KO DELPS1.22 TOPLED E1608. Applications. Features: Produktdatenblatt Version 1.1 KO DELPS1.22
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1 Produktdatenblatt Version 1.1 TOPLED E1608 The TOPLED E1608 expands OSRAM Opto Semiconductors low power portfolio by offering one of the smallest LED Industry standard footprints in a highly reliable and well proved package concept. Its outstanding performance is suitable for a huge variety of applications especially automotive interior where a small package design with excellent reliability is needed. The TOPLED E1608 is available in different colors and brightness levels. Applications Cluster, Button Backlighting Electronic Equipment Interior Illumination (e.g. Ambient Map) Features: Package: white SMT package, colorless clear resin Chip technology: Thinfilm Typ. Radiation: 120 (Lambertian emitter) Color: λ dom = 606 nm ( orange) Corrosion Robustness Class: 1B ESD: 2 kv acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) 1 Version
2 Ordering Information Type Luminous Intensity 1) Ordering Code = 20 ma I v -UGVI-24-H3Q mcd Q65112A Version
3 Maximum Ratings Parameter Symbol Values Operating Temperature T op min. max. Storage Temperature T stg min. max. -40 C 110 C -40 C 110 C Junction Temperature T j max. 125 C Forward current T S = 25 C Surge Current t 10 µs; D = ; T S = 25 C Reverse voltage 2) T S = 25 C ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) min. max. 1 ma 30 ma S max. 70 ma V R max. 5 V V ESD 2 kv 3 Version
4 Characteristics = 20 ma; T S = 25 C Parameter Symbol Values Peak Wavelength 3) λ peak typ. 610 nm Dominant Wavelength 3) = 20 ma λ dom min. typ. max. 600 nm 606 nm 609 nm Spectral Bandwidth at 50% I rel,max λ typ. 17 nm Viewing angle at 50 % I V 2φ typ. 120 Forward Voltage 4) = 20 ma Reverse current 2) V R = 5 V Temperature Coefficient of Peak Wavelength -10 C T 100 C V F I R min. typ. max. typ. max V 2.30 V 2.50 V 0.2 µa 10 µa TC λpeak typ nm / K Real thermal resistance junction/solderpoint 5) R thjs real typ. max. 120 K / W 150 K / W 4 Version
5 Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 6) = 20 ma = 20 ma = 20 ma min. max. typ. I v I v Φ V UG 450 mcd 520 mcd 1600 mlm UH 520 mcd 610 mcd 1900 mlm UI 610 mcd 710 mcd 2200 mlm VG 710 mcd 820 mcd 2500 mlm VH 820 mcd 970 mcd 3000 mlm VI 970 mcd 1120 mcd 3400 mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) = 20 ma = 20 ma min. max. V F V F H V 2.10 V L V 2.30 V Q V 2.50 V Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) = 20 ma min. = 20 ma max. λ dom λ dom nm 603 nm nm 606 nm nm 609 nm 5 Version
6 Group Name on Label Example: UG-2-H3 Brightness Wavelength Forward Voltage UG 2 H3 6 Version
7 Relative Spectral Emission 6) I rel = f (λ); = 20 ma; T S = 25 C 1,0 I rel :V λ :orange 0,8 0,6 0,4 0,2 0, λ [nm] Radiation Characteristics 6) I rel = f (ϕ); T S = 25 C ϕ [ ] ,0 Irel :0 : 90 0, ,6-70 0,4-80 0,2-90 0, Version
8 Forward current 6), 7) Relative Luminous Intensity 6), 7) = f(v F ); T S = 25 C I v /I v (20 ma) = f( ); T S = 25 C 70 [ma] I V I V (20mA) 3,0 60 2,5 50 2,0 40 1, ,0 10 0,5 1 1,7 2,0 2,2 2,4 2,6 2,8 3,1 V F [V] 0, [ma] 8 Version
9 Forward Voltage 6) ΔV F = V F - V F (25 C) = f(t j ); = 20 ma Relative Luminous Intensity 6) I v /I v (25 C) = f(t j ); = 20 ma V F [V] 0,3 I v I v (25 C) 1,6 0,2 1,4 1,2 0,1 1,0 0,0 0,8-0,1 0,6 0,4-0,2 0,2-0, T j [ C] 0, T j [ C] Dominant Wavelength 6) Δλ dom = λ dom - λ dom (25 C) = f(t j ); = 20 ma λ dom [nm] T j [ C] 9 Version
10 Max. Permissible Forward Current = f(t) [ma] :T s T [ C] Permissible Pulse Handling Capability = f(t p ); D: Duty cycle [ma] T S =0 C C :D=1.0 :D=0.5 :D=0.2 :D=0.1 :D=0.05 :D=0.02 :D=0.01 :D= ,01 0, Pulse time [s] 10 Version
11 Dimensional Drawing 8) Approximate Weight: Package marking: Corrosion test: 2.0 mg Anode Class: 1B Test condition: 25 C / 75 % RH / 200ppb SO 2, 200ppb NO 2, 10ppb H 2 S, 10ppb Cl 2 / 21 days (EN (Method 4)) 11 Version
12 Electrical internal circuit 12 Version
13 Recommended Solder Pad 8) All products are packed in a dry pack bag (Moisture Barrier Bag, MBB) according MIL-PRF-81705, after opening the MBB the products should go to reflow soldering process. Unused remaining LEDs should be protected from environment due to silver plated soldering terminal. In order to maintain solderability it is recommended to protect the silver plated solder terminals from corrosive environment before soldering. For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. 13 Version
14 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E 300 C T C 217 C t P t L T p OHA C 150 t S C s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 150 C 2 3 K/s Time t S t S s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L s Peak temperature T P C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C t P s 3 6 K/s Time 480 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 14 Version
15 Taping 8) 15 Version
16 Tape and Reel 9) Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 180 mm / Version
17 _< C). _< Avoid metal contact. Do not eat. If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. If wet, parts still adequately dry. change desiccant WET Comparator check dot 15% 10% 5% CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD Version
18 _< C). _< Bin3: ML C R 2a ML C R 2a Transportation Packing and Materials 8) Barcode label Barcode label CAUTION LEVEL This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours If blank, see bar code label OSRAM Opto Semiconductors LSY T676 Multi TOPLED 240 C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OHA02044 Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH (Q)QTY: 2000 Bin1: P-1-20 Bin2: Q-1-20 Temp ST OSRAM Opto Semiconductors Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P-1-20 Bin2: Q-1-20 Bin3: Temp ST 240 C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OSRAM Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm 18 Version
19 Type Designation System Emission Color Color coordinates according CIE 1931/Emission color: O: orange (606 nm) W: white Y: yellow (587 nm) P: pure green (560 nm) T: true green (528 nm) S: super red (633 nm) Technology Concept S: Silicone encapsulation (casted) Platform: pre-molded K: Automotive and Industry Product Package Type D: Top emitting device Leadframe based White reflector package Product version K O D E L P S Lead / Package Properties TOPlooker: E: 1608 Sidelooker: E: 5515 Ceramic packages: E: 1915 Encapsulant Type / Lens Properties L: No lens (Lambertian) Chip Technology: P: Standard power class Q: Elevated power class M: Medium performance Special Characteristic 1: InGaN saturated colors 2: INGaAlP or AlGaAs saturated colors F: Full conversion (color depending on color description) R: standard cold white Binning Information: 2: mcd A: Automotive interior binning: FKPL P: COD Puregreen 19 Version
20 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC For further application related informations please visit 20 Version
21 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 21 Version
22 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single devices within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC and specified in mm. 22 Version
23 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D Regensburg All Rights Reserved. 23 Version
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