E E mm Size encoder with mm height contribute to space saving and multifunctioning Typical Specifications Items Specifications Product Line Structure Dip ctuator l e n g t h(m m) Reflow Detent torque (mn m) 7± 6±7 ± 7±8 (Initial), +7 (fter reflow) Rating Number of detent 0 8 0 8 0 Operating life 0m V D 0,000 cycles Operating temperature range 0 to +8 Number of pulse Minimum order unit (pcs.) Japan Export 600,00 0 600 60 80,00 60 Product E00 E00 E000 E007 E000 E00 Packing Specifications Tray Number of packages (pcs.) Product case /Japan case /export packing Export package measurements (mm) E000 0 80 8 7 E 600,00 6 08 E007 E000 600,00 60 0 0 E 60 60 0 00 8 Style Unit:mm P board mounting hole dimensions (Viewed from mounting side). 6.6. 0.6 0.6.6. ø holes 0 Refer to P. for soldering conditions.
E/E/mm Size Style Unit:mm P board mounting hole dimensions (Viewed from mounting side). 0.7.6.. 6 6.6. 0. - ø. - -. -.6.6.8 0 ø hole.6.6 ø. hole ø. -8 ø0.8.. -.. -8. -8 -. -0. -0. -φ. -. -φ. -. -.0. -.0. -.0 -.0-8 -8 0.8 -.6 -.6 0.8. -. -...6.6 0.6 -.6 6. -. -.0 hole. - 8. -6.6 -. -..6.. -. -.Mounting surface Mounting surface -. 0. -. 0... -8-8 6-0. 6-0. -.0 φ. -.0 φ. -.0-0.6 φ0.8 -.0-0.6 φ0.8-8 -8 -.6 -.6...6.6 -.6 -..7 -.6..6 -φ.0 hole. 6 -. -6.6 φ. hole -0.6 6.. -.6 0.8 7.6.6 -. -6.6 -φ. -φ0. 0.8 - -. φ. 0. -. -.6 -.0 0 -.6 -. -.6 φ. -8 φ0.8 -φ.0 holes 8. -. 0
E E mm Size Output Wave Sliding Noise signal signal Detent stability position W direction Detent position cannot be specified for signal. V =V =.V max. R Test circuit Terminal R V D Terminal Encoder Terminal /s t R = kω hattering : ms max. ounce : ms max. V Output waveform t t Sliding direction V V t : Masking time to avoid chatterin 0
List of Varieties type mm size 8mm size mm size E E E8 E8 E EH NEW Output Incremental (Two phase and ) Incremental ( Three phase, and ) types type Number of pulse / Number of detent /8 /0 /0 /0 8/8 /0 6 /8 0 /0 (mm) W 8 8.6 D.6. H. Operating temperature range 0 to +8 0 to +0 0 to +8 Operating life 0,000 cycles utomotive use Life cycle (availability) Rating 0m V D Electrical performance Max./min. operating current(resistive load) Insulation resistance Voltage proof 00V for minute or 60V for s 00V for minute or 60V for s 0m / m 00MΩ min. 0V D 00V for minute or 60V for s 00V for minute or 60V for s 00V for minute or 60V for s Mechanical performance Detent torque Push-pull strength Push Pull 7±mN m ±mn m 6±7mN m 7±8mN m (Initial) + 7 mn m (fter reflow) 7±mN m ±7mN m 0±0mN m 00N 00N 0±mN m (Initial) 0±0mN m (fter reflow) 8±7mN m 0±mN m ±mn m 8±7mN m 0±mN m configuration type Terminal type Insertion Switch type ontact arrangement Travel (mm) Switch Specifications Operating force (N) Switch position Rotational torque Rating ontact resistance Operating life Page 0 0 07 08 Soldering onditions autions 6 Note Indicates applicability to all products in the series. 7
Soldering onditions Reference for Manual Soldering Tip temperature Soldering time of solders E0E, E0E, E0E, E, E, EE, EG, EK, ED, EE, E8, E, E8, E, EH, E, E0, E, E0, E60, EM, EM0, E, E8, EH EJ 0 max. s max. time 0±0 + s 0 times Reference for Dip Soldering E0E, E, E, EE, EG, EK, E8, E, E8, E, EH, E, E0, E60 E0E, ED, EE, EM Soldering surfacetemperature Heating time Soldering temperature Soldering time of solders 00 max. min. max. 60± ±s times max. 00 max. Preheating min. max. 60± Dip soldering ±s times max. E0 0 max. min. max. 60 max. 0s max. time E EM0 00 max. 80 max. min. max. min. max. 60 max. 60 max. s max. s max. times max. times max. Example of Reflow Soldering ondition Temperature profile Temperature ( ) 00 00 00 D Room temperature Time (s) Pre-heating E max. F max. G max. H max. EJ D E F G H of reflows 60 0 80 0 min. max. s 0s min. max. times max. E0E 0 min. 0 min. 80 0 60s to 0s 0s to 0s times max. E 0 to 0 00 0 60s to 0s s to 60s 00s max. time max. E8, EH 60 0 80 0 min. min. s 0s 0s max. time max. 注記. When using an infrared reflow oven, solder may sometimes not be applied. e sure to use a hot air reflow oven or a type that uses infrared rays in combination with hot air.. The temperatures given above are the maximum temperatures at the terminals of the encoder when employing a hot air reflow method. The temperature of the P board and the surface temperature of the encoder may vary greatly depending on the P board material, its size and thickness. Ensure that the surface temperature of the encoder does not rise to 0 or greater.. onditions vary to some extent depending on the type of reflow bath used. e sure to give due consideration to this prior to use.