Surface Mount Polyethylene Naphthalate (PEN) Film Capacitor LDE, Unencapsulated Stacked Chip, Size , 50 1,000 VDC (Automotive Grade)

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1 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Overview Polyethylene naphthalate (PEN) film capacitor for surface mounting which meets the demanding Automotive Electronics Council's AEC Q200 qualification requirements. Applications Typical applications include filtering, timing, bypassing and coupling. LDE is a general purpose series designed for the highest reliability and high temperature service. Not suitable for across-the-line application (see suppressor capacitors). Benefits Rated voltage: 50,000 Rated voltage: Capacitance range: µf EIA size: Capacitance tolerance: ±%, ±20%, ±5% on request Climatic category: 55/25/56 RoHS Compliant and lead-free terminations Operating temperature range of 55 C to +25 C Automotive (AEC Q200) grades available System LDE C C 2560 M A 5 N 00 Series Metallized PEN Rated Voltage () C = 50 D = 63 E = 0 I = 250 M = 400 P = 630 Q =,000 See Dimension Table Capacitance (pf) Digits two four indicate the first three digits of the capacitance value. First digit indicates the number of zeros to be added. Capacitance Tolerance K = ±% M = ±20% J = ±5% on request Dielectric Version Packaging Internal Use A = PEN 5 = Standard 0 = Miniature See Ordering Options Table 00 (Standard) One world. One KEMET KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208

2 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Ordering Options Table Packaging Type Standard Packaging Options Tape and Reel (Standard Reel) Packaging N Dimensions Millimeters W L H B Chip (EIA) A ±0.2 W H L B Nominal Tolerance (Maximum) Nominal Tolerance Nominal Tolerance / / 0.3 B ± / / 0.3 C ± / / 0.3 D ± ± / 0.3 See Table E ± ± / 0.3 F ±0.5.5 ± / 0.3 G ± ± / 0.3 H ± / / 0.3 KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 2

3 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Performance Characteristics Rated Voltage () ,000 Rated Voltage () Capacitance Range (μf) Chip (EIA) Capacitance Values Capacitance Tolerance Category Temperature Range Rated Temperature Voltage Derating E2 series ±%, ±20%, ±5% on request 55 C to +25 C +5 C Vc (category voltage) = Vr (rated voltage) up to 5 C. Vc is decreased with.25%/ C from +5 C to +25 C Climatic Category 55/25/56 Capacitance Drift Maximum 3% (sizes 22.20) after a 2 year storage period at a temperature of + C to +40 C and a relative humidity of 40% to 60% Maximum 2% (sizes > 22.20) after a 2 year storage period at a temperature of + C to +40 C and a relative humidity of 40% to 60% Reliability (Reference MIL-HDBK-27) Failure rate FIT, T = +40 C, V = 0.5 x V R FIT = 9 failures / (components * hours) Failure criteria: open or short circuit, cap. change > %, DF 2 times the catalog limits, IR < x initial limit Measured at +25 C ±5 C Minimum Value Between Terminals C 0.33 µf,000 MΩ Insulation Resistance C > 0.33 µf 400 MΩ µf Charging time: minute Charging voltage: V DC for V R < 0 V DC 0 V DC for V R 0 V DC Dissipation Factor Maximum Values at 25 C ±5 C khz 0.8% Surge Voltage Test.4 x V R (2 seconds; T = 25 ± 5 C) for V R 630 V DC.5 x V R (2 seconds; T = 25 ± 5 C) for V R =,000 V DC Maximum dv/dt 0 V/us for V R 630 V DC 300 V/us for V R =,000 V DC Qualification Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details regarding test methods and conditions are referenced in document AEC Q200, Stress Test Qualification for Passive Components. For additional information regarding the Automotive Electronics Council and AEC Q200, please visit their website at KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 3

4 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Maximum V rms and I rms vs. Frequency (Sinusoidal Waveform/Th* +85 C) / / µf.0 µf 2.2 µf 4.7 µf V RMS [V] 0.47 µf.0 µf 2.2 µf 4.7 µf I RMS [A] 0, , / µf 2.2 µf.0 µf 0.47 µf 0 /63 V RMS [V] 0.47 µf.0 µf 2.2 µf 4.7 µf I RMS [A] 0, ,000, / / µf 0.47 µf 0.22 µf µf V RMS [V] µf 0.22 µf 0.47 µf.0 µf I RMS [A] 0, ,000 *Maximum ambient temperature surrounding the capacitor or hottest contact point, e.g., tracks, whichever is higher, in the worst operating conditions in C. Measurements performed in free air condition. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 4

