Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, VDC (Commercial Grade)

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1 KPS Series, X7R Dielectric, VDC (Commercial Grade) Overview KEMET Power Solutions (KPS) Commercial Series stacked capacitors utilize a proprietary lead-frame technology to vertically stack one or two multilayer ceramic chip capacitors into a single compact surface mount package. The attached lead-frame mechanically isolates the capacitor/s from the printed circuit board, therefore offering advanced mechanical and thermal stress performance. Isolation also addresses concerns for audible, microphonic noise that may occur when a bias voltage is applied. A two chip stack offers up to double the capacitance in the same or smaller design footprint when compared to traditional surface mount MLCC devices. Providing up to mm of board flex capability, KPS Series capacitors are environmentally friendly and in compliance with RoHS legislation. Available in X7R dielectric, these devices are capable of Pb-Free reflow profiles and provide lower ESR, ESL and higher ripple current capability when compared to other dielectric solutions. Combined with the stability of an X7R dielectric, KEMET s KPS Series devices exhibit a predictable change in capacitance with respect to time and voltage and boast a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from -55 C to +15 C. Benefits -55 C to +15 C operating temperature range Reliable and robust termination system EIA 1, 181, and case sizes DC voltage ratings of V, 16 V, 5 V, V, V, and V Capacitance offerings ranging from.1 μf up to 47 μf Available capacitance tolerances of ±% and ±% Higher capacitance in the same footprint Potential board space savings Advanced protection against thermal and mechanical stress Provides up to mm of board flex capability Reduces audible, microphonic noise Extremely low ESR and ESL Pb-Free and RoHS Compliant Capable of Pb-Free reflow profiles Non-polar device, minimizing installation concerns Tantalum and electrolytic alternative Ordering Information C 1 C 5 M 4 R 1 C 7186 Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pf) Capacitance Tolerance 1 Voltage Dielectric Failure Rate/Design Leadframe Finish Packaging/Grade (C-Spec) C = Standard significant digits + number of zeros K = ±% M = ±% 8 = V 4 = 16 V 3 = 5 V 5 = V 1 = V A = V R = X7R 1 = KPS Single Chip Stack = KPS Double Chip Stack C = % Matte Sn 7186 = 7" Reel Unmarked 789 = 13" Reel Unmarked 1 Double chip stacks ("" in the 13th character position of the ordering code) are only available in M (±%) capacitance tolerance. Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±%) or M (±%) tolerances. Additional leadframe finish options may be available. Contact KEMET for details. 3 Additional reeling or packaging options may be available. Contact KEMET for details. One world. One KEMET KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 1

2 KPS Series, X7R Dielectric, VDC (Commercial Grade) Dimensions Millimeters (Inches) Top View Profile View Single or Double Double Chip Stack Single Chip Stack Chip Stack Number of Chips Single Double EIA Size Code Metric Size Code L Length W Width H Height LW Lead Width (.138) ±.3 (.1).6 (.) ±.3 (.1) 3.35 (.13) ±. (.4).8 (.3) ±.15 (.6) (.197) ±. (.) 3. (.138) ±. (.).65 (.4) ±.35 (.14) 1. (.43) ±.3 (.1) (.36) ±. (.) 5. (.197) ±. (.) 3. (.138) ±.3 (.1) 1.6 (.63) ±.3 (.1) (.138) ±.3 (.1).6 (.) ±.3 (.1) 6.15 (.4) ±.15 (.6).8 (.31) ±.15 (.6) (.197) ±. (.) 3. (.138) ±. (.) 5. (.197) ±. (.) 1. (.43) ±.3 (.1) (.36) ±. (.) 5. (.197) ±. (.) 5. (.197) ±. (.) 1.6 (.63) ±.3 (.1) Mounting Technique Solder Reflow Only Applications Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction (piezoelectric/ mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits without (integrated) current limitation and any application that is subject to high levels of board flexure or temperature cycling. Markets include industrial, military, automotive and telecom. Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Pb-Free and RoHS Compliant. KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1

