Converter - Brake - Inverter Module XPT IGBT

Similar documents
D1 D2 D3 T1 T2 T3 5 D4 D5 D6 T4 T5 T6 7

Converter - Brake - Inverter Module XPT IGBT

Converter - Brake - Inverter Module XPT IGBT

Six-Pack XPT IGBT MIXA30W1200TED. V CES = 1200 V I C25 = 43 A V CE(sat) = 1.8 V. Part name (Marking on product) MIXA30W1200TED

Six-Pack XPT IGBT MIXA80W1200TEH V CES I C25 = 1200 V. Part name (Marking on product) MIXA80W1200TEH

Converter - Brake - Inverter Module XPT IGBT

IGBT Module H Bridge MIXA81H1200EH. = 1200 V = 120 A V CE(sat) = 1.8 V V CES I C25. Part name (Marking on product) MIXA81H1200EH.

Six-Pack XPT IGBT MIXA80W1200TED V CES I C25. = 1200 V = 120 A V CE(sat) = 1.8 V. Part name (Marking on product) MIXA80W1200TED

Six-Pack XPT IGBT MIXA30W1200TML. V CES = 1200 V I C25 = 43 A V CE(sat) = 1.8 V. Part name (Marking on product) MIXA30W1200TML

T1 T3 T5 D1 D3 D5 G1 G3 G5 U V W G2 G4 G6 EU EV EW

Six-Pack XPT IGBT MIXA30W1200TMH. V CES = 1200 V I C25 = 43 A V CE(sat) = 1.8 V. Part name (Marking on product) MIXA30W1200TMH

Six-Pack XPT IGBT MIXA20W1200MC. V CES = 1200 V I C25 = 28 A V CE(sat) = 2.1 V. Part name (Marking on product) MIXA20W1200MC

Converter - Brake - Inverter Module (CBI 1) Trench IGBT

10 23, 24 21, 22 19, , 14

Converter - Brake - Inverter Module (CBI 1) NPT IGBT

Converter - Brake - Inverter Module (CBI 1) NPT IGBT

Converter - Brake - Inverter Module NPT IGBT

Converter - Brake - Inverter Module (CBI3) with Trench IGBT technology

Converter - Inverter Module NPT IGBT

Converter - Brake - Inverter Module (CBI3) with Trench IGBT technology

Converter - Brake - Inverter Module (CBI3) with Trench IGBT technology

tentative X2PT IGBT Module 6-Pack + NTC MIXG120W1200TEH V CES = 1200 V I C25 = 186 A V CE(sat) = 1.7 V tentative Part number MIXG120W1200TEH

Features / Advantages: Applications: Package: SOT-227B (minibloc)

XPT IGBT phaseleg ISOPLUS Surface Mount Power Device

ITF48IF1200HR. Trench IGBT. V CES = 1200 V I C25 = 72 A V CE(sat) = 2.05 V. Copack. Part number ITF48IF1200HR 2 (C) (G) 1 3 (E)

1200 V 600 A IGBT Module

Symbol Parameter/Test Conditions Values Unit T C = T C =80 100

STARPOWER IGBT GD40PIY120C5S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

Symbol Parameter/Test Conditions Values Unit T C = T C =80 75

Symbol Parameter/Test Conditions Values Unit T C = T C =75 800

KDG25R12KE3. Symbol Description Value Units V CES Collector-Emitter Blocking Voltage 1200 V V GES Gate-Emitter Voltage ±20 V

STARPOWER IGBT GD300HFY120C6S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

STARPOWER IGBT GD25PIT120C5S. General Description. Features. Typical Applications SEMICONDUCTOR. Molding Type Module. 1200V/25A PIM in one-package

STARPOWER IGBT GD600SGK120C2S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

L K K K K P P1 N GU EU GV EV GW EW GU GVGW GB E LABEL H H

STARPOWER IGBT GD600HFT120C2S_G8. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

STARPOWER IGBT GD600HFY120C6S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

Symbol Parameter Test condition Value Unit V CES Collector-Emitter Voltage 1200 V V GES Gate-Emitter Voltage ±20 V

GHIS075A120T2P2 Si IGBT/ SiC SBD PIM Module

STARPOWER IGBT GD450HFY120C2S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

STARPOWER. Rectifier RD180PBS180C5S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