5 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Maximum V rms and I rms vs. Frequency (Sinusoidal Waveform/Th* +85 C), / µf µf µf 0.0 µf 400 /60 V RMS [V] 0.0 µf µf µf 0.47 µf I RMS [A] 0, ,000, / / µf µf µf 0.0 µf V RMS [V] 0.0 µf µf µf 0.22 µf I RMS [A] 0, ,000,000,000 /250,000 / ,300 pf 0.0 µf µf µf V RMS [V] 3,300 pf 0.0 µf µf µf I RMS [A] 0, ,000 *Maximum ambient temperature surrounding the capacitor or hottest contact point, e.g., tracks, whichever is higher, in the worst operating conditions in C. Measurements performed in free air condition. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 5

6 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) PEN Dielectric Typical Temperature Graphs C/C [%] Capacitance vs. Temperature (f = khz) Temperature [ C] PEN Dielectric Typical Frequency Graphs C/C [%] ,000 f [khz] 0 80 Capacitance vs. Frequency Dissipation Factor vs. Frequency µf tgδ x 4 Dissipation vs. Temperature (f = khz) Temperature [ C] tg δ x 4 ESR [Ω] nf 0 0,000 f [khz] E+2 E+ E+0 E Equivalent Series Resisteance vs. Frequency nf µf Insulation Resistance vs. Temperature E 2 0,000 f [khz] E+6 PEN and PPS Impedance vs. Frequency IR [MΩ] E+5 E+4 Z [Ω] E Temperature [ C] µf Note: Measurements performed at T = 25±5 C µf 0.0 µf 0 f [MHZ] KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 6

7 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Environmental Test Data Damp Heat, Steady State Temperature Test Conditions +40 C ±2 C Relative Humidity (RH) 93% ±2% Test Duration 56 days Performance Capacitance Change C/C 7% DF Change ( tgδ) Insulation Resistance Temperature Test Duration Voltage Applied Endurance Test Conditions Performance 50 x 4 at khz 50% of limit value 25 C ±2 C 2,000 hours.25 x V C Capacitance Change C/C 5% DF Change ( tgδ) Insulation Resistance 50 x 4 at khz 50% of limit value Rapid Change of Temperature Test Conditions Temperature hour at 55 C, hour at +25 C Number of Cycles,000 Performance Capacitance Change C/C 5% DF Change ( tgδ) Insulation Resistance 50 x 4 at khz limit value No Mechanical Damage Test Conditions Reflow Performance Capacitance Change C/C 3% DF Change ( tgδ) See Solder Process 50 x 4 at khz Insulation Resistance limit value No Mechanical Damage Bending Test Conditions Deflection to 6 mm Performance Capacitance Change C/C % No visible damage on the terminations (pealing) neither on the body (cracking) Environmental Compliance All KEMET surface mount capacitors are RoHS Compliant. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 7

8 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Table Ratings & Reference Capacitance Value (µf) () K = ±%, M = ±20%, J = ±5% on request. (2) Only K and M tolerances available. Chip Dimensions in mm W H (max) L (V/µs) Legacy Part Number A DECA0()A0N00 LDECA0()A0N A DECA20()A0N00 LDECA20()A0N C DECC50()A5N00 LDECC50()A5N A DECA50()A0N00 LDECA50()A0N C DECC80()A5N00 LDECC80()A5N A DECA80()A0N00 LDECA80()A0N C DECC220()A5N00 LDECC220()A5N A DECA220()A0N00 LDECA220()A0N C DECC270()A5N00 LDECC270()A5N A DECA270()A0N00 LDECA270()A0N C DECC330()A5N00 LDECC330()A5N A DECA330()A0N00 LDECA330()A0N C DECC390()A5N00 LDECC390()A5N A DECA390()A0N00 LDECA390()A0N C DECC470()A5N00 LDECC470()A5N A DECA470()A0N00 LDECA470()A0N C DECC560()A5N00 LDECC560()A5N A DECA560()A0N00 LDECA560()A0N C DECC680()A5N00 LDECC680()A5N A DECA680()A0N00 LDECA680()A0N C DECC820()A5N00 LDECC820()A5N A DECA820()A0N00 LDECA820()A0N C DECC20()A5N00 LDECC20()A5N A DECA20()A0N00 LDECA20()A0N C DECC220()A5N00 LDECC220()A5N A DECA220()A0N00 LDECA220()A0N C DECC250()A5N00 LDECC250()A5N A DECA250()A0N00 LDECA250()A0N C DECC280()A5N00 LDECC280()A5N A DECA280()A0N00 LDECA280()A0N C DECC2220()A5N00 LDECC2220()A5N A DECA2220()A0N00 LDECA2220()A0N C DECC2270()A5N00 LDECC2270()A5N A DECA2270()A0N00 LDECA2270()A0N C DECC2330()A5N00 LDECC2330()A5N B DECB2330()A0N00 LDECB2330()A0N A DECA2330(2)A0N00 LDECA2330(2)A0N C DECC2390()A5N00 LDECC2390()A5N B DECB2390()A0N00 LDECB2390()A0N C DECC2470()A5N00 LDECC2470()A5N B DECB2470()A0N00 LDECB2470()A0N C DECC2560()A5N00 LDECC2560()A5N B DECB2560()A0N00 LDECB2560()A0N C DECC2680()A5N00 LDECC2680()A5N B DECB2680()A0N00 LDECB2680()A0N C DECC2820()A5N00 LDECC2820()A5N B DECB2820()A0N00 LDECB2820()A0N C DECC30()A5N00 LDECC30()A5N B DECB30()A0N00 LDECB30()A0N C DECC320()A5N00 LDECC320()A5N C DECC350()A5N00 LDECC350()A5N C DECC380()A5N00 LDECC380()A5N C DECC3220()A5N00 LDECC3220()A5N D DECD3270()A5N00 LDECD3270()A5N D DECD3330()A5N00 LDECD3330()A5N D DECD3390()A5N00 LDECD3390()A5N D DECD3470()A5N00 LDECD3470()A5N D DECD3560()A5N00 LDECD3560()A5N D DECD3680()A5N00 LDECD3680()A5N00 Capacitace Value (µf) Chip W H L (V/μs) Legacy KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 8

