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1 EL Power TOP VIEW LED Features Package:Cool White LED with PLCC 3 package Emitted Color:Cool White Typ. Luminance Intensity:2,800 30mA Typ. Luminous Flux:8.5 30mA Viewing angle:120 o ESD:up to 8KV MSL:2 Preconditioning:According to JEDEC J-STD 020D Level 2 Qualifications: According to AEC-Q101 Compliance with RoHS and REACH Au Plating L/F Applications Automotive Interior Lighting, Dashboard, Switch, Reading lamp, Audio and Car Infortainment,etc. Backlight: LCD, switches, symbol, mobile phone and illuminated advertising. Optical indicator. General applications.

2 Contents Characteristics... 3 Absolute Maximum Ratings... 4 Characteristics Graph... 5 Binning Information Part Number Ordering Information Mechanical Dimension Recommended Soldering Pad Reflow Soldering Profile Packaging Information Precaution for Use

3 1. Characteristics Parameter Symbol Min. Typ. Max. Unit Condition Forward Current Cool White I F ma --- Luminous Intensity Cool White I v mcd I F =30mA Forward Voltage Cool White V F V I F =30mA Viewing Angle Cool White φ deg I F =30mA Color Cool White CIE x I F =30mA Color Cool White CIE y I F =30mA Thermal Resistance (Junction to Solder) Real R th JS real Electrical R th JS el K/W I F =30mA Notes: 1. Luminous Intensity measurement tolerance: ±8%. 2. The data of Luminous Intensity measured at thermal pad=25 C. 3. Typical luminous Intensity or light output performance is operated within the condition guided by this datasheet. 4. Forward voltage measurement tolerance: ±0.05V. 5. The V F range shown in the table above indicates 99% output. 6. Tolerance of Chromaticity Coordinates x,y: ±

4 2. Absolute Maximum Ratings Parameter Symbol Ratings Unit Power Dissipation P d mw Forward Current I F 5~50 ma Surge Current (t<=10 µs; D=0.005; T s =25 ) I FM 250 ma Reverse Voltage V R Not designed for reverse operation V Junction Temperature T J 125 C Operating Temperature T opr -40 ~ +110 C Storage Temperature T stg -40 ~ +110 C ESD Sensitivity (R=1.5kΩ, C= 100pF) ESD HBM 8 kv Soldering Temperature Reflow 260 C for 30sec C 4

5 3. Characteristics Graph Wavelength Characteristics Relative Spectral Ts = 25 C, I F =30mA, RH=30% I V = f(λ) 1.0 Relative Luminous Intenstiy Wavelength(nm) Typical Diagram Characteristics of Radiation Φ ) V Φ ( 0 o = V f ( ϕ) Relative Luminous Intensity ϕ [ ] Notes: 1. φ is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 5

6 Forward Current vs. Forward Voltage I F = f(v F Ts = 25 C 60 Forward Current [ma] Forward Voltage [V] Luminous vs. Forward Current I V /I V(30mA) = f(i F Ts = 25 C 2.0 Relative Luminous Intensity Forward current [ma] 6

7 Chromaticity Coordinates Shift vs. Forward Ts = 25 C CIE x, CIE y= f (I F ) CIE-X CIE-Y Chromaticity Coordinates Forward Current [ma] Relative Forward Voltage vs. Junction Temperature V F -V F (T J 25 o C)= f (T J I F =30mA 0.3 Relative Forward Voltage Junction Temperature [ 0 C] 7

8 Relative Luminous Intensity vs. Junction Temperature I V /I V (T J 25 o C)= f (T J I F =30mA 1.4 Relative Luminous Intensity Junction Temperature [ o C] Chromaticity Coordinates Shift vs. Junction I F =30mA CIE x, CIE y (T J 25 o C)= f (T J ) CIE-X CIE-Y Chromaticity Coordinates Junction Temperature [ 0 C] 8

9 Forward Current Derating Curve I F = f (T S ) 60 T S (100, 50) Forward Current [ma] Do not use current below 5mA Soldering Pad Temperature [ 0 C] Permissible Pulse Handling Capability I F = f (t p ); D=Duty cycle; T A = I F A D= t p 9