IXXH80N65B4H1 V CES. XPT TM 650V IGBT GenX4 TM w/ Sonic Diode = 650V I C110. = 80A V CE(sat) 2.1V = 52ns. t fi(typ)

STARPOWER. Rectifier TD180PBS160C5S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

STARPOWER IGBT GD30PJT60L2S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

Parameter Symbol Conditions Values Unit. V CC = 900 V, V CEM 1200 V V GE 15 V, Tv j 125 ºC

C N V (4TYP) U (5TYP)

C N V (4TYP) U (5TYP) Dimensions Inches Millimeters L 0.69± ±0.25 M N P Q

MMIX4B22N300 V CES. = 3000V = 22A V CE(sat) 2.7V I C90

CM200EXS-24S. Chopper IGBT NX-Series Module 200 Amperes/1200 Volts

CM75MX-12A. NX-Series CIB Module (3Ø Converter + 3Ø Inverter + Brake) 75 Amperes/600 Volts

STARPOWER IGBT GD25FSY120L2S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

IXXH60N65B4H1 V CES. XPT TM 650V IGBT GenX4 TM w/ Sonic Diode = 650V I C110. = 60A V CE(sat) 2.2V = 43ns. t fi(typ)

STARPOWER IGBT GD25FST120L2S_G8. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

Standard Rectifier Module

Standard Rectifier Module

IXGT16N170A IXGH16N170A IXGT16N170AH1 IXGH16N170AH1

GSID040A120B1A3 IGBT Dual Boost Module

Values / / 360 ± (125) /125/ / / ,5 4,5 5, ,3 1,9 18 4,3 3,6

ACEPACK 1 converter inverter brake, 1200 V, 15 A trench gate field-stop IGBT M series, soft diode and NTC

ACEPACK 2 converter inverter brake, 1200 V, 25 A trench gate field-stop IGBT M series, soft diode and NTC

IXXH75N60C3D1 V CES = 600V I C110. XPT TM 600V IGBT GenX3 TM w/ Diode. = 75A V CE(sat) 2.3V t fi(typ) = 75ns

STARPOWER IGBT GD800HTT65P4S. General Description. Features. Typical Applications SEMICONDUCTOR. Molding Type Module. 650V/800A 6 in one-package

) unless otherwise specified Symbol Description Values Units

AK AJ AT AR DETAIL "A" N M L K B AB (6 PLACES) DETAIL "B" TH1 (11) TH2 (10) NTC *ALL PIN DIMENSIONS WITHIN A TOLERANCE OF ±0.5

IXYH10N170CV1 V CES = 1700V I C110. High Voltage XPT TM IGBT w/ Diode. = 10A V CE(sat) 3.8V = 70ns. t fi(typ) Advance Technical Information TO-247 AD

ABB HiPak TM. IGBT Module 5SNA 1200E V CE = 2500 V I C = 1200 A

XPT TM 600V IGBT GenX3 TM w/diode MMIX1X200N60B3H1 = 600V I C110 V CES. = 72A V CE(sat) 1.7V t fi(typ) = 110ns. Preliminary Technical Information

IXXR110N65B4H1. XPT TM 650V GenX4 TM w/ Sonic Diode V CES I C110. = 650V = 70A V CE(sat) 2.10V = 43ns. t fi(typ) (Electrically Isolated Tab)

IXYL40N250CV1 V CES. High Voltage XPT TM IGBT w/ Diode = 2500V I C110. = 40A V CE(sat) 4.0V = 134ns. t fi(typ) Advance Technical Information

IXBK55N300 IXBX55N300

ACEPACK 2 converter inverter brake, 1200 V, 35 A trench gate field-stop IGBT M series, soft diode and NTC

T C MEASURED POINT G1 E1 E2 G2 W - (4 PLACES) G2 E2 E1 G1

STARPOWER IGBT GD1000HFL170P2S. General Description. Features. Typical Applications SEMICONDUCTOR. Molding Type Module. 1700V/1000A 2 in one-package

IXYX25N250CV1 IXYX25N250CV1HV

IXBK55N300 IXBX55N300

ABB HiPak TM. IGBT Module 5SNA 0800N V CE = 3300 V I C = 800 A

Features / Advantages: Applications: Package: Y4

IXYH16N250CV1HV. High Voltage XPT TM IGBT w/ Diode V CES I C110. = 2500V = 16A V CE(sat) 4.0V = 250ns. t fi(typ) Advance Technical Information