9 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Table Ratings & Reference cont'd Capacitance Value (µf) Chip Dimensions in mm W H (max) L (V/µs) Legacy Part Number E DECE3820()A5N00 LDECE3820()A5N D DECD3820()A0N00 LDECD3820()A0N E DECE40()A5N00 LDECE40()A5N D DECD40()A0N00 LDECD40()A0N E DECE420()A5N00 LDECE420()A5N G DECG450()A5N00 LDECG450()A5N E DECE450()A0N00 LDECE450()A0N G DECG480()A5N00 LDECG480()A5N E DECE480()A0N00 LDECE480()A0N G DECG4220()A5N00 LDECG4220()A5N F DECF4220()A0N00 LDECF4220()A0N G DECG4270()A5N00 LDECG4270()A5N F DECF4270()A0N00 LDECF4270()A0N H DECH4330()A5N00 LDECH4330()A5N F DECF4330()A0N00 LDECF4330()A0N H DECH4390()A5N00 LDECH4390()A5N F DECF4390()A0N00 LDECF4390()A0N H DECH4470()A5N00 LDECH4470()A5N G DECG4470()A0N00 LDECG4470()A0N A DEDA0()A0N00 LDEDA0()A0N A DEDA20()A0N00 LDEDA20()A0N C DEDC50()A5N00 LDEDC50()A5N A DEDA50()A0N00 LDEDA50()A0N C DEDC80()A5N00 LDEDC80()A5N A DEDA80()A0N00 LDEDA80()A0N C DEDC220()A5N00 LDEDC220()A5N A DEDA220()A0N00 LDEDA220()A0N C DEDC270()A5N00 LDEDC270()A5N A DEDA270()A0N00 LDEDA270()A0N C DEDC330()A5N00 LDEDC330()A5N A DEDA330()A0N00 LDEDA330()A0N C DEDC390()A5N00 LDEDC390()A5N A DEDA390()A0N00 LDEDA390()A0N C DEDC470()A5N00 LDEDC470()A5N A DEDA470()A0N00 LDEDA470()A0N C DEDC560()A5N00 LDEDC560()A5N A DEDA560()A0N00 LDEDA560()A0N C DEDC680()A5N00 LDEDC680()A5N A DEDA680()A0N00 LDEDA680()A0N C DEDC820()A5N00 LDEDC820()A5N A DEDA820()A0N00 LDEDA820()A0N C DEDC20()A5N00 LDEDC20()A5N A DEDA20()A0N00 LDEDA20()A0N C DEDC220()A5N00 LDEDC220()A5N A DEDA220()A0N00 LDEDA220()A0N C DEDC250()A5N00 LDEDC250()A5N A DEDA250()A0N00 LDEDA250()A0N C DEDC280()A5N00 LDEDC280()A5N A DEDA280()A0N00 LDEDA280()A0N C DEDC2220()A5N00 LDEDC2220()A5N A DEDA2220()A0N00 LDEDA2220()A0N C DEDC2270()A5N00 LDEDC2270()A5N A DEDA2270()A0N00 LDEDA2270()A0N C DEDC2330()A5N00 LDEDC2330()A5N B DEDB2330()A0N00 LDEDB2330()A0N A DEDA2330(2)A0N00 LDEDA2330(2)A0N C DEDC2390()A5N00 LDEDC2390()A5N B DEDB2390()A0N00 LDEDB2390()A0N C DEDC2470()A5N00 LDEDC2470()A5N00 Capacitace Value (µf) () K = ±%, M = ±20%, J = ±5% on request. (2) Only K and M tolerances available. Chip W H L (V/μs) Legacy KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 9

