum 6 Pb-Free (SnAgCu) Assembly Recommendation 2 3 K/s Maximum 8 1 Einheit Unit s K/s C s Peak Temperature Time within 5 C of the specified peak temperature T P - 5 K Ramp-down Rate* T P to 1 C Time 25 C to T P T P t P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range C s K/s s Taping Dimensions in mm

9 Version 1.6/ OS-IN SFH 4258 Tape and Reel 12 mm tape with 2 pcs. on 18 mm reel W 1 D P P 2 F E W A N 13. ±.25 P 1 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 4 mm * Trailer: min. 16 mm * *) Dimensions acc. to IEC ; EIA 481-D OHAY324 Tape dimensions [mm] Tape dimensions in mm W P P 1 P 2 D E F / ±.1 4 ±.1 or 8 ±.1 2 ± ± ± ±.5 Reel dimensions [mm] Reel dimensions in mm A W N min W 1 W 2max Barcode-Product-Label (BPL) EX XAM AMP MPL LE OSRAM Opto Semiconductors ors (6P) BATCH ENO: E234 (1T) LOT NO: (9D) D/M: D/C: 1234 (X) PROD NO: (Q)QTY: AMD) AMD/ D C 9999 (G) GROUP: LX XXXX RoHS Compliant Pack: RXX DEMY BIN1: XX-XX-X-XXX-X ML Temp ST X XXX C X XXX X_X123_ _ X XX-XX-X-X X-X-X OHA

10 _< C). _< _< C). 11 _< 144 Bin2: Q-1-2 Bin3: ML 2 2a 22 C R WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Version 1.6/ OS-IN SFH 4258 Dry Packing Process and Materials OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot 5% 1% 15% If wet, parts still adequately dry. change desiccant If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units 11 (9D) D/C: 144 Bin2: Q-1-2 Bin3: ML Temp ST 2 22 C R 2a CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. Transportation Packing and Materials Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 (9D) D/C: 425 (Q)QTY: 2 LSY T676 Bin1: P-1-2 Multi TOPLED Temp ST 24 C R 3 26 C RT Additional TEXT R77 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: 123GH1234 Muster (X) PROD NO: (Q)QTY: 2 LSY T676 Bin1: P-1-2 Multi TOPLED 24 C R 3 26 C RT Additional TEXT R77 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Packing Sealing label OHA244 Dimensions of transportation box in mm Width Length Height 195 ± ± 5 3 ±

11 Version 1.6/ OS-IN SFH 4258 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered

12 Version 1.6/ OS-IN SFH 4258 Glossary 1) Thermal resistance: junction -ambient, mounted on PC-board (FR4), padsize 16 mm 2 each 2) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 3) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice

13 Version 1.6/ OS-IN SFH 4258 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-9355 Regensburg All Rights Reserved