HiPerFAST TM High Speed IGBT C2-Class w/ Diode

Standard Rectifier Module

ACEPACK 2 converter inverter brake, 1200 V, 25 A trench gate field-stop IGBT M series, soft diode and NTC

IXBX50N360HV. = 3600V = 50A V CE(sat) 2.9V. BiMOSFET TM Monolithic Bipolar MOS Transistor High Voltage, High Frequency. Advance Technical Information

5SNA 2000K StakPak IGBT Module

Thyristor Modules Thyristor/Diode Modules

IXYB82N120C3H1 V CES

n-channel Solar Inverter Induction Heating G C E Gate Collector Emitter

GSID300A125S5C1 6-Pack IGBT Module

CM400DY-24A. APPLICATION AC drive inverters & Servo controls, etc CM400DY-24A. IC...400A VCES V Insulated Type 2-elements in a pack

MMIX4B12N300 V CES = 3000V. = 11A V CE(sat) 3.2V. High Voltage, High Gain BIMOSFET TM Monolithic Bipolar MOS Transistor

STARPOWER IGBT GD40PIK120C5S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

50MT060ULS V CES = 600V I C = 100A, T C = 25 C. I27123 rev. C 02/03. Features. Benefits. Absolute Maximum Ratings Parameters Max Units.

DETAIL "A" #110 TAB (8 PLACES) X (4 PLACES) Y (3 PLACES) TH1 TH2 F O 1 F O 2 DETAIL "A"

ECONO2 PIM. Parameter Symbol Test Conditions Ratings Units. Parameter Symbol Min Typical Maximum Units

GSID300A120S5C1 6-Pack IGBT Module

Features / Advantages: Applications: Package: Y4

20MT120UF "FULL-BRIDGE" IGBT MTP. UltraFast NPT IGBT V CES = 1200V I C = 40A T C = 25 C. 5/ I27124 rev. D 02/03. Features.

Features / Advantages: Applications: Package: TO-240AA

STARPOWER IGBT GD800CUT170A3S/GD800CLT170A3S. General Description. Features. Typical Applications SEMICONDUCTOR TM. Molding Type Module

HiPerFAST TM IGBT with Diode C2-Class High Speed IGBTs

3 1/4. Features / Advantages: Applications: Package: SOT-227B (minibloc)

Transcription:

MIX3WBTED Converter - Brake - Inverter Module XPT IGBT Three Phase Rectifier Brake Chopper RRM = CES = Three Phase Inverter CES = I DM = 5 5 = 7 5 = 43 I FSM = 3 CE(sat) =. CE(sat) =. Part name (Marking on product) MIX3WBTED D D3 D5 7 D7 T D 7 T3 D3 9 T5 D5 NTC 3 5 5 4 D D4 D 4 T7 D D4 D T 3 T4 T 9 E 773 3 4 Pin configuration see outlines. Features: Easy paralleling due to the positive temperature coefficient of the on-state voltage Rugged XPT design (Xtreme light Punch Through) results in: - short circuit rated for µsec. - very low gate charge - low EMI Thin wafer technology combined with the XPT design results in a competitive low CE(sat) SONIC diode - fast and soft reverse recovery - low operating forward voltage pplication: C motor drives Solar inverter Medical equipment Uninterruptible power supply ir-conditioning systems Welding equipment Switched-mode and resonant-mode power supplies Package: "E-Pack" standard outline Iulated copper base plate Soldering pi for PCB mounting Temperature see included IXYS reserves the right to change limits, test conditio and dimeio. 9c IXYS ll rights reserved -