10 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Table Ratings & Reference cont'd Capacitance Value (µf) Chip Dimensions in mm W H (max) L (V/µs) Legacy Part Number B DEDB2470()A0N00 LDEDB2470()A0N C DEDC2560()A5N00 LDEDC2560()A5N B DEDB2560()A0N00 LDEDB2560()A0N C DEDC2680()A5N00 LDEDC2680()A5N B DEDB2680()A0N00 LDEDB2680()A0N C DEDC2820()A5N00 LDEDC2820()A5N B DEDB2820()A0N00 LDEDB2820()A0N C DEDC30()A5N00 LDEDC30()A5N B DEDB30()A0N00 LDEDB30()A0N C DEDC320()A5N00 LDEDC320()A5N C DEDC350()A5N00 LDEDC350()A5N C DEDC380()A5N00 LDEDC380()A5N C DEDC3220()A5N00 LDEDC3220()A5N D DEDD3270()A5N00 LDEDD3270()A5N D DEDD3330()A5N00 LDEDD3330()A5N D DEDD3390()A5N00 LDEDD3390()A5N D DEDD3470()A5N00 LDEDD3470()A5N D DEDD3560()A5N00 LDEDD3560()A5N D DEDD3680()A5N00 LDEDD3680()A5N E DEDE3820()A5N00 LDEDE3820()A5N D DEDD3820()A0N00 LDEDD3820()A0N E DEDE40()A5N00 LDEDE40()A5N D DEDD40()A0N00 LDEDD40()A0N E DEDE420()A5N00 LDEDE420()A5N G DEDG450()A5N00 LDEDG450()A5N E DEDE450()A0N00 LDEDE450()A0N G DEDG480()A5N00 LDEDG480()A5N E DEDE480()A0N00 LDEDE480()A0N G DEDG4220()A5N00 LDEDG4220()A5N F DEDF4220()A0N00 LDEDF4220()A0N G DEDG4270()A5N00 LDEDG4270()A5N F DEDF4270()A0N00 LDEDF4270()A0N H DEDH4330()A5N00 LDEDH4330()A5N F DEDF4330()A0N00 LDEDF4330()A0N H DEDH4390()A5N00 LDEDH4390()A5N F DEDF4390()A0N00 LDEDF4390()A0N H DEDH4470()A5N00 LDEDH4470()A5N G DEDG4470()A0N00 LDEDG4470()A0N A DEEA0()A0N00 LDEEA0()A0N A DEEA20()A0N00 LDEEA20()A0N C DEEC50()A5N00 LDEEC50()A5N A DEEA50()A0N00 LDEEA50()A0N C DEEC80()A5N00 LDEEC80()A5N A DEEA80()A0N00 LDEEA80()A0N C DEEC220()A5N00 LDEEC220()A5N A DEEA220()A0N00 LDEEA220()A0N C DEEC270()A5N00 LDEEC270()A5N A DEEA270()A0N00 LDEEA270()A0N C DEEC330()A5N00 LDEEC330()A5N A DEEA330()A0N00 LDEEA330()A0N C DEEC390()A5N00 LDEEC390()A5N A DEEA390()A0N00 LDEEA390()A0N C DEEC470()A5N00 LDEEC470()A5N A DEEA470()A0N00 LDEEA470()A0N C DEEC560()A5N00 LDEEC560()A5N A DEEA560()A0N00 LDEEA560()A0N C DEEC680()A5N00 LDEEC680()A5N A DEEA680()A0N00 LDEEA680()A0N C DEEC820()A5N00 LDEEC820()A5N00 Capacitace Value (µf) () K = ±%, M = ±20%, J = ±5% on request. (2) Only K and M tolerances available. Chip W H L (V/μs) Legacy KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208