3 KPS Series, X7R Dielectric, VDC (Commercial Grade) Electrical Parameters/Characteristics Item Operating Temperature Range -55 C to +15 C Parameters/Characteristics Capacitance Change with Reference to +5 C and VDC Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.% Dielectric Withstanding Voltage (DWV) % of rated voltage (5 ±1 seconds and charge/discharge not exceeding ma) Dissipation Factor (DF) Maximum 5ºC 5%( V), 3.5%(16 V and 5 V) and.5%( V to V) Insulation Resistance (IR) 5 C See Insulation Resistance Limit Table (Rated voltage applied for 1 ±5 5 C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 48 or 1, hours. Please refer to a part number specific datasheet for referee time details. To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 khz ± Hz and 1. ±. Vrms if capacitance µf 1 Hz ± Hz and.5 ±.1 Vrms if capacitance > µf Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP484 and Agilent E498 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits Dielectric High Temperature Life, Biased Humidity, Moisture Resistance Rated DC Voltage > 5 Capacitance Value Dissipation Factor (Maximum %) 3. Capacitance Shift Insulation Resistance X7R 16/5 All 5. < ±% % of Initial Limit Insulation Resistance Limit Table EIA Case Size 1, Megohm Microfarads or GΩ Megohm Microfarads or GΩ 1 <.39 µf.39 µf 181 <. µf. µf < µf µf KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 3

4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) KPS Series, X7R Dielectric, VDC (Commercial Grade) Electrical Characteristics Z and ESR CC5MARC Z and C1C475M5R1C ESR C1C475M5R1C Z and ESR 4 3 ESR ESR Z Z 3 Magnitude Ohms Magnitude Ohms Frequency (Hz) Frequency (Hz) Z and ESR CC476M3RC 4 ESR Z Magnitude Ohms Frequency (Hz) KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 4

5 KPS Series, X7R Dielectric, VDC (Commercial Grade) Electrical Characteristics cont'd ESR 181,. µf, V X7R Impedance 181,. µf, V X7R ESR vs. Frequency C181C4K5RC ( Chip Stack) C181C4K5R1C (1 Chip Stack) Impedance vs. Frequency C181C4K5RC ( Chip Stack) C181C4K5R1C (1 Chip Stack) ESR (Ohms) 1.1 Impedance (Ohms) E+3 1.E+4 1.E+5 1.E+6 1.E+7 1.E+8 Frequency (Hz).1 1.E+3 1.E+4 1.E+5 1.E+6 1.E+7 1.E+8 Frequency (Hz) ESR 1,. µf, V X7R Impedance 1,. µf, V X7R ESR vs. Frequency C1C4K5RC ( Chip Stack) C1C4K5R1C (1 Chip Stack) Impedance vs. Frequency C1C4K5RC ( Chip Stack) C1C4K5R1C (1 Chip Stack) ESR (Ohms) 1.1 Impedance (Ohms) E+3 1.E+4 1.E+5 1.E+6 1.E+7 1.E+8 Frequency (Hz).1 1.E+3 1.E+4 1.E+5 1.E+6 1.E+7 1.E+8 Frequency (Hz) KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 5

6 KPS Series, X7R Dielectric, VDC (Commercial Grade) Electrical Characteristics cont'd Microphonics 1, 4.7 µf, V, X7R Microphonics, µf, V, X7R Sound Pressure (db) Standard SMD MLCC KPS - 1 Chip Stack 5 15 Vp-p Sound Pressure (db) 4 3 Standard SMD MLCC KPS - Chip Stack 4 6 Vp-p Microphonics, 47 µf, 5 V, X7R Microphonics 1, µf, 5 V, X7R Sound Pressure (db) 4 3 Standard SMD MLCC KPS - Chip Stack 5 15 Vp-p Sound Pressure (db) 4 3 Standard SMD MLCC KPS - Chip Stack 4 6 Vp-p Competitive Comparision Microphonics 1, 4.7 µf, V, X7R Ripple Current (Arms), µf, V Sound Pressure (db) Competitor KEMET - KPS 5 15 Vp-p Absolute Temperature (C) KEMET KPS,, µf, V rated ( Chip Stack) Competitor, µf, V rated ( Chip Stack) 3 Ripple Current (Arms) Note: Refer to Table 4 for test method. KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 6

