MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW Dual General Purpose Transistors The MBT394DW and MBT394DW2 devices are a spinoff of our popular SOT23/SOT323 threeleaded device. It is designed for general purpose amplifier applications and is housed in the SOT33 sixleaded surface mount package. By putting two discrete devices in one package, this device is ideal for lowpower surface mount applications where board space is at a premium. Features h FE, Low V CE(sat),.4 V Simplifies Circuit Design Reduces Board Space Reduces Component Count Available in 8 mm, inch/3, Unit Tape and Reel S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AECQ Qualified and PPAP Capable These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Symbol Value Unit CollectorEmitter Voltage V CEO 4 Vdc CollectorBase Voltage V CBO Vdc EmitterBase Voltage V EBO. Vdc Collector Current Continuous I C madc Electrostatic Discharge ESD HBM Class 2 MM Class B Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Package Dissipation (Note ) T A = 2 C Thermal Resistance, JunctiontoAmbient Junction and Storage Temperature Range P D mw R JA 833 C/W T J, T stg to + C. Device mounted on FR4 glass epoxy printed circuit board using the minimum recommended footprint. Q (3) SOT33/SC88/ SC CASE 49B (2) () Q 2 (4) () () MBT394DWT STYLE MARKING DIAGRAM XX M XX = MA for MBT394DWTG MJ for MBT394DW2TG M = Date Code = PbFree Package (Note: Microdot may be in either location) Q (3) ORDERING INFORMATION Device Package Shipping MBT394DWTG, MBT394DW2TG (2) (4) () SMBT394DWTG NSVMBT394DWT3G MBT394DW2T STYLE 2 SOT33 (PbFree) SOT33 (PbFree) SOT33 (PbFree) () Q 2 () / Tape & Reel / Tape & Reel / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. Semiconductor Components Industries, LLC, 2 June, 2 Rev. Publication Order Number: MBT394DWT/D
MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW ELECTRICAL CHARACTERISTICS (T A = 2 C unless otherwise noted) Characteristic Symbol Min Max Unit OFF CHARACTERISTICS CollectorEmitter Breakdown Voltage (Note 2) V (BR)CEO Vdc (I C = madc, I B = ) 4 CollectorBase Breakdown Voltage (I C = Adc, I E = ) EmitterBase Breakdown Voltage (I E = Adc, I C = ) Base Cutoff Current (V CE = 3 Vdc, V EB = 3. Vdc) Collector Cutoff Current (V CE = 3 Vdc, V EB = 3. Vdc) ON CHARACTERISTICS (Note 2) DC Current Gain (I C = madc, V CE = Vdc) (I C = madc, V CE = Vdc) (I C = madc, V CE = Vdc) (I C = madc, V CE = Vdc) (I C = madc, V CE = Vdc) CollectorEmitter Saturation Voltage (I C = madc, I B = madc) (I C = madc, I B =. madc) BaseEmitter Saturation Voltage (I C = madc, I B = madc) (I C = madc, I B =. madc) SMALLSIGNAL CHARACTERISTICS CurrentGain Bandwidth Product (I C = madc, V CE = 2 Vdc, f = MHz) Output Capacitance (V CB =. Vdc, I E =, f = MHz) Input Capacitance (V EB =. Vdc, I C =, f = MHz) Input Impedance (V CE = Vdc, I C = madc, f = khz) Voltage Feedback Ratio (V CE = Vdc, I C = madc, f = khz) SmallSignal Current Gain (V CE = Vdc, I C = madc, f = khz) Output Admittance (V CE = Vdc, I C = madc, f = khz) Noise Figure (V CE =. Vdc, I C = Adc, R S = k, f = khz) 2. Pulse Test: Pulse Width s; Duty Cycle 2.%. V (BR)CBO V (BR)EBO. I BL I CEX h FE 4 3 V CE(sat) V BE(sat)..2.3.8.9 f T C obo 4. C ibo 8. h ie 2. h re. h fe h oe 3. NF 2 8. 4 4 4. Vdc Vdc nadc nadc Vdc Vdc MHz pf pf k X 4 mhos db 2
MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW SWITCHING CHARACTERISTICS Characteristic Symbol Min Max Unit Delay Time (V CC = 3. Vdc, V BE =. Vdc) t d 3 Rise Time (I C = madc, I B = madc) t r 3 Storage Time (V CC = 3. Vdc, I C = madc) t s Fall Time (I B = I B2 = madc) t f ns ns DUTY CYCLE = 2% ns +.9 V +3 V 2 < t < s DUTY CYCLE = 2% t +.9 V +3 V 2 -. V < ns k C s < 4 pf* k N9 C s < 4 pf* - 9. V < ns * Total shunt capacitance of test jig and connectors Figure. Delay and Rise Time Equivalent Test Circuit Figure 2. Storage and Fall Time Equivalent Test Circuit 3
f MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW TYPICAL TRANSIENT CHARACTERISTICS T J = 2 C T J = 2 C CAPACITANCE (pf).. 3. 2. C ibo C obo.2.3.. 2. 3... 2 3 4 REVERSE BIAS VOLTAGE (VOLTS) Figure 3. Capacitance Q, CHARGE (pc) V CC = 4 V I C /I B = Q T 2. 3... 2 3 Figure 4. Charge Data Q A I C /I B = V CC = 4 V I C /I B = TIME (ns) 3 2 V t d @ V OB = V 2. V 2. 3... 2 3 Figure. TurnOn Time t r @ V CC = 3. V 4 V t, RISE TIME (ns) r 3 2 2. 3... 2 3 Figure. Rise Time t, STORAGE TIME (ns) s 3 2 I C /I B = 2 I C /I B = t s = t s - / 8 t f I B = I B2 I C /I B = 2 I C /I B = t, FALL TIME (ns) 3 2 I C /I B = I C /I B = 2 V CC = 4 V I B = I B2 2. 3... 2 3 Figure. Storage Time 2. 3... 2 3 Figure 8. Fall Time 4
MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW TYPICAL AUDIO SMALLSIGNAL CHARACTERISTICS NOISE FIGURE VARIATIONS (V CE =. Vdc, T A = 2 C, Bandwidth = Hz) NF, NOISE FIGURE (db) 2 8 4 SOURCE RESISTANCE = I C = ma SOURCE RESISTANCE = I C =. ma SOURCE RESISTANCE = k I C = A NF, NOISE FIGURE (db) 4 2 8 4 f = khz I C =. ma I C = ma I C = A I C = A 2 SOURCE RESISTANCE = I C = A.2.4 2. 4. 2 4 f, FREQUENCY (khz) Figure 9. Noise Figure 2.2.4 2. 4. 2 4 R S, SOURCE RESISTANCE (k OHMS) Figure. Noise Figure h PARAMETERS (V CE = Vdc, f = khz, T A = 2 C) h fe, CURRENT GAIN 3.2.3. 2. 3.. Figure. Current Gain h oe, OUTPUT ADMITTANCE ( mhos) 2 2.2.3. 2. 3.. Figure 2. Output Admittance h ie, INPUT IMPEDANCE (k OHMS) 2. 2...2.2.3. 2. 3.. h re, VOLTAGE FEEDBACK RATIO (x -4 ).. 3. 2....2.3. 2. 3.. Figure 3. Input Impedance Figure 4. Voltage Feedback Ratio
MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW TYPICAL STATIC CHARACTERISTICS h FE, DC CURRENT GAIN (NORMALIZED) 2....3.2 T J = +2 C +2 C - C V CE = V.2.3.. 2. 3... 2 3 Figure. DC Current Gain V CE, COLLECTOR EMITTER VOLTAGE (VOLTS).8..4.2. I C = ma.2.3.. T J = 2 C ma 3 ma ma.2.3.. 2. 3... I B, BASE CURRENT (ma) Figure. Collector Saturation Region.2 T J = 2 C V BE(sat) @ I C /I B =. +2 C TO +2 C V, VOLTAGE (VOLTS).8..4.2 V CE(sat) @ I C /I B = V BE @ V CE = V COEFFICIENT (mv/ C) -. - -. VC FOR V CE(sat) VB FOR V BE(sat) - C TO +2 C - C TO +2 C +2 C TO +2 C 2.. 2-2. 2 4 8 2 4 8 Figure. ON Voltages Figure 8. Temperature Coefficients
MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW TYPICAL STATIC CHARACTERISTICS f T, CURRENTGAINBANDWIDTH PRODUCT (MHz) V CE = V T A = 2 C Figure 9. Current Gain Bandwidth Product I C, COLLECTOR CURRENT (A).. Thermal Limit Sec msec msec V CE, COLLECTOR EMITTER VOLTAGE (V) Figure 2. Safe Operating Area msec
MBT394DW, MBT394DW2, SMBT394DW, NSVMBT394DW PACKAGE DIMENSIONS E 2X bbb H D e X ccc C A D 4 2 3 B TOP VIEW SIDE VIEW A 2X D E aaa H aaa 2X 3 TIPS X b ddd M A2 A C D L2 C C SEATING PLANE SC88/SC/SOT33 CASE 49B2 ISSUE Y A-B D DETAIL A H RECOMMENDED SOLDERING FOOTPRINT* X.3 L DETAIL A END VIEW GAGE PLANE c X. NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.M, 994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRU- SIONS, OR GATE BURRS SHALL NOT EXCEED.2 PER END. 4. DIMENSIONS D AND E AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY AND DATUM H.. DATUMS A AND B ARE DETERMINED AT DATUM H.. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN.8 AND FROM THE TIP.. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.8 TOTAL IN EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI- TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OF THE FOOT. MILLIMETERS DIM MIN NOM MAX A. A.. A2..9.2.3.39 b.2.2..8. C.8.22.3..9 D.8 2. 2.2..8.8 E 2. 2. 2.2.8.82.8 E..2.3.4.49.3 e. BSC.2 BSC L.2.3.4..4.8 L2 BSC. BSC aaa. bbb.3.2 ccc..4 ddd..4 STYLE : PIN. EMITTER 2 2. BASE 2 3. COLLECTOR 4. EMITTER. BASE. COLLECTOR 2 INCHES MIN NOM MAX.43..4 STYLE 2: PIN. BASE 2 2. BASE 3. COLLECTOR 4. EMITTER. EMITTER 2. COLLECTOR 2 2.. PITCH DIMENSIONS: MILLIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 3, Denver, Colorado 82 USA Phone: 332 or 834438 Toll Free USA/Canada Fax: 332 or 834438 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 828298 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 42 33 9 29 Japan Customer Focus Center Phone: 838 8 ON Semiconductor Website: Order Literature: http:///orderlit For additional information, please contact your local Sales Representative MBT394DWT/D