11 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Table Ratings & Reference cont'd Capacitance Value (µf) Chip Dimensions in mm W H (max) L (V/µs) Legacy Part Number A DEEA820()A0N00 LDEEA820()A0N C DEEC20()A5N00 LDEEC20()A5N A DEEA20()A0N00 LDEEA20()A0N C DEEC220()A5N00 LDEEC220()A5N A DEEA220()A0N00 LDEEA220()A0N C DEEC250()A5N00 LDEEC250()A5N A DEEA250()A0N00 LDEEA250()A0N C DEEC280()A5N00 LDEEC280()A5N B DEEB280()A0N00 LDEEB280()A0N C DEEC2220()A5N00 LDEEC2220()A5N B DEEB2220()A0N00 LDEEB2220()A0N C DEEC2270()A5N00 LDEEC2270()A5N B DEEB2270()A0N00 LDEEB2270()A0N C DEEC2330()A5N00 LDEEC2330()A5N B DEEB2330()A0N00 LDEEB2330()A0N C DEEC2390()A5N00 LDEEC2390()A5N B DEEB2390()A0N00 LDEEB2390()A0N C DEEC2470()A5N00 LDEEC2470()A5N B DEEB2470()A0N00 LDEEB2470()A0N C DEEC2560()A5N00 LDEEC2560()A5N C DEEC2680()A5N00 LDEEC2680()A5N C DEEC2820()A5N00 LDEEC2820()A5N C DEEC30()A5N00 LDEEC30()A5N D DEED320()A5N00 LDEED320()A5N D DEED350()A5N00 LDEED350()A5N D DEED380()A5N00 LDEED380()A5N D DEED3220()A5N00 LDEED3220()A5N D DEED3270()A5N00 LDEED3270()A5N D DEED3330()A5N00 LDEED3330()A5N E DEEE3390()A5N00 LDEEE3390()A5N D DEED3390()A0N00 LDEED3390()A0N E DEEE3470()A5N00 LDEEE3470()A5N D DEED3470()A0N00 LDEED3470()A0N E DEEE3560()A5N00 LDEEE3560()A5N E DEEE3680()A5N00 LDEEE3680()A5N F DEEF3820()A5N00 LDEEF3820()A5N E DEEE3820()A0N00 LDEEE3820()A0N F DEEF40()A5N00 LDEEF40()A5N E DEEE40(2)A0N00 LDEEE40(2)A0N G DEEG420()A5N00 LDEEG420()A5N F DEEF420()A0N00 LDEEF420()A0N G DEEG450()A5N00 LDEEG450()A5N F DEEF450()A0N00 LDEEF450()A0N G DEEG480()A5N00 LDEEG480()A5N F DEEF480()A0N00 LDEEF480()A0N G DEEG4220()A5N00 LDEEG4220()A5N F DEEF4220(2)A0N00 LDEEF4220(2)A0N H DEEH4270()A5N00 LDEEH4270()A5N G DEEG4270()A0N00 LDEEG4270()A0N H DEEH4330()A5N00 LDEEH4330()A5N G DEEG4330()A0N00 LDEEG4330()A0N H DEEH4390()A5N00 LDEEH4390()A5N H DEEH4470()A5N00 LDEEH4470()A5N A DEIA0()A0N00 LDEIA0()A0N A DEIA20()A0N00 LDEIA20()A0N C DEIC50()A5N00 LDEIC50()A5N A DEIA50()A0N00 LDEIA50()A0N C DEIC80()A5N00 LDEIC80()A5N A DEIA80()A0N00 LDEIA80()A0N00 Capacitace Value (µf) () K = ±%, M = ±20%, J = ±5% on request. (2) Only K and M tolerances available. Chip W H L (V/μs) Legacy KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208