7 KPS Series, X7R Dielectric, VDC (Commercial Grade) Electrical Characteristics cont'd Board Flex vs. Termination Type Weibull X7R 1 uf (uf KPS Stacked) Board Flex vs. Termination Type Weibull X7R uf 5V (47uF KPS Stacked) Percent Standard Termination KPS Chip Stack Percent Standard Termination KPS Chip Stack Board Flexure (mm) Board Flexure (mm) Board Flexure to mm Board Flexure to mm Weibull X7R uf V Weibull X7R uF 16V Percent Board Flexure (mm) Percent Board Flexure (mm) KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 7

8 KPS Series, X7R Dielectric, VDC (Commercial Grade) Table 1 Capacitance Range/Selection Waterfall (1 Case Sizes) Series C1 C181 C Capacitance Cap Voltage Code A A A Code Voltage DC Capacitance Tolerance Product Availability and Chip Thickness Codes See Table for Chip Thickness Dimensions Single Chip Stack. µf 4 K M FV FV FV FV FV FV GP GP GP GP GP JP JP JP JP JP. µf 4 K M FV FV FV FV FV GP GP GP GP GP JP JP JP JP JP.47 µf 474 K M FV FV FV FV FV GP GP GP GP GP JP JP JP JP JP 1. µf 5 K M FV FV FV FV FV GP GP GP GP JP JP JP JP JP. µf 5 K M FV FV FV FV FV GP GP GP JP JP JP JP 3.3 µf 335 K M FV FV FV FV GP GP GP JP JP JP JP 4.7 µf 475 K M FV FV FV FV GP GP GP JP JP JP µf 6 K M FV FV FV GP GP JP JP JP 15 µf 156 K M FV JP JP µf 6 K M FV JP JP 33 µf 336 K M 47 µf 476 K M µf 7 K M Double Chip Stack. µf 4 M FW FW FW FW FW FW GR GR GR GR GR JR JR JR JR JR. µf 4 M FW FW FW FW FW FW GR GR GR GR GR JR JR JR JR JR.47 µf 474 M FW FW FW FW FW GR GR GR GR GR JR JR JR JR JR 1. µf 5 M FW FW FW FW FW GR GR GR GR GR JR JR JR JR JR. µf 5 M FW FW FW FW FW GR GR GR GR JR JR JR JR JR 3.3 µf 335 M FW FW FW FW FW GR GR GR GR JR JR JR JR 4.7 µf 475 M FW FW FW FW GR GR GR JR JR JR JR µf 6 M FW FW FW FW GR GR GR JR JR JR µf 6 M FW FW FW GR GR JR JR JR 33 µf 336 M FW JR JR 47 µf 476 M FW JR JR µf 7 M µf 7 M Capacitance Cap Code Voltage DC Voltage Code A A A Series C1 C181 C Table Chip Thickness/Packaging Quantities Thickness Code Case Size Thickness ± Range (mm) Paper Quantity Plastic Quantity 7" Reel 13" Reel 7" Reel 13" Reel FV ±. 6, FW ± , GP ±.35, GR ±. 4 1,7 JP 3. ±.3 3 1,3 JR 5. ±. 8 Thickness Code Case Size Thickness ± Range (mm) Package quantity based on finished chip thickness specifications. 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 8

9 KPS Series, X7R Dielectric, VDC (Commercial Grade) Table 3 KPS Land Pattern Design Recommendations (mm) EIA SIZE CODE METRIC SIZE CODE Median (Nominal) Land Protrusion C Y X V1 V Soldering Process KEMET s KPS Series devices are compatible with IR reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for IR reflow reflect the profile conditions of the IPC/J STD D standard for moisture sensitivity testing. To prevent degradation of temperature cycling capability, care must be taken to prevent solder from flowing into the inner side of the lead frames (inner side of "J" lead in contact with the circuit board). After soldering, the capacitors should be air cooled to room temperature before further processing. Forced air cooling is not recommended. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (T Smin ) C 1 C Temperature Maximum (T Smax ) 1 C C Time (t s ) from T smin to T smax ) 6 1 seconds 6 1 seconds Ramp-up Rate (T L to T P ) 3 C/seconds maximum 3 C/seconds maximum Liquidous Temperature (T L ) 183 C 17 C Time Above Liquidous (t L ) 6 1 seconds 6 1 seconds Peak Temperature (T P ) 35 C C Time within 5 C of Maximum Peak Temperature (t P ) seconds maximum seconds maximum Ramp-down Rate (T P to T L ) 6 C/seconds maximum 6 C/seconds maximum Time 5 C to Peak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the capacitor body. The iron should be used to heat the solder pad, applying solder between the pad and the lead, until reflow occurs. Once reflow occurs, the iron should be removed immediately. (Preheating is required when hand soldering to avoid thermal shock.) Temperature T P T L T smax T smin Maximum Ramp Up Rate = 3ºC/seconds Maximum Ramp Down Rate = 6ºC/seconds t S t L t P 5 5ºC to Peak Time KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 9

