Schottky Rectifier, 0 0TQ...S D PK PRODUT SUMMRY I F(V) V R ase cathode 3 N/ node 0 35/45 V FETURES 75 T J operation Low forward voltage drop High frequency operation High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance Guard ring for enhanced ruggedness and long term reliability Designed and qualified for Q0 level DESRIPTION The 0TQ...S Schottky rectifier series has been optimized for low reverse leakage at high temperature. The proprietary barrier technology allows for reliable operation up to 75 junction temperature. Typical applications are in switching power supplies, converters, freewheeling diodes, and reverse battery protection. MJOR RTINGS ND HRTERISTIS SYMOL HRTERISTIS VLUES UNITS I F(V) Rectangular waveform 0 V RRM 35/45 V I FSM t p = 5 µs sine 050 V F 0 pk, T J = 5 0.49 V T J Range - 55 to 75 VOLTGE RTINGS PRMETER SYMOL 0TQ035S 0TQ045S UNITS Maximum D reverse voltage V R Maximum working peak reverse voltage V RWM 35 45 V SOLUTE MXIMUM RTINGS PRMETER SYMOL TEST ONDITIONS VLUES UNITS Maximum average forward current See fig. 5 I F(V) 50 % duty cycle at T = 5, rectangular waveform 0 Maximum peak one cycle 5 µs sine or 3 µs rect. pulse Following any rated 050 non-repetitive surge current I FSM load condition and with See fig. 7 0 ms sine or 6 ms rect. pulse rated V RRM applied 80 Non-repetitive avalanche energy E S T J = 5, I S =, L = 6.5 mh 3 mj urrent decaying linearly to zero in µs Repetitive avalanche current I R Frequency limited by T J maximum V =.5 x V R typical
0TQ...S Schottky Rectifier, 0 ELETRIL SPEIFITIONS PRMETER SYMOL TEST ONDITIONS VLUES UNITS 0 0.57 T J = 5 Maximum forward voltage drop 0 0.67 V () FM See fig. 0 0.49 T J = 5 0 0.6 V Maximum reverse leakage current T J = 5 I RM See fig. V R = Rated V R T J = 5 5 m Maximum junction capacitance T V R = 5 V D (test signal range 00 khz to MHz) 5 900 pf Typical series inductance L S Measured lead to lead 5 mm from package body 8.0 nh Maximum voltage rate of change dv/dt Rated V R 0 000 V/µs Note () Pulse width < 300 µs, duty cycle < % THERML - MEHNIL SPEIFITIONS PRMETER SYMOL TEST ONDITIONS VLUES UNITS Maximum junction and storage temperature range T J, T Stg - 55 to 75 Maximum thermal resistance, junction to case Typical thermal resistance, case to heatsink pproximate weight Mounting torque Marking device R thj D operation See fig. 4 R ths Mounting surface, smooth and greased 0.50.0 /W g 0.07 oz. minimum 6 (5) kgf cm maximum (0) (lbf in) 0TQ035S ase style D PK 0TQ045S
Schottky Rectifier, 0 0TQ...S ORDERING INFORMTION TLE Device code 0 T Q 045 S TRL - 3 4 5 6 7 - urrent rating (0 ) - ircuit configuration: T = TO-0 3 - Schottky Q series 4 - Voltage ratings 5 - S = D PK 6 - None = Tube (50 pieces) TRL = Tape and reel (left oriented) TRR = Tape and reel (right oriented) 7 - None = Standard production PbF = Lead (Pb)-free 035 = 35 V 045 = 45 V 5