12 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Table Ratings & Reference cont'd Capacitance Value (µf) Chip Dimensions in mm W H (max) L (V/µs) Legacy Part Number C DEIC220()A5N00 LDEIC220()A5N A DEIA220()A0N00 LDEIA220()A0N C DEIC270()A5N00 LDEIC270()A5N A DEIA270()A0N00 LDEIA270()A0N C DEIC330()A5N00 LDEIC330()A5N A DEIA330()A0N00 LDEIA330()A0N C DEIC390()A5N00 LDEIC390()A5N B DEIB390()A0N00 LDEIB390()A0N C DEIC470()A5N00 LDEIC470()A5N B DEIB470()A0N00 LDEIB470()A0N C DEIC560()A5N00 LDEIC560()A5N B DEIB560()A0N00 LDEIB560()A0N C DEIC680()A5N00 LDEIC680()A5N B DEIB680()A0N00 LDEIB680()A0N C DEIC820()A5N00 LDEIC820()A5N B DEIB820()A0N00 LDEIB820()A0N C DEIC20()A5N00 LDEIC20()A5N B DEIB20()A0N00 LDEIB20()A0N C DEIC220()A5N00 LDEIC220()A5N C DEIC250()A5N00 LDEIC250()A5N D DEID280()A5N00 LDEID280()A5N C DEIC280()A0N00 LDEIC280()A0N D DEID2220()A5N00 LDEID2220()A5N C DEIC2220()A0N00 LDEIC2220()A0N D DEID2270()A5N00 LDEID2270()A5N C DEIC2270()A0N00 LDEIC2270()A0N D DEID2330()A5N00 LDEID2330()A5N C DEIC2330()A0N00 LDEIC2330()A0N D DEID2390()A5N00 LDEID2390()A5N D DEID2470()A5N00 LDEID2470()A5N D DEID2560()A5N00 LDEID2560()A5N D DEID2680()A5N00 LDEID2680()A5N E DEIE2820()A5N00 LDEIE2820()A5N D DEID2820()A0N00 LDEID2820()A0N E DEIE30()A5N00 LDEIE30()A5N D DEID30()A0N00 LDEID30()A0N E DEIE320()A5N00 LDEIE320()A5N D DEID320()A0N00 LDEID320()A0N E DEIE350()A5N00 LDEIE350()A5N F DEIF380()A5N00 LDEIF380()A5N E DEIE380()A0N00 LDEIE380()A0N F DEIF3220()A5N00 LDEIF3220()A5N E DEIE3220()A0N00 LDEIE3220()A0N F DEIF3270()A5N00 LDEIF3270()A5N F DEIF3330()A5N00 LDEIF3330()A5N G DEIG3390()A5N00 LDEIG3390()A5N F DEIF3390()A0N00 LDEIF3390()A0N G DEIG3470()A5N00 LDEIG3470()A5N F DEIF3470()A0N00 LDEIF3470()A0N G DEIG3560()A5N00 LDEIG3560()A5N F DEIF3560()A0N00 LDEIF3560()A0N H DEIH3680()A5N00 LDEIH3680()A5N G DEIG3680()A0N00 LDEIG3680()A0N H DEIH3820()A5N00 LDEIH3820()A5N G DEIG3820()A0N00 LDEIG3820()A0N H DEIH40()A5N00 LDEIH40()A5N H DEIH420()A0N00 LDEIH420()A0N H DEIH450()A0N00 LDEIH450()A0N D DEMD250()A5N00 LDEMD250()A5N00 Capacitace Value (µf) () K = ±%, M = ±20%, J = ±5% on request. (2) Only K and M tolerances available. Chip W H L (V/μs) Legacy KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 2

13 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Table Ratings & Reference cont'd Capacitance Value (µf) Chip Dimensions in mm W H (max) L (V/µs) Legacy Part Number D DEMD280()A5N00 LDEMD280()A5N D DEMD2220()A5N00 LDEMD2220()A5N D DEMD2270()A5N00 LDEMD2270()A5N D DEMD2330()A5N00 LDEMD2330()A5N D DEMD2390()A5N00 LDEMD2390()A5N D DEMD2470()A5N00 LDEMD2470()A5N E DEME2560()A5N00 LDEME2560()A5N E DEME2680()A5N00 LDEME2680()A5N E DEME2820()A5N00 LDEME2820()A5N E DEME30()A5N00 LDEME30()A5N F DEMF320()A5N00 LDEMF320()A5N F DEMF350()A5N00 LDEMF350()A5N F DEMF380()A5N00 LDEMF380()A5N G DEMG3220()A5N00 LDEMG3220()A5N G DEMG3270()A5N00 LDEMG3270()A5N G DEMG3330()A5N00 LDEMG3330()A5N H DEMH3390()A5N00 LDEMH3390()A5N H DEMH3470()A5N00 LDEMH3470()A5N D DEPD0()A5N00 LDEPD0()A5N D DEPD20()A5N00 LDEPD20()A5N D DEPD50()A5N00 LDEPD50()A5N D DEPD80()A5N00 LDEPD80()A5N D DEPD220()A5N00 LDEPD220()A5N D DEPD270()A5N00 LDEPD270()A5N D DEPD330()A5N00 LDEPD330()A5N D DEPD390()A5N00 LDEPD390()A5N D DEPD470()A5N00 LDEPD470()A5N D DEPD560()A5N00 LDEPD560()A5N D DEPD680()A5N00 LDEPD680()A5N D DEPD820()A5N00 LDEPD820()A5N D DEPD20()A5N00 LDEPD20()A5N D DEPD220()A5N00 LDEPD220()A5N D DEPD250()A5N00 LDEPD250()A5N D DEPD280()A5N00 LDEPD280()A5N E DEPE2220()A5N00 LDEPE2220()A5N E DEPE2270()A5N00 LDEPE2270()A5N E DEPE2330()A5N00 LDEPE2330()A5N E DEPE2390()A5N00 LDEPE2390()A5N F DEPF2470()A5N00 LDEPF2470()A5N F DEPF2560()A5N00 LDEPF2560()A5N F DEPF2680()A5N00 LDEPF2680()A5N F DEPF2820()A5N00 LDEPF2820()A5N G DEPG30()A5N00 LDEPG30()A5N F DEPF30(2)A0N00 LDEPF30(2)A0N G DEPG320()A5N00 LDEPG320()A5N G DEPG350()A5N00 LDEPG350()A5N H DEPH380()A5N00 LDEPH380()A5N H DEPH3220()A5N00 LDEPH3220()A5N H DEPH3270(2)A5N00 LDEPH3270(2)A5N D DEQD0()A5N00 LDEQD0()A5N D DEQD20()A5N00 LDEQD20()A5N D DEQD50()A5N00 LDEQD50()A5N D DEQD80()A5N00 LDEQD80()A5N D DEQD220()A5N00 LDEQD220()A5N D DEQD270()A5N00 LDEQD270()A5N D DEQD330()A5N00 LDEQD330()A5N D DEQD390()A5N00 LDEQD390()A5N D DEQD470()A5N00 LDEQD470()A5N D DEQD560()A5N00 LDEQD560()A5N00 Capacitace Value (µf) () K = ±%, M = ±20%, J = ±5% on request. (2) Only K and M tolerances available. Chip W H L (V/μs) Legacy KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 3