10 KPS Series, X7R Dielectric, VDC (Commercial Grade) Table 4 Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS C 649 Appendix 1, Note: Force of 1.8 kg for 6 seconds. Board Flex JIS C 649 Appendix, Note: 5. mm minimum Magnification X. Conditions: Solderability J STD a) Method B, C, dry 35 C b) Method 15 C category 3 c) Method D, category 6 C Temperature Cycling JESD Method JA 4 1, cycles (-55 C to +15 C). Measurement at 4 hours +/- hours after test conclusion. Biased Humidity MIL STD Method 3 Load Humidity: 1, hours 85 C/85% RH and VDC maximum. Add K ohm resistor. Measurement at 4 hours +/- hours after test conclusion. Low Volt Humidity: 1, hours 85 C/85% RH and 1.5 V. Add K ohm resistor. Measurement at 4 hours +/- hours after test conclusion. Moisture Resistance MIL STD Method 6 t = 4 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 4 hours +/- hours after test conclusion. Thermal Shock MIL STD Method 7-55 C/+15 C. Note: Number of cycles required 3. Maximum transfer time seconds. Dwell time 15 minutes. Air-Air. High Temperature Life MIL STD Method 8 1, hours at 15 C with rated voltage applied. Storage Life MIL STD Method 8 1 C, VDC for 1, hours. Vibration MIL STD Method 4 5 g's for minutes, 1 cycles each of 3 orientations. Note: Use 8" X 5" PCB.31" thick, 7 secure points on one long side and secure points at corners of opposite sides. Parts mounted within " from any secure point. Test from, Hz. Mechanical Shock MIL STD Method 13 Figure 1 of Method 13, Condition F. Resistance to Solvents MIL STD Method 15 Add aqueous wash chemical, OKEM Clean or equivalent. KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1

11 KPS Series, X7R Dielectric, VDC (Commercial Grade) Storage & Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 4ºC and maximum storage humidity not exceed 7% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. Construction Reference Item Material A Leadframe Phosphor Bronze Alloy 5 B Leadframe Attach HMP Solder C Cu D Termination Ni E Sn F Inner Electrode Ni G Dielectric Material BaTiO 3 Note: Image is exaggerated in order to clearly identify all components of construction. HMP = High Melting Point KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 11

