YAGEO COPOATION SMD INDUCTO/BEADS Multilayer Ferrite Chip Beads SB/PB Series [ PB Series for Large Current ] APPLICATIONS Prevention of high frequency EMI form computers, printers, VCs, TVs, wireless telephone and other related equipment. OUTLINE PODUCT IDENTIFICATION SB * B: Bulk; T: Tape and eel Intemal No. Impedance and Tolerance Packaging Style (*) Dimensions (A, B, C) Material Code Product Symbol SB PB (large current) YAGEO ferrite chip EMI suppressers provide a powerful means of EMI/FI attenuation for electronic equipment. These products are highly produced with the use of magnetic material and multilayered technology. These components contain tremendous electrode strength, solder heat resistance and outstanding solderability. These products are specially designed for flow, reflow and wave soldering required for surface mounting application. FEATUES Unlike conventional beads, these beads do not require wiring: Simply mounts them onto the PCB to eliminate the EMI/FI. Specially designed for surface mounting equipment, available in various size which allows them to wide rang of application and usage. Best designed and tested to offer high impedance for volume. SHAPES AND DIMENSIONS Ferrite Terminal Electrode D D C A B Dimensions : mm TYPE A B C D S/PB 60808.6±0.20 0.80±0.5 0.8± 0.5 0.4± 0.2 S/PB 20209 2.0±0.20.25±0.20 0.9± 0.20 0.5± 0.3 S/PB 326 3.2±0.20.60±0.20.± 0.20 0.5± 0.3 SB 3266 3.2±0.20.60±0.20.6± 0.20 0.5± 0.3 SB 32253 3.2±0.20 2.50±0.20.3± 0.20 0.5± 0.3 S/PB 4566 4.5±0.25.60±0.20.6± 0.20 0.5± 0.3 S/PB 45325 4.5±0.25 3.20±0.20.5± 0.20 0.5± 0.3
2 ELECTICAL CHAACTEISTICS PAT NO. Test Frequency Impedance DC esistance ate Current (MHz) (Ω) (Ω) Max. (ma) Max. SBK60808T-300Y-S 0 30±25% 0.20 200 SBK60808T-400Y-S 0 40±25% 0.20 200 SBK60808T-600Y-S 0 60±25% 0.20 200 SBK60808T-800Y-S 0 80±25% 0.30 200 SBK60808T-2Y-S 0 20±25% 0.30 200 SBK60808T-22Y-S 0 220±25% 0.50 0 SBK60808T-30Y-S 0 300±25% 0.60 0 SBK60808T-45Y-S 0 450±25% 0.70 0 SBK60808T-60Y-S 0 600±25% 0.80 0 SBK60808T-75Y-S 0 750±25%.00 0 SBK60808T-2Y-S 0 00±25%.00 0 SBY20209T-070Y-S 0 7±25% 0. 600 SBY20209T-090Y-S 0 9±25% 0. 600 SBY20209T-Y-S 0 ±25% 0. 600 SBY20209T-70Y-S 0 7±25% 0. 500 SBY20209T-320Y-S 0 32±25% 0.20 500 SBK20209T-600Y-S 0 60±25% 0.30 400 SBK20209T-700Y-S 0 70±25% 0.30 400 SBK20209T-800Y-S 0 80±25% 0.40 400 SBK20209T-2Y-S 0 20±25% 0.40 200 SBK20209T-5Y-S 0 50±25% 0.50 200 SBK20209T-22Y-S 0 220±25% 0.60 200 SBK20209T-30Y-S 0 300±25% 0.90 200 SBK20209T-40Y-S 0 400±25% 0.90 200 SBK20209T-50Y-S 0 500±25%.00 200 SBK20209T-60Y-S 0 600±25%.00 200 SBK20209T-2Y-S 50 00±25%.00 0 SBK2022T-52Y-S 30 500±25%.00 0