MIX3WBTED Ouput Inverter T - T Symbol Definitio Conditio min. typ. max. Unit CES collector emitter voltage = 5 C GES GEM max. DC gate voltage max. traient collector gate voltage continuous traient 5 collector current T C = 5 C T C = C ± ±3 43 3 P tot total power dissipation T C = 5 C 5 W CE(sat) collector emitter saturation voltage = 5 ; GE = 5 = 5 C... GE(th) gate emitter threshold voltage = m; GE = CE = 5 C 5.4..5 ES collector emitter leakage current CE = CES ; GE = = 5 C...5 m m I GES gate emitter leakage current GE = ± 5 n Q G(on) total gate charge CE = ; GE = 5 ; = 5 7 nc t d(on) t r t d(off) t f E on E off turn-on delay time current rise time turn-off delay time current fall time turn-on energy per pulse turn-off energy per pulse inductive load CE = ; = 5 GE = ±5 ; R G = 39 W RBSO reverse bias safe operating area GE = ±5 ; R G = 39 W; CEK = 75 SCSO t SC I SC short circuit safe operating area short circuit duration short circuit current 7 4 5.5 3. CE = 9 ; GE = ±5 ; R G = 39 W; non-repetitive µs thermal resistance junction to case (per IGBT).4 K/W Output Inverter D - D Symbol Definitio Conditio min. typ. max. Unit RRM max. repetitve reverse voltage = 5 C I F5 I F forward current T C = 5 C T C = C F forward voltage I F = 3 ; GE = = 5 C Q rr I RM t rr E rec reverse recovery charge max. reverse recovery current reverse recovery time reverse recovery energy R = di F /dt = - /µs I F = 3 ; GE =.95.95 3.5 3 35.9 44 3. µc thermal resistance junction to case (per diode). K/W T C = 5 C unless otherwise stated IXYS reserves the right to change limits, test conditio and dimeio. 9c IXYS ll rights reserved -

MIX3WBTED Brake T7 Symbol Definitio Conditio min. typ. max. Unit CES collector emitter voltage = 5 C GES GEM max. DC gate voltage max. traient collector gate voltage continuous traient 5 collector current T C = 5 C T C = C P tot total power dissipation T C = 5 C W CE(sat) collector emitter saturation voltage = 9 ; GE = 5 = 5 C.. ± ±3 7. GE(th) gate emitter threshold voltage =.3 m; GE = CE = 5 C 5.4..5 ES collector emitter leakage current CE = CES ; GE = = 5 C.. m m I GES gate emitter leakage current GE = ± 5 n Q G(on) total gate charge CE = ; GE = 5 ; = nc t d(on) t r t d(off) t f E on E off turn-on delay time current rise time turn-off delay time current fall time turn-on energy per pulse turn-off energy per pulse inductive load CE = ; = GE = ±5 ; R G = W RBSO reverse bias safe operating area GE = ±5 ; R G = W; CEK = 3 SCSO t SC I SC short circuit safe operating area short circuit duration short circuit current 7 4 5.. CE = 9 ; GE = ±5 ; R G = W; non-repetitive 4 µs thermal resistance junction to case (per IGBT). K/W Brake Chopper D7 Symbol Definitio Conditio min. typ. max. Unit RRM max. repetitive reverse voltage = 5 C I F5 I F forward current T C = 5 C T C = C F forward voltage I F = 5 ; GE = = 5 C I R reverse current R = RRM = 5 C.5 Q rr I RM t rr E rec reverse recovery charge max. reverse recovery current reverse recovery time reverse recovery energy R = di F /dt = /µs I F = 5 ; GE =.95.95..5 m m µc thermal resistance junction to case (per diode) 3.4 K/W T C = 5 C unless otherwise stated. 35. IXYS reserves the right to change limits, test conditio and dimeio. 9c IXYS ll rights reserved 3 -

MIX3WBTED Input Rectifier Bridge D - D Symbol Definitio Conditio min. typ. max. Unit RRM max. repetitive reverse voltage = 5 C I F average forward current sine T C = C I DM max. average DC output current rect.; d = / 3 T C = C I FSM max. forward surge current t = ms; sine 5 Hz = 5 C I t I t value for fusing t = ms; sine 5 Hz = 5 C P tot total power dissipation T C = 5 C W F forward voltage I F = 5 = 5 C I R reverse current R = RRM = 5 C..34.34 37 5 3 5 39 s s.7. m m thermal resistance junction to case (per diode). K/W Temperature Seor NTC Symbol Definitio Conditio min. typ. max. Unit R 5 resistance T C = 5 C 4.75 5. B 5/5 3375 5.5 kw K Module Symbol Definitio Conditio min. typ. max. Unit M T stg operating temperature max. virtual junction temperature storage temperature -4-4 5 5 5 C C C ISOL isolation voltage I ISOL < m; 5/ Hz 5 ~ CTI comparative tracking index - M d mounting torque (M5) 3 Nm d S d creep distance on surface strike distance through air mm mm R pin-chip resistance pin to chip 5 R thch thermal resistance case to heatsink with heatsink compound. K/W Weight g Equivalent Circuits for Simulation I Symbol Definitio Conditio min. typ. max. Unit R R rectifier diode D - D3 = 5 C. 9 IGBT T - T = 5 C. R 55 free wheeling diode D - D = 5 C. R 7 IGBT T7 = 5 C. R 53 free wheeling diode D7 = 5 C.5 R 7 T C = 5 C unless otherwise stated IXYS reserves the right to change limits, test conditio and dimeio. 9c IXYS ll rights reserved 4 -