Outline Dimensions D PK, TO-6 DIMENSIONS FOR D PK in millimeters and inches onforms to JEDE outline D PK (SMD-0) (3) L ()(3) E 4 c (E) (D) (3) Pad layout.00 (0.43) 9.65 (0.38) D L x e 3 H () x b x b Detail 0.00 M M c ± 0.004 M E View - H (3) 7.90 (0.70) 5.00 (0.65).3 (0.08) Plating.64 (0.03).4 (0.096) (4) b, b3 3.8 (0.5) ase Metal Gauge plane Lead assignments Diodes. - node (two die)/open (one die)., 4. - athode 3. - node Lead tip 0 to 8 L3 L L4 Detail Rotated 90 W Scale: 8: Seating plane (c) (b, b) Section - and - Scale: None c (4) SYMOL MILLIMETERS INHES MILLIMETERS INHES NOTES SYMOL MX. MX. MX. MX. 4.06 4.83 0.60 0.90 D 6.86-0.70-3 0.00 0.54 0.000 0.00 E 9.65 0.67 0.380 0.40, 3 b 0.5 0.99 0.00 0.039 E 6. - 0.45-3 b 0.5 0.89 0.00 0.035 4 e.54 S 0.00 S b.4.78 0.045 0.070 H 4.6 5.88 0.575 0.65 b3.4.73 0.045 0.068 4 L.78.79 0.070 0.0 c 0.38 0.74 0.05 0.09 L -.65-0.066 3 c 0.38 0.58 0.05 0.03 4 L.7.78 0.050 0.070 c.4.65 0.045 0.065 L3 0.5 S 0.00 S D 8.5 9.65 0.335 0.380 L4 4.78 5.8 0.88 0.08 NOTES Notes () Dimensioning and tolerancing per SME Y4.5 M-994 () Dimension D and E do not include mold flash. Mold flash shall not exceed 0.7 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L, D and E (4) Dimension b and c apply to base metal only (5) Datum and to be determined at datum plane H (6) ontrolling dimension: inch (7) Outline conforms to JEDE outline TO-63
Outline Dimensions D PK, TO-6 DIMENSIONS FOR TO-6 in millimeters and inches Modified JEDE outline TO-6 (Datum ) () (3) E (3) L c E D Seating plane D(3) L 3 L () x e 0.00 M M Lead tip 3 x b 3 x b c Lead assignments Diodes. - node (two die)/open (one die)., 4. - athode 3. - node Plating c E (3) Section - (4) ase b, b3 metal (b, b) c (4) Section - and - Scale: None SYMOL MILLIMETERS INHES MX. MX. NOTES 4.06 4.83 0.60 0.90.03 3.0 0.080 0.9 b 0.5 0.99 0.00 0.039 b 0.5 0.89 0.00 0.035 4 b.4.78 0.045 0.070 b3.4.73 0.045 0.068 4 c 0.38 0.74 0.05 0.09 c 0.38 0.58 0.05 0.03 4 c.4.65 0.045 0.065 D 8.5 9.65 0.335 0.380 D 6.86-0.70-3 E 9.65 0.67 0.380 0.40, 3 E 6. - 0.45 3 e.54 S 0.00 S L 3.46 4.0 0.530 0.555 L -.65-0.065 3 L 3.56 3.7 0.40 0.46 Notes () Dimensioning and tolerancing as per SME Y4.5M-994 () Dimension D and E do not include mold flash. Mold flash shall not exceed 0.7 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L, D and E (4) Dimension b and c apply to base metal only (5) ontrolling dimension: inches (6) Outline conform to JEDE TO-6 except (maximum), b (minimum) and D (minimum) where dimensions derived the actual package outline
Packaging Information D PK TPE ND REEL INFORMTION in millimeters (inches) P.0 ± 0. Ø.55 ± 0.05 See note (5) Y P 0 4.0 ± 0. See note ().75 ± 0. Ø.6 ± 0. R 0.3 TYP..7 ± 0..57 ± 0. F.50 ± 0. See note (5) W 4.00 ± 0.3 Y P 6.00 ± 0. 0 0.50 ± 0. 0.35 ± 0.05 0. MX. L 0.5 ± 0. 0 5.80 ± 0..0 K 0 4.90 ± 0. Notes () 0 sprocket hole pitch cumulative tolerance ± 0.0 () amber not to exceed mm in 00 mm (3) Material: conductive black styrenic alloy (4) K 0 measured from a plane on the inside bottom of the pocket to the top surface of the carrier (5) Measured from centerline of sprocket hole to centerline of pocket (6) Vendor: (optional) (7) Must also meet requirements of EI standard # EI-48 taping of surface mount components for automatic placement (8) Surface resistivity of molded material must measure less or equal to 0 6 Ω per square. Measured in accordance to procedure given in STM D-57 and STM D-99 (9) Total length per reel must be 45 m (0) critical Section Y - Y