10 4. Binning Information Luminous Intensity Bins Group Bin Minimum Luminous Intensity (mcd) Maximum Luminous Intensity (mcd) L L M M N N P P Q Q R R S S T T U U V V AA AB BA BB CA CB DA DB EA EB FA FB GA Notes: 1. Luminous flux measurement tolerance: ±8%. 2. Highlighted Black Box is available bins. 10

11 White Color Bin Structure White Color Bin Coordinates Bin CIE x CIE y Bin CIE x CIE y A B Reference Range: 6240~6530K Reference Range: 6240~6530K Bin CIE x CIE y Bin CIE x CIE y C D Reference Range: 6240~6680K Reference Range: 6240~6680K Bin CIE x CIE y Bin CIE x CIE y A B Reference Range: 5850~6240K Reference Range: 5850~6240K 11

12 Bin CIE x CIE y Bin CIE x CIE y C D Reference Range: 5850~6240K Reference Range: 5850~6240K Bin CIE x CIE y Bin CIE x CIE y A B Reference Range: 5500~5850K Reference Range: 5500~5850K Bin CIE x CIE y Bin CIE x CIE y C D Reference Range: 5500~5850K Reference Range: 5500~5850K Bin CIE x CIE y Bin CIE x CIE y A B Reference Range: 5180~5500K Reference Range: 5180~5500K Bin CIE x CIE y Bin CIE x CIE y C D Reference Range: 5180~5500K Reference Range: 5180~5500K 12

13 Forward Voltage Bins Bin code Forward Voltage [V] Notes: 1. Forward voltage measurement tolerance: ±0.05V. 2. Forward voltage bins are defined at I F = 30mA operation. 13

14 5. Part Number Part number is designated with below details = Product family name. C = Color [1] 7 = CRI (0=N/A; >70%=7; >80%=8; >90%=9) 030 = Test current [ma] 0 = Lead Frame Type (0=Ag; 1=Au) H = Brightness Level (H=High; L=Low) AM = Automotive application Note [1] Color: Symbol C N W PA PR UB IB SB UG UY UA UR SR RGB Description Cool White Neutral White Warm White Phosphor Converted Amber Phosphor Converted Red Blue lce Blue Sky Blue Green Yellow Amber Red Super Red RGB-Color 14

15 6. Ordering Information C70300H-ABCDEFGHJKLMNO-PQ-AM Part Number of the Order Code C70301H-53A64DBBCB2737-2T-AM Order code contains information with below details: ABCDEF = min/max wavelength or CCT GHJK = min./max. luminous flux in [lm] or luminous intensity in [mcd] LMNO = min./max. forward voltage PQ = internal code AM = Automotive Application 15

16 7. Mechanical Dimension Notes: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. 16

17 8. Recommended Soldering Pad 9. Reflow Soldering Profile Soldering Condition (Reference: IPC/JEDEC J-STD-020D) Profile Feature Pb-Free Assembly Recommendation Unit Ramp-up rate to preheat 25 C to 150 C 3 C /sec Time of soaking zone 150 C to 200 C 120 sec Ramp-up rate to peak 3 C /sec Liquefied temperature 217 C Time above liquefied temperature 100 sec Peak temperature (max.) 260 C Time within 5 C of the specified peak temperature 30 sec Ramp-down Rate (max.) 6 C /sec 17

18 10. Packaging Information Product Labeling CPN:Customer s Product Number P/N:Everlight Part Number QTY:Packing Quantity CAT:Luminous Flux (Brightness) Bin HUE:Color Bin REF:Forward Voltage Bin LOT No:Lot Number Packing: Loaded Quantity 2000 pcs Per Reel Notes: 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.2mm. 18

19 Reel Dimensions Notes: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ±0.2mm. Moisture Resistant Packing Process Notes: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ±0.2mm. 19

20 11. Precaution for Use 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (burn out will happen). 2. Assemblies Do not stack assemblies containing LEDs to prevent damage to the optical surface of LEDs. Forces applied to the optical surface may result in the surface being damaged. 3. Soldering Condition 3.1 When soldering, do not put stress on the LEDs during heating. 3.2 After soldering, do not warp the circuit board. 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 20

21 Current version: Mar Issue No: Version: 2.0 Created by: una lin Revision History Rev. Subjects (major change in previous version) Modified date 1.0 Standard data sheet 2016/12/ Add MSL, surge current, Permissible Pulse Handling Capability fig 2017/03/23 21