MIX3WBTED Circuit Diagram D D3 D5 D7 D D3 D5 T T3 T5 NTC 7 5 7 9 3 5 4 D D4 D 4 T7 D D4 D T T4 3 T 9 3 4 Outline Drawing Dimeio in mm ( mm =.394 ) Product Marking XXXXXXXXXX yywwx Logo UL Part name Date Code D Data Matrix: FOSS-ID digits Batch # digits Location Part number M = Module I = IGBT X = XPT = Standard 3 = Current Rating [] WB = -Pack + 3~ Rectifier Bridge & Brake Unit = Reverse oltage [] T = NTC ED = E-Pack Ordering Part Name Marking on Product Delivering Mode Base Qty Ordering Code Standard MIX3WB TED MIX3WBTED Box 59 9 IXYS reserves the right to change limits, test conditio and dimeio. 9c IXYS ll rights reserved 5 -

MIX3WBTED Inverter T - T 5 4 GE = 5 5 4 GE = 5 7 9 3 [] 3 = 5 C [] 3 9 3 [] CE Fig. Typ. output characteristics 3 4 5 CE [] Fig. Typ. output characteristics 5 4 5 = 5 CE = [] 3 GE [] 5 = 5 C 5 7 9 3 GE [] Fig. 3 Typ. tranfer characteristics 4 Q G [nc] Fig. 4 Typ. turn-on gate charge E 5 4 [] 3 R G = 39 Ω CE = GE = ±5 3 4 5 [] Fig. 5 Typ. switching energy vs. collector current IXYS reserves the right to change limits, test conditio and dimeio. E on E off.5 E. [].5. 4 4 R G [Ω ] Fig. Typ. switching energy vs. gate resistance 9c IXYS ll rights reserved - 4. 3.5 3...5 E off E on = 5 CE = GE = ±5

MIX3WBTED Inverter D - D 5 7 R = 4 5 I F [] 3 = 5 C Q rr [µc] 4 3 3 5..5..5..5 3. Fig. 7 Typ. Forward current versus F 3 4 5 7 9 F [] di F /dt [/µs] Fig. Typ. reverse recov.charge Q rr vs. di/dt 7 7 R = R = 5 3 5 I RR [] 4 3 5 t rr [] 4 3 3 5 3 4 5 7 9 di F /dt [/µs] Fig. 9 Typ. peak reverse current I RM vs. di/dt 3 4 5 7 9 di F /dt [/µs] Fig. Typ. recovery time t rr versus di/dt E rec... R = 3 Z thjc Diode IGBT []..4 5. 3 4 5 7 9 di F /dt [/µs] Fig. Typ. recovery energy E rec versus di/dt IXYS reserves the right to change limits, test conditio and dimeio. 4...94..... 9c IXYS ll rights reserved 7 - [K/W]. IGBT t p [s] FRD R i t i R i t i..5.343.5.4.3.7.3 3.3.3.3475.3 Fig. Typ. traient thermal impedance

MIX3WBTED Brake T7 & D7 GE = 5 = 5 C I F [] [] 4 4 = 5 C 3 CE [] Fig. 3 Typ. output characteristics..5..5..5 3. F [] Fig. 4 Typ. forward characteristics diode Z thjc IGBT R [K/W] [Ω] Inverter-IGBT Inverter-FRD R i t i R i t i.44..5..45.3.5.3 3.7.3.494.3 4.47..45..... t P [s] Fig. 5 Typ. traient thermal impedance 5 5 75 5 5 T C [ C] Fig. Typ. NTC resistance vs. temperature IXYS reserves the right to change limits, test conditio and dimeio. 9c IXYS ll rights reserved -