14 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Table Ratings & Reference cont'd Capacitance Value (µf) Chip Dimensions in mm W H (max) L (V/µs) Legacy Part Number D DEQD680()A5N00 LDEQD680()A5N E DEQE820()A5N00 LDEQE820()A5N E DEQE20()A5N00 LDEQE20()A5N E DEQE220()A5N00 LDEQE220()A5N E DEQE250()A5N00 LDEQE250()A5N E DEQE280()A5N00 LDEQE280()A5N F DEQF2220()A5N00 LDEQF2220()A5N F DEQF2270()A5N00 LDEQF2270()A5N F DEQF2330()A5N00 LDEQF2330()A5N G DEQG2390()A5N00 LDEQG2390()A5N G DEQG2470()A5N00 LDEQG2470()A5N G DEQG2560()A5N00 LDEQG2560()A5N G DEQG2680()A5N00 LDEQG2680()A5N H DEQH2820()A5N00 LDEQH2820()A5N H DEQH30()A5N00 LDEQH30()A5N00 Capacitace Value (µf) () K = ±%, M = ±20%, J = ±5% on request. (2) Only K and M tolerances available. Chip W H L (V/μs) Legacy Soldering Process Reflow Recommendations Preheating Temperature Reflow Temperature Profile Maximum Preheating Time Minimum Temperature 50 C Maximum Temperature 200 C Maximum Time within T max and T max 5 C ( T 5 ) Maximum Time Over 27 C ( T 27 ) Maximum Temperature Ramp Rate Second reflow 80 seconds 30 seconds (T max 250 C) seconds (250 C < T max 255 C) 50 seconds 3 C/seconds (heating) 6 C/seconds (cooling) If two reflow processes are needed, be sure that before the second reflow, the temperature on the capacitor s surface is lower than 50 C. T max T max 5 C 27 C Preheating T 5 T 27 Linear profiles are also allowed (if in line with the reflow recommendations) Time KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 4

15 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Maximum Temperature on Component Body (T max ) Capacitor Capacitor Volume (mm 3 ) H max < ,000 > 2,000 < C 255 C 255 C C 250 C 245 C > C 245 C 245 C *In line with JEDEC STD 020 with some limitations. Flux/Cleaning/Storage and Moisture Flux suggestions KEMET suggests to use a no-clean flux with a halogen content lower than %. Cleaning suggestions To clean the PCB assembly KEMET recommends to use a suitable solvent like Isopropyl alcohol, deionized water or neutral ph detergents. Aggressive solvents shall not be used. For any different cleaning solvent used please contact KEMET Technical Services to analyze the potential impact on KEMET products. Storage and moisture recommendations KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class. We can guarantee a 24 months shelf life (temperature 40 C/relative humidity 90%). After the MBB has been opened, components may stay in areas with controlled temperature and humidity (temperature 30 C/relative humidity 60%) for 68 hours [MSL 3] (rated voltage 0 ) or 696 hours [MSL 2a] (rated voltage > 0 ). For longer periods of time and/or higher temperature and/or higher relative humidity values, it is absolutely necessary to protect the components against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use the same MBB or to avoid areas without controlled temperature and humidity (see above). If the above conditions are not respected, components require a baking (minimum time: 48 hours at 55±5 C) before the reflow. Manual assembly recommendations If PCBs are assembled manually, care must be taken to avoid any mechanical damage to the components. Our recommendations are the following (see Fig. ):. When using tweezers, the components should be gripped across the two terminations (A); 2. Avoid any contact with the two cutting surfaces (C); 3. A vacuum pen is recommended on the top and bottom surfaces (B). C A B B C A Fig. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 5

