EL Advanced Power TOP VIEW LED A09K-PA1501H-AM

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1 EL Advanced Power TOP VIEW LED Features Package:Phosphor Converted Amber LED with PLCC 6 package Emitted Color:Phosphor Converted Amber Typ. Luminance Intensity: mA Typ. Luminous Flux:20 150mA Viewing angle:120 o ESD:up to 8KV MSL:2 Preconditioning:According to JEDEC J-STD 020D Level 2 Qualifications; According to AEC-Q101 Compliance with RoHS and REACH MSL Level 2 Au Plating L/F Applications Automotive Interior Lighting, Dashboard, Switch, Reading lamp, Audio and Car Infortainment, etc. Backlight: LCD, switches, symbol, mobile phone and illuminated advertising. Optical indicator. General applications.

2 Contents Characteristics... 3 Absolute Maximum Ratings... 4 Characteristics Graph... 5 Binning Information Part Number Ordering Information Mechanical Dimension Recommended Soldering Pad Reflow Soldering Profile Packaging Information Precaution for Use

3 1. Characteristics Forward Current Luminous Intensity Forward Voltage Viewing Angle Color Color Thermal Resistance (Junction to Solder) Parameter Symbol Min. Typ. Max. Unit Condition Phosphor Converted Amber Phosphor Converted Amber Phosphor Converted Amber Phosphor Converted Amber e Phosphor Converted Amber Phosphor Converted Amber I F ma --- I V mcd I F =150mA V F V I F =150mA φ deg I F =150mA I F =150mA I F =150mA Real R th JS real Electrical R th JS el K/W I F =150mA Notes: 1. Luminous Intensity measurement tolerance: ±8%. 2. The data of Luminous Intensity measured at thermal pad=25 C. 3. Typical luminous Intensity or light output performance is operated within the condition guided by this datasheet. 4. Forward voltage measurement tolerance: ±0.05V. 5. The V F range shown in the table above indicates 99% output. 6. Tolerance of Chromaticity Coordinates: ±

4 2. Absolute Maximum Ratings Parameter Symbol Ratings Unit Power Dissipation P d 750 mw Forward Current I F 20~200 ma Surge Current (t<=10 μs; D=0.005; T s =25 ) I FM 750 ma Reverse Voltage V R Not designed for reverse operation V Junction Temperature T J 125 C Operating Temperature T opr -40 ~ +110 C Storage Temperature T stg -40 ~ +110 C ESD Sensitivity (R=1.5kΩ, C= 100pF) ESD HBM 8 kv Soldering Temperature Reflow 260 C for 30sec C 4

5 3.Characteristics Graph Wavelength Characteristics Relative Spectral Ts = 25 C, I F =150mA, RH=30% I V = f( ) Typical Diagram Characteristics of Radiation ) V ( 0 V f Notes: 1. φ is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 5

6 Forward Current vs. Forward Voltage I F = f(v F Ts = 25 C Relative Luminous Intensity vs. Forward Current I V /I V(150mA) = f(i F Ts = 25 C 6

7 Relative Forward Voltage DATASHEET Chromaticity Coordinates Shift vs.forward Ts = 25 C CIE x, CIE y= f (I F ) Relative Forward Voltage vs. Junction I F =150mA V F -V F (T J 25 o C)= f (T J ) Junction Temperature [ 0 C] 7

8 Chromaticity Coordinates Relative Luminous Intensity DATASHEET Relative Luminous Intensity vs. Junction Temperature I V /I V (T J 25 o C)= f (T J I F =150mA Junction Temperature [ o C] Chromaticity Coordinates Shift vs. Junction I F =150mA CIE-X CIE-Y Junction Temperature [ o C] 8

9 Forward Current Derating Curve I F = f (T S ) Do not use current below 20mA Permissible Pulse Handling Capability I F = f (t p ); D=Duty cycle; T A = I F A D= t 2 p 9

10 4.Binning Information Luminous Intensity Bins Group Bin Minimum Luminous Intensity (mcd) Maximum Luminous Intensity (mcd) L L M M N N P P Q Q R R S S T T U U V V AA AB BA BB CA CB DA DB EA EB FA FB GA Notes: 1. Luminous flux measurement tolerance: ±8%. 2. Highlighted Black Box is available bins. 10

11 CIE y DATASHEET Phosphor Converted Amber Bin Structure YB ECE Phosphor Yellow Specification YA CIE x Phosphor Converted Amber Bin Coordinates Bin CIE x CIE y Bin CIE x CIE y YA YB

12 Forward Voltage Bins Bin code Forward Voltage [V] Notes: 1. Forward voltage measurement tolerance: ±0.05V. 2. Forward voltage bins are defined at I F = 150mA operation. 12

13 5.Part Number Part number is designated with below details. A09K = Product family name. PA = Color [1] 150 = Test current [ma] 1 = Lead Frame Type (0=Ag; 1=Au) H = Brightness Level (H=High; L=Low) AM = Automotive application Note [1] Color: Symbol C N W PA PR UB IB SB UG UY UA UR SR RGB Description Cool White Neutral White Warm White Phosphor Converted Amber Phosphor Converted Red Blue lce Blue Sky Blue Green Yellow Amber Red Super Red RGB-Color 13

14 6.Ordering Information A09K-PA1501H-ABCDEFGHJKLM-NO-AM Part Number of the A09K Order Code A09K-PA1501H-YAYBDBEB2737-1T-AM Order code contains information with below details: ABCD = min/max wavelength or CCT EFGH = min./max. luminous flux in [lm] or luminous intensity in [mcd] JKLM = min./max. forward voltage NO = internal code AM = Automotive Application 14

15 7. Mechanical Dimension Notes: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm. 15

16 8. Recommended Soldering Pad 9. Reflow Soldering Profile Soldering Condition (Reference: IPC/JEDEC J-STD-020D) Profile Feature Pb-Free Assembly Recommendation Unit Ramp-up rate to preheat 25 C to 150 C 3 C /sec Time of soaking zone 150 C to 200 C 120 sec Ramp-up rate to peak 3 C /sec Liquidus temperature 217 C Time above liquidus temperature 100 sec Peak temperature (max.) 260 C Time within 5 C of the specified peak temperature 30 sec Ramp-down Rate (max.) 6 C /sec 16

17 10. Packaging Information Product Labeling CPN:Customer s Product Number P/N: Everlight Part Number QTY:Packing Quantity CAT:Luminous Flux (Brightness) Bin HUE:Color Bin REF:Forward Voltage Bin LOT No:Lot Number Packing: Loaded Quantity 1000 pcs Per Reel Notes: 1. Dimensions are in millimeters. 2. Tolerances for fixed dimensions are ±0.2mm. 17

18 Reel Dimensions Notes: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ±0.2mm. Moisture Resistant Packing Process Notes: 1. Dimensions are in millimeters. 2. Tolerances unless mentioned are ±0.2mm. 18

19 11. Precaution for Use 1. Over-current-proof Customer must apply resistors for protection; otherwise slight voltage shift will cause big current change (burn out will happen). 2. Assemblies Do not stack assemblies containing LEDs to prevent damage to the optical surface of LEDs. Forces applied to the optical surface may result in the surface being damaged. 3. Soldering Condition 3.1 When soldering, do not put stress on the LEDs during heating. 3.2 After soldering, do not warp the circuit board. 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 19

20 Current version: Dec Issue No: Version: 2.0 Created by: Vicky Feng Revision History Rev. Subjects (major change in previous version) Modified date 1.0 Standard datasheet 2016/12/ Add MSL, surge current, Permissible Pulse Handling Capability fig 2017/3/16 20

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