Silicon PIN Photodiode Version 1.3 SFH 206 K
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1 Silicon PIN Photodiode Version 1.3 Features: Especially suitable for applications from 4 nm to 11 nm Short switching time (typ. 2 ns) 5 mm LED plastic package Also available on tape and reel Applications Photointerrupters Industrial electronics For control and drive circuits Computer-controlled flashes Ordering Information Type: Ordering Code Q6272P
2 Maximum Ratings (T A = 25 C) Parameter Symbol Values Unit Operating and storage temperature range T op ; T stg C Reverse voltage V R 32 V Total Power dissipation P tot 15 mw ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-1 - HBM) Characteristics (T A = 25 C) V ESD 2 V Parameter Symbol Values Unit Spectral sensitivity (V R = 5 V, standard light A, T = 2856 K) (typ) S 8 ( 5) na/ix Wavelength of max. sensitivity (typ) λ S max 85 nm Spectral range of sensitivity (typ) λ 1% (typ) Radiant sensitive area (typ) A 7.2 mm 2 Dimensions of radiant sensitive area (typ) L x W 2.65 x 2.65 mm x mm Half angle (typ) ϕ ± 6 Dark current (V R = 1 V) Spectral sensitivity of the chip (λ = 85 nm) Quantum yield of the chip (λ = 85 nm) Open-circuit voltage (E v = 1 lx, Std. Light A) Short-circuit current (E v = 1 lx, Std. Light A) Rise and fall time (V R = 5 V, R L = 5 Ω, λ = 85 nm, I P = 8 µa) Forward voltage (I F = 1 ma, E = ) Capacitance (V R = V, f = 1 MHz, E = ) nm (typ (max)) I R 2 ( 3) na (typ) S λ typ.62 A / W (typ) η.9 Electro ns /Photon (typ (min)) V O 365 ( 31) mv (typ) I SC 8 µa (typ) t r, t f.2 µs (typ) V F 1.3 V (typ) C 72 pf Temperature coefficient of V O (typ) TC V -2.6 mv / K
3 Parameter Symbol Values Unit Temperature coefficient of I SC (Std. Light A) Noise equivalent power (V R = 1 V, λ = 85 nm) Detection limit (V R = 1 V, λ = 85 nm) (typ) TC I.18 % / K (typ) NEP.41 pw / Hz ½ (typ) D * 6.5e12 cm x Hz ½ / W Relative Spectral Sensitivity S rel = f(λ) Photocurrent / Open-Circuit Voltage I P (V R = 5 V) / V O = f(e v ) 1 OHF78 S rel % nm 11 λ
4 Power Consumption P tot = f(t A ) Dark Current I R = f(v R ), E = P tot 16 mw 14 OHF C 1 T A Capacitance C = f(v R ), f = 1 MHz, E = Dark Current I R = f(t A ), V R = 1 V, E = Ι R 1 3 na OHF C 1 T A
5 Directional Characteristics S rel = f(ϕ) ϕ 1. OHF Package Outline Area not flat 6.9 (.272) 6.3 (.248).8 (.31) 4. (.157).8 (.31).4 (.16) 34 (1.339) 32 (1.26).6 (.24) x.5 (.2).4 (.16) x.3 (.12) 1.8 (.71) 1.2 (.47) 2.54 (.1) spacing Radiant sensitive area 5.1 (.21) 4.7 (.185) Cathode 4.1 (.161) 3.7 (.146) GEOY6647 Dimensions in mm (inch). Package 5mm Radial (T 1 ¾), Epoxy
6 Approximate Weight:.3 g Note Packing information is available on the internet (online product catalog). Recommended Solder Pad Dimensions in mm. Note: pad 1: anode
7 TTW Soldering IEC TTW 3 C T C - 26 C First wave Preheating 13 C 12 C 1 C 1 s max., max. contact time 5 s per wave T < 15 K Second wave Typical OHA4645 Continuous line: typical process Dotted line: process limits Cooling ca. 3.5 K/s typical ca. 2 K/s ca. 5 K/s 5 Disclaimer s 24 Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. t
8 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice
9 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-9355 Regensburg All Rights Reserved
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