12 KPS Series, X7R Dielectric, VDC (Commercial Grade) Capacitor Marking (Optional): These surface mount multilayer ceramic capacitors are normally supplied unmarked. If required, they can be marked as an extra cost option. Marking is available on most KEMET devices but must be requested using the correct ordering code identifier(s). If this option is requested, two sides of the ceramic body will be laser marked with a K to identify KEMET, followed by two characters (per EIA see table below) to identify the capacitance value. EIA 63 case size devices are limited to the K character only. Marking appears in legible contrast. Illustrated below is an example of an MLCC with laser marking of KA8, which designates a KEMET device with rated capacitance of µf. Orientation of marking is vendor optional. _ KA8 Laser marking option is not available on: CG and Y5V dielectric devices EIA 4 case size devices EIA 63 case size devices with Flexible Termination option. Alpha Character Capacitance (pf) For Various Alpha / Numeral Identifiers Numeral Capacitance (pf) A.1 1 1,,, 1,,,,,, B , 11, 1, 1,, 11,, 1,, C , 1, 1, 1,, 1,, 1,, D ,3 13, 13, 1,3, 13,, 13,, E , 15, 1, 1,, 15,, 1,, F ,6 16, 16, 1,6, 16,, 16,, G ,8 18, 18, 1,8, 18,, 18,, H.,,,,,,,,, J.,,,,,,,,, K ,4 4, 4,,4, 4,, 4,, L ,7 7, 7,,7, 7,, 7,, M , 3, 3, 3,, 3,, 3,, N ,3 33, 33, 3,3, 33,, 33,, P ,6 36, 36, 3,6, 36,, 36,, Q ,9 39, 39, 3,9, 39,, 39,, R ,3 43, 43, 4,3, 43,, 43,, S ,7 47, 47, 4,7, 47,, 47,, T , 51, 5, 5,, 51,, 5,, U ,6 56, 56, 5,6, 56,, 56,, V , 6, 6, 6,, 6,, 6,, W ,8 68, 68, 6,8, 68,, 68,, X , 75, 7, 7,, 75,, 7,, Y , 8, 8, 8,, 8,, 8,, Z , 91, 9, 9,, 91,, 9,, a.5 5 5, 5,,,, 5,,,, b , 35, 3, 3,, 35,, 3,, d , 4, 4, 4,, 4,, 4,, e , 45, 4, 4,, 45,, 4,, f.5 5 5,,, 5,,,,,, m , 6, 6, 6,, 6,, 6,, n , 7, 7, 7,, 7,, 7,, t , 8, 8, 8,, 8,, 8,, y , 9, 9, 9,, 9,, 9,, KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 1

13 KPS Series, X7R Dielectric, VDC (Commercial Grade) Tape & Reel Packaging Information KEMET offers multilayer ceramic chip capacitors packaged in 8, 1 and 16 mm tape on 7" and 13" reels in accordance with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table for details on reeling quantities for commercial chips. Table 5 Carrier Tape Configuration Embossed Plastic (mm) EIA Case Size Tape Size (W)* Pitch (P 1 )* KPS KPS 181 & 16 1 Array 8 & *Refer to Figure 1 for W and P 1 carrier tape reference locations. *Refer to Table 5 for tolerance specifications. KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 13

14 KPS Series, X7R Dielectric, VDC (Commercial Grade) Figure 1 Embossed (Plastic) Carrier Tape Dimensions T T ØDo P Po [ pitches cumulative tolerance on tape ±. mm] E1 Ao F B1 Ko Bo E W S1 P1 T1 Cover Tape B1 is for tape feeder reference only, including draft concentric about B o. Center Lines of Cavity User Direction of Unreeling ØD1 Embossment For cavity size, see Note 1 Table 4 Table 6 Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions Millimeters (Inches) Tape Size D 8 mm 1 mm 16 mm /-. ( /-.) D 1 Minimum Note 1 1. (.39) 1.5 (.59) E 1 P P 1.75 ±. (.69 ±.4) 4. ±. (.157 ±.4). ±.5 (.79 ±.) R Reference Note 5. (.984) 3 (1.181) S 1 Minimum Note 3.6 (.4) T Maximum.6 (.4) T 1 Maximum. (.4) Variable Dimensions Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 1 mm Single (4 mm) & Double (8 mm) 16 mm Triple (1 mm) B 1 Maximum Note (.171) 8. (.33) 1.1 (.476) E Minimum 6.5 (.46).5 (.44) 14.5 (.561) F P ±.5 (.138 ±.) 5.5 ±.5 (.17 ±.) 5.5 ±.5 (.17 ±.) 4. ±. (.157 ±.4) 8. ±. (.315 ±.4) 1. ±. (.157 ±.4) T Maximum.5 (.98) 4.6 (.181) 4.6 (.181) W Maximum 8.3 (.37) 1.3 (.484) 16.3 (.64) A,B & K Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other.. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S 1 < 1. mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B 1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A, B and K shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to maximum for 8 and 1 mm tapes and maximum for 16 mm tapes (see Figure ). (d) lateral movement of the component is restricted to.5 mm maximum for 8 and 1 mm wide tape and to 1. mm maximum for 16 mm tape (see Figure 3). (e) for KPS Series product, A and B are measured on a plane.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 14

