FULL PITCH MINI-FLAT PACKAGE 4-PIN OPTOCOUPLERS

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HMA2 Series HMA24 HMA27 Series HMAA275 DESCRITION The HMA24, HMA2 series and HMA27 series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. The HMAA275 consists of two gallium arsenide infrared emitting diodes, connected in inverse parallel, driving a single silicon phototransistor in a compact 4-pin mini-flat package. The lead pitch is 2.54mm. FEATURES Compact 4-pin package (2.4 mm maximum standoff height) Current Transfer Ratio in selected groups HMA2: 5 6% HMA27: 5 3% HMA2A: 3% HMA27A: 5 3% HMA2B: 5 5% HMA27B: 8 6% HMA2C: 2% HMA24: % MIN HMA2D: 5 % HMAA275: 5 3% HMA2E: 5 3% HMA2F: 6% Available in tape and reel quantities of 5 and 25. Applicable to Infrared Ray reflow (23 C max, 3 seconds.) BSI (File #86/862), CSA (File #623), UL (File #E97) and DE (File #3648) certified Creepage 5 mm, typical 5.2 mm Clearance 5 mm, typical 5.2 mm ALICATIONS HMAA275 AC line monitor Unknown polarity DC sensor Telephone line receiver HMA2 series, HMA27 series, HMA24 Digital logic inputs Microprocessor inputs ower supply monitor Twisted pair line receiver Telephone line receiver.2 (.5).2 (.3) ACKAGE DIMENSIONS.35 (.89).2 (.3) 2 IN.287 (7.29).248 (6.3).73 (4.4) TY Equivalent Circuit (HMAA275). (2.54) TY.8 (.2). (.) 4 COLLECTOR 3 EMITTER.69 (4.29).54 (3.9) NOTE All dimensions are in inches (millimeters).33 (.85).26 (.65).94 (2.39).79 (2.) ANODE 4 COLLECTOR CATHODE 2 3 EMITTER Equivalent Circuit (HMA27, HMA2, HMA24) 23 Fairchild Semiconductor Corporation age of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise specified) arameter Symbol alue Units TOTAL ACKAGE Storage Temperature T STG -4 to +25 C Operating Temperature T OR -4 to + C EMITTER Continuous Forward Current I F (avg) 5 ma eak Forward Current ( µs pulse, 3 pps.) I F (pk) A Reverse Input oltage (HMA) R 6 ower Dissipation 7 mw D Derate linearly (above 25 C).65 mw/ C DETECTOR Continuous Collector Current 8 ma ower Dissipation 5 mw D Derate linearly (above 25 C) 2. mw/ C Collector-Emitter oltage HMA27 Series, HMAA275 4 CEO HMA2 Series, HMA24 8 Emitter-Collector oltage ECO 7 23 Fairchild Semiconductor Corporation age 2 of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 ELECTRICAL CHARACTERISTICS (T A = 25 C) INDIIDUAL COMONENT CHARACTERISTICS Reverse Current ( R = 5 ) I R arameter Test Conditions Symbol Device Min Typ** Max Unit EMITTER HMA2 Series (I F = ma)..3 Forward oltage HMA24 (I F F = 5 ma) HMA27 Series.4 (I F = ± 5 ma) HMAA275 HMA2 Series 5 µa HMA27 Series HMA24 DETECTOR HMA2 Series 8 Breakdown oltage HMA24 (I C = ma, I F = ) B CEO Collector to Emitter HMA27 Series 4 HMAA275 Emitter to Collector (I E = µa, I F = ) B ECO All 7 Collector Dark Current ( CE = 4, I F = ) I CEO All na Capacitance ( CE =, f = MHz) C CE All pf 23 Fairchild Semiconductor Corporation age 3 of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 TRANSFER CHARACTERISTICS (T A = 25 C) Characteristic Test Conditions Symbol Device Min Typ** Max Unit DC Current Transfer Ratio (I F = ± 5 ma, CE = 5 ) HMAA275 5 3 HMA27 5 3 (I F = 5 ma, CE = 5 ) HMA27A 5 3 HMA27B 8 6 HMA2 5 6 HMA2A 3 HMA2B 5 5 (I CTR F = 5 ma, CE = 5 ) HMA2C 2 HMA2D 5 HMA2E 5 3 HMA2F 6 (I F = ma, CE =.4 ) HMA2F 3 (I F = ma, CE =.5 ) HMA24 2 (I F =.5 ma, CE =.5 ) HMA24 5 % CTR Symmetry (I F = ± 5 ma, CE = 5 ) HMAA275.3 3. Saturation oltage (I F = ± ma, I C = 2 ma) HMAA275.3 HMA27.3 (I F = ma, I C = 2 ma) HMA27A.3 HMA27B.3 HMA2.4 HMA2A.4 CE (SAT) HMA2B.4 (I F = 8 ma, I C = 2.4 ma) HMA2C.4 HMA2D.4 HMA2E.4 HMA2F.4 (I F = ma, I C =.2 ma) HMA2F.4 (I F = ma, I C =.5 ma) HMA24.4 Rise Time (Non-Saturated) Fall Time (Non-Saturated) (I C = 2 ma, CE = 5 ) (R L = Ω) (I C = 2 ma, CE = 5 ) (R L = Ω) t r 3 t f 3 µs ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Device Min Typ** Max Unit Steady State Isolation oltage ( Minute) ISO All 375 RMS ** All typicals at TA = 25 C 23 Fairchild Semiconductor Corporation age 4 of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 TYICAL ERFORMANCE CURES Fig. Forward Current vs. Forward oltage Fig. 2 Collector Current vs. Forward Current IF - FORWARD CURRENT (ma) IC - COLLECTOR CURRENT (ma) CE = CE =.4 CE = 5.6.8..2.4.6. F - FORWARD OLTAGE () I F - FORWARD CURRENT (ma) Fig. 3 Current Transfer Ratio vs. Forward Current Fig. 4 Collector Current vs. Temperature IC / IF - CURRENT TRANSFER RATIO (%) CE =.4 CE = 5 CE = IC - COLLECTOR CURRENT (ma) I F = ma I F = 25 ma I F = 5 ma I F = ma I F =.5 ma CE = 5 I F - FORWARD CURRENT (ma). -2 2 4 6 8 T A - AMBIENT TEMERATURE ( C) Fig. 5 Collector Current vs. Collector-Emitter oltage 4 IC - COLLECTOR CURRENT (ma) 3 2 I F = 5 ma I F = 4 ma I F = 3 ma I F = 2 ma I F = ma I F = 5 ma I F = ma 2 4 6 8 CE - COLLECTOR-EMITTER OLTAGE () 23 Fairchild Semiconductor Corporation age 5 of /2/3

