SFH OSLON Black Flat. Applications. Features: Ordering Information. Produktdatenblatt Version 1.1 SFH 4735

Transcription

1 Produktdatenblatt Version 1.1 OSLON Black Flat OSLON Black Flat (IR broad band emitter) Applications Infrared Spectroscopy Features: Package: diffuse silicone ESD: 2 kv acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) Spectral range of emission: (typ) nm Wide viewing angle of 120 Low thermal resistance (Max. 9 K/W) Ordering Information Type Total radiant flux 1) Ordering Code typ. I F = 350 ma; λ = 600nm nm; t p = 20ms Φ e 16 mw Q65111A Version

2 Maximum Ratings T A = 25 C Parameter Symbol Values Operating temperature T op min. max. Storage temperature T stg min. max. -40 C 85 C -40 C 85 C Junction temperature T j max. 125 C Forward current I F max. 500 ma Surge current t p 1 ms; D = 0 I FSM max. 1 A Reverse current 2) I R max. 200 ma Power consumption P tot max W ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) V ESD max. 2 kv For the forward current and power consumption please see maximum permissible forward current diagram 2 Version

3 Characteristics I F = 350 ma; t p = 20 ms; T A = 25 C Parameter Symbol Values Half angle φ typ. 60 Forward voltage V F typ. max. Forward voltage I F = 500 ma; t p = 100 µs Reverse voltage 2) I R = 20 ma V F typ. max V 3.5 V 3 V 3.8 V V R max. 1.2 V Reverse voltage (ESD device) 2) V R ESD min. 45 V Radiant intensity 3) λ = nm Radiant intensity 3) λ = nm Total radiant flux 1) λ = nm Total radiant flux 1) λ = nm Spectral flux λ = 750 nm Spectral flux λ = 850 nm Spectral flux λ = 950 nm I e typ. 59 mw/sr I e typ. 5 mw/sr Φ e typ. 184 mw Φ e typ. 16 mw Φ e,λ typ. 60 µw/nm Φ e,λ typ. 45 µw/nm Φ e,λ typ. 45 µw/nm Thermal resistance junction solder point real 4) R thjs max. 9.0 K / W 3 Version

4 Relative Spectral Emission I e,rel = f (λ); I F = 350 ma; t p = 10 ms 5), 6) Radiation Characteristics I e,rel = f (φ) 5), 6) OHL01660 ϕ Version

5 Forward current 5), 6) I F = f (V F ); λ = 600 nm nm; single pulse; t p = 100 µs Relative Total Radiant Flux 5), 6) Φ e /Φ e (350mA) = f (I F ); λ = 600 nm nm; single pulse; t p = 20 ms Φ Φ [ ] 5 Version

6 Max. Permissible Forward Current I F,max = f (T S ); R thjs = 9.0 K / W [ ] 0.5 Permissible Pulse Handling Capability I F = f (t p ); duty cycle D = parameter; T S = 85 C [ ] 1, , , [ ] 0,4 0,2 :D=1 :D=0,5 :D=0,2 :D=0,1 :D=0,05 :D=0,02 :D=0,01 :D=0,005 0, ,01 0, [ ] 6 Version

7 Dimensional Drawing 7) Approximate Weight: Package marking: ESD advice: 23.0 mg Anode The device is protected by ESD device which is connected in parallel to the Chip. 7 Version

8 Recommended Solder Pad 7) Recommended Solder Pad 7) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. 8 Version

9 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 300 C T C 217 C t P t L T p OHA C 150 t S C s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 150 C 2 3 K/s Time t S t S s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L s Peak temperature T P C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C t P s 3 6 K/s Time 480 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 9 Version

10 Taping 7) Tape and Reel 8) W 1 D 0 P 0 P 2 ±0.25 P 1 F E W A N 13.0 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC ; EIA 481-D OHAY Version

11 Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 180 mm / Barcode-Product-Label (BPL) 11 Version

12 _< C). _< _< C). _< ML 2 2a Bin3: 220 C R Avoid metal contact. Do not eat. If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units If wet, parts still adequately dry. change desiccant Dry Packing Process and Materials 7) OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. WET 15% Comparator check dot 10% 5% ML 2 2a 220 C R CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. Schematic transportation box 7) Barcode label Barcode label CAUTION LEVEL This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours If blank, see bar code label OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: GH1234 LSY T676 Multi TOPLED Additional TEXT R077 PACKVAR: P-1+Q-1 OHA02044 Muster (X) PROD NO: 1 (9D) D/C: (Q)QTY: 2000 Bin1: P-1-20 Bin2: Q-1-20 Temp ST 240 C R C RT (G) GROUP: R18 DEMY OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: GH1234 Muster (X) PROD NO: 1 (9D) D/C: (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P-1-20 Bin2: Q-1-20 Bin3: Temp ST 240 C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: R18 DEMY P-1+Q-1 OSRAM Packing Sealing label 12 Version

13 Dimensions of transportation box in mm Width Length Height 195 ± 5 mm 195 ± 5 mm 30 ± 5 mm 13 Version

14 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC For further application related informations please visit 14 Version

15 Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 15 Version

16 Glossary 1) Total radiant flux: Measured with integrating sphere. 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 5) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 6) Testing temperature: TA = 25 C 7) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 8) Tape and Reel: All dimensions and tolerances are specified acc. IEC and specified in mm. 16 Version

17 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D Regensburg All Rights Reserved. 17 Version