15 KPS Series, X7R Dielectric, VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1. Kg minimum.. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm.1 to 1. Newton ( to gf) 1 and 16 mm.1 to 1.3 Newton ( to 13 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 18 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 3 ± mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 64. Figure Maximum Component Rotation Bo T Ao Maximum Component Rotation Top View Typical Pocket Centerline Maximum Component Rotation Side View Tape Maximum s Width (mm) Rotation ( T) 8,1 16 Tape Maximum Width (mm) Rotation ( 8,1 Typical Component Centerline S) Figure 3 Maximum Lateral Movement Figure 4 Bending Radius 8 mm & 1 mm Tape.5 mm maximum.5 mm maximum 16 mm Tape 1. mm maximum 1. mm maximum Embossed Carrier Punched Carrier R Bending Radius R KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 15

16 KPS Series, X7R Dielectric, VDC (Commercial Grade) Figure 5 Reel Dimensions Full Radius, See Note Access Hole at Slot Location (Ø 4 mm minimum) W3 (Includes flange distortion at outer edge) W (Measured at hub) A D (See Note) B (see Note) C (Arbor hole diameter) If present, tape slot in core for tape start:.5 mm minimum width x. mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. N W1 (Measured at hub) Table 7 Reel Dimensions Metric will govern Constant Dimensions Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±. (7.8 ±.8) 1 mm or 33 ±. 16 mm (13. ±.8) 1.5 (.59) Variable Dimensions Millimeters (Inches) /-. (.51 +./-.8). (.795) Tape Size N Minimum W 1 W Maximum W 3 8 mm /-. ( /-.) 14.4 (.567) 1 mm (1.969) /-. ( /-.) 18.4 (.74) Shall accommodate tape width without interference 16 mm /-. ( /-.).4 (.88) KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 16

17 KPS Series, X7R Dielectric, VDC (Commercial Grade) Figure 6 Tape Leader & Trailer Dimensions Embossed Carrier Punched Carrier 8 mm & 1 mm only END Carrier Tape Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (3 mm tape and wider) Trailer 16 mm Minimum Top Cover Tape Components mm Minimum Leader 4 mm Minimum Figure 7 Maximum Camber Elongated sprocket holes (3 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge mm KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 17

18 KPS Series, X7R Dielectric, VDC (Commercial Grade) KEMET Corporation World Headquarters 835 KEMET Way Simpsonville, SC 9681 Mailing Address: P.O. Box 598 Greenville, SC Tel: Fax: Corporate Offices Fort Lauderdale, FL Tel: North America Southeast Lake Mary, FL Tel: Northeast Wilmington, MA Tel: Central Novi, MI Tel: West Milpitas, CA Tel: Europe Southern Europe Paris, France Tel: Sasso Marconi, Italy Tel: Central Europe Landsberg, Germany Tel: Kamen, Germany Tel: Northern Europe Bishop s Stortford, United Kingdom Tel: Espoo, Finland Tel: Asia Northeast Asia Hong Kong Tel: Shenzhen, China Tel: Beijing, China Tel: Shanghai, China Tel: Taipei, Taiwan Tel: Southeast Asia Singapore Tel: Penang, Malaysia Tel: Bangalore, India Tel: Mexico Guadalajara, Jalisco Tel: Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 18

19 KPS Series, X7R Dielectric, VDC (Commercial Grade) Other KEMET Resources Tools Resource Configure A Part: CapEdge SPICE & FIT Software Search Our FAQs: KnowledgeEdge Location Product Information Resource Products Technical Resources (Including Soldering Techniques) RoHS Statement Quality Documents Location Product Request Resource Sample Request Engineering Kit Request Location Contact Resource Website Contact Us Investor Relations Call Us Twitter Location MyKEMET Disclaimer All product specifications, statements, information and data (collectively, the Information ) are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute and we specifically disclaim any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required. KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1 19

20 KPS Series, X7R Dielectric, VDC (Commercial Grade) KEMET Electronics Corporation P.O. Box 598 Greenville, SC 966 (864) C_X7R_KPS_SMD 11/1/1