16 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Flux/Cleaning/Storage and Moisture cont'd Manual soldering recommendations LDE and LDB series have been designed for Surface Mount Technology, pick and place machines and reflow soldering systems. Using a manual soldering iron, issues may occur because the typical temperature for manual soldering is around 350 C. Therefore please pay careful attention: Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the tin wire edge (see Fig. 2); If the soldering iron is equipped with a temperature controller device: Set the temperature to 250±3 C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5 seconds); If the soldering iron is NOT equipped with a temperature controller device: This is the worst situation. The following are a few practical suggestions but, clearly, the operator s experience is extremely important:. Proceed as per Fig. 2; 2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible; 3. Wait a few seconds and check that the soldering joint has been properly created; If the soldering iron is equipped with a hot air flow device: Set the hot air temperature to 250±3 C and do not send the hot air directly onto the capacitor plastic body. In this situation, the operator s experience is very important; In any case, avoid mass-mounting SMD Film Capacitors manually. Tin Wire Fig. 2 Landing Area SMD Film Capacitor PCB Soldering Iron KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 6

17 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Packaging Quantities Chip (EIA) Height Reel 206 All 3,000 2 All 2, , , , , , , , , , , , , , , , Landing Dimensions in mm A B C D A B C D These landing area dimensions have been developed to take full advantage of the new RoHS 6 terminations design. We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0 5 mm). If a non-lead free solder paste is used, a minimum peak temperature of 2 C on the component s body is suggested. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 7

18 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Production process basic suggestions In case of: Typical cause Typical solution landing area dimensions see landing areas suggestions, page 7 solder paste quality see solder paste suggestions, page 7 no solder joint on one end termination not-uniform solder paste thickness on the landing areas wrong position of the capacitor on the landing areas set the dispensing solder paste machine properly set the pick and place machine properly thermal profile temperature see reflow recommendations, page 4 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations landing area dimensions see landing areas suggestions, page 7 solder paste quality see solder paste suggestions, page 7 no solder joint on both end termination no solder paste on the landing areas set the dispensing solder paste machine properly thermal profile temperature see reflow recommendations, page 4 bad temperature distribution in the reflow oven check the reflow oven temperature distribution and variations oxidated end terminations see moisture recommendations, page 5 too long time over 27 C see reflow recommendations, page 4 capacitor's body mechanical deformation too long time within T max and T max 5 C see reflow recommendations, page 4 too high temperature ramp rate see reflow recommendations, page 4 capacitor damaged by a soldering iron see manual soldering recommendations, page 6 too long time over 27 C see reflow recommendations, page 4 capacitance drop (up to 20%) too long time within T max and T max 5 C see reflow recommendations, page 4 too high temperature ramp rate see reflow recommendations, page 4 capacitor damaged by a soldering iron see manual soldering recommendations, page 6 capacitance drop (over 20%) capacitor damaged by a soldering iron see manual soldering recommendations, page 6 Note: small fissures on the capacitor s cutting surface are actually slight detachments of two adjacent metallized film layers and have to be considered only as an aesthetic issue related to the SMD Film Capacitors manufacturing process and technology. Therefore, small fissures on SMD Film Capacitors are not comparable to cracks on SMD Ceramics. Fissures do not influence in anyway SMD Film Capacitors reliability. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 8

19 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) Carrier Taping & Packaging (IEC ) Horizontal Taping Orientation 2.0± ± ± T B0 W2 L W +0.3 P± A0 SMD Film Capacitor (Top View) Tape Reel K0 Ø W Chip (EIA) Horizontal Mounting Dimensions in mm Taping Specification W H L W P A 0 B 0 K 0 D W W 2 Nominal Nominal Nominal /+0.3 +/ Nominal Nominal Nominal /+2.0 0/+2 Maximum All All In accordance with IEC Materials: - carrier tape: antistatic material - cover tape: polyester + polythene - reel: recyclable polystyrene All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 9

20 LDE, Unencapsulated Stacked Chip, , 50,000 (Automotive Grade) KEMET Electronics Corporation Sales Offices For a complete list of our global sales offi ces, please visit Disclaimer All product specifi cations, statements, information and data (collectively, the Information ) in this datasheet are subject to change. The customer is responsible for checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on KEMET Electronics Corporation s ( KEMET ) knowledge of typical operating conditions for such applications, but are not intended to constitute and KEMET specifi cally disclaims any warranty concerning suitability for a specifi c customer application or use. The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained. Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not be required. KEMET is a registered trademark of KEMET Electronics Corporation. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC F3078_LDE 4/9/208 20