SWITCHING TIME (µs) SATURATION OLTAGE () FULL ITCH MINI-FLAT ACKAGE HMA2 Series HMA24 HMA27 Series HMAA275 Fig. 6 Collector Current vs. Collector-Emitter oltage Fig. 7 Collector Dark Current vs. Temperature IC - COLLECTOR CURRENT (ma) 2 5 5 I F =.5 ma I F = 5 ma I F = 4 ma I F = 3 ma I F = 2 ma I F = ma I F = 5 ma I F = 2 ma I F = ma ICEO - COLLECTOR DARK CURRENT (µa)... CE = 48 CE = 24 CE = CE = 5..2.4.6.8. 2 4 6 8 2 CE - COLLECTOR-EMITTER OLTAGE () T A - AMBIENT TEMERATURE ( C) Fig. 8 Switching Time vs. Load Resistance Fig. 9 Collector-Emitter Saturation oltage vs. Temperature I F = 6 ma CC = 5 t OFF t s t ON CE (sat) - COLLECTOR-EMITTER.24.2.6.2.8 I F = 5 ma I C = ma. R L - RESISTANCE (kω) -4-2 2 4 6 8 T A - AMBIENT TEMERATURE ( C) 23 Fairchild Semiconductor Corporation age 6 of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 ORDERING INFORMATION Option R R2 R3 R4 R R2 R3 R4 Description DE Approved Tape and Reel (5 units) Tape and Reel (25 units) Tape and Reel (5 units; unit 8 rotated) Tape and Reel (25 units; unit 8 rotated) Tape and Reel (5 units) and DE Approved Tape and Reel (25 units) and DE Approved Tape and Reel (5 units; unit 8 rotated) and DE Approved Tape and Reel (25 units; unit 8 rotated) and DE Approved MARKING INFORMATION 2 2 X YY M 6 3 4 5 Definitions Fairchild logo 2 Device number DE mark (Note: Only appears on parts ordered with DE 3 option See order entry table) 4 One digit year code 5 Two digit work week ranging from to 53 6 Assembly package code 23 Fairchild Semiconductor Corporation age 7 of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 K t 2 D E W A B F W d D Description Tape Width Tape Thickness Sprocket Hole itch Sprocket Hole Dia. Sprocket Hole Location ocket Location ocket itch ocket Dimension ocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt Symbol W t D E F A B K D W d 2 2.54 itch Dimensions (mm) 2.±.4.3±.2 4.±.2.55±.2.75±.2 5.5±.2 2.±.2 8.±.2 4.4±.2 7.3±.2 2.3±.2.55±.2 9.2.65±.2 2 max Devices er Reel Reel Diameter R R2 R R2 5 25 78 mm (7") 33 mm (3") 23 Fairchild Semiconductor Corporation age 8 of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 Footprint Drawing for CB Layout.24 (.6).6 (.52).3 (7.87).9 (4.83). (2.54) Recommended Infrared Reflow Soldering rofile (heating) to 3 s ackage Surface Temperature T ( C) 8 C to 6 s 23 C (peak temperature) 2 C 5 s 9 s 6 s Time (s) eak reflow temperature: 23 C (package surface temperature) for 3 seconds Time of temperature higher than 2 C: 6 seconds or less One time soldering reflow is recommended 23 Fairchild Semiconductor Corporation age 9 of /2/3

HMA2 Series HMA24 HMA27 Series HMAA275 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY RODUCTS HEREIN TO IMROE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE ALICATION OR USE OF ANY RODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONEY ANY LICENSE UNDER ITS ATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUORT OLICY FAIRCHILD S RODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMONENTS IN LIFE SUORT DEICES OR SYSTEMS WITHOUT THE EXRESS WRITTEN AROAL OF THE RESIDENT OF FAIRCHILD SEMICONDUCTOR CORORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. 23 Fairchild Semiconductor Corporation age of /2/3