3 ELECTICAL CHAACTEISTICS PAT NO. Test Frequency Impedance DC esistance ate Current (MHz) (Ω) (Ω) Max. (ma) Max. SBY326T-90Y-S 0 9±25% 0.5 500 SBY326T-260Y-S 0 26±25% 0.5 500 SBY326T-320Y-S 0 32±25% 0.5 500 SBY326T-500Y-S 0 50±25% 0.20 400 SBY326T-600Y-S 0 60±25% 0.30 400 SBK326T-700Y-S 0 70±25% 0.30 400 SBK326T-900Y-S 0 90±25% 0.30 400 SBK326T-2Y-S 0 20±25% 0.40 400 SBK326T-5Y-S 0 50±25% 0.50 200 SBK326T-20Y-S 0 200±25% 0.50 200 SBK326T-40Y-S 0 400±25% 0.50 200 SBK326T-50Y-S 0 500±25% 0.50 200 SBK326T-60Y-S 0 600±25% 0.50 200 SBK326T-2Y-S 50 00±25%.00 0 SBK326T-22Y-S 50 200±25%.00 0 SBK326T-202Y-S 30 2000±25%.50 0 SBY3266T-250Y-S 0 25±25% 0.50 200 SBY3266T-600Y-S 0 60±25% 0.50 200 SBK3266T-700Y-S 0 70±25% 0.50 200 SBY32253T-320Y-S 0 32±25% 0.30 400 SBY32253T-600Y-S 0 60±25% 0.30 400 SBY32253T-900Y-S 0 90±25% 0.30 400 SBK32253T-202Y-S 30 2000±25%.50 0 SBY4566T-330Y-S 0 33±25% 0.30 400 SBY4566T-600Y-S 0 60±25% 0.30 400 SBY4566T-800Y-S 0 80±25% 0.30 400 SBY4566T-Y-S 0 0±25% 0.40 300 SBK4566T-5Y-S 0 50±25% 0.50 200 SBK4566T-7Y-S 0 70±25% 0.50 200 SBY45325T-700Y-S 0 70±25% 0.40 300 SBY45325T-2Y-S 0 20±25% 0.40 300
4 ELECTICAL CHAACTEISTICS PAT NO. Test Frequency Impedance DC esistance ate Current (MHz) (Ω) (Ω) Max. (ma) Max. PBY60808T- -S 0 ±25 or 20% 0.05 5000 PBY60808T-250 -S 0 25±25 or 20% 0.030 4000 PBY20209T- -S 0 ±25 or 20% 0.0 6000 PBY20209T-320 -S 0 32±25 or 20% 0.025 4000 PBY20209T-600 -S 0 60±25 or 20% 0.025 4000 PBY20209T-800 -S 0 80±25 or 20% 0.030 4000 PBY326T-260 -S 0 26±20 or 20% 0.05 7000 PBY326T-320 -S 0 32±25 or 20% 0.05 6000 PBY326T-500 -S 0 50±25 or 20% 0.020 5000 PBY326T-700 -S 0 70±25 or 20% 0.020 5000 PBY326T-800 -S 0 80±20 or 20% 0.05 5000 PBY326T-900 -S 0 90±25 or 20% 0.030 4000 PBY4566T-600 -S 0 60±25 or 20% 0.020 6000 PBY4566T-700 -S 0 70±25 or 20% 0.025 6000 PBY4566T-800 -S 0 80±25 or 20% 0.025 5000 PBY45325T-700 -S 0 70±25 or 20% 0.030 7000 PBY45325T-2 -S 0 20±25 or 20% 0.030 4000 : Y (± 25%) M (±20%)
5 TAPE DIMENSIONS Dimensions : mm 4±0. 4±0. 2±0.05 K±0.05.75±0. W±0.2 F±0.05 EEL DIMENSIONS B±0. A±0. P±0. T±0.05 TYPE A B T W P F K B60808.4.75.5 8.0 4.0 3.5 0.2 B20209.54 2.32.5 8.0 4.0 3.5 0.2 B326.94 3.54.29 8.0 4.0 3.5 0.2 SB3266.94 3.64.90 8.0 4.0 3.5 0.2 SB32253 2.80 3.42.64 8.0 4.0 3.5 0.2 B4566.94 4.94.90 2.0 4.0 5.5 0.3 B45325 3.64 4.94.80 2.0 8.0 5.5 0.3 : S or P Dimensions : mm.0 D±0.5 2±0.5 3±0.5 B± 2±0.8 A±2 C± TYPE A B C D SB/PB 60808 78 60 2 SB/PB 20209 78 60 2 SB/PB 326 78 60 2 SB 3266 78 60 2 SB 32253 78 60 2 SB/PB 4566 78 60 4 2 SB/PB 45325 78 60 4 2 TAPE MATEIAL Carrier Tape : Polystyrene 60mm Min. Blank Part Cover Tape Chip Mounting Part Cover Type : Polyethyiene Blank 330mm Min. Leader PACKAGING QUANTITY TYPE BULK CHIP/EEL SB/PB 60808 4000 SB/PB 20209 4000 SB/PB 326 3000 SB 3266 2000 SB 32253 2500 SB/PB 4566 2000 SB/PB 45325 00 ECOMMENDED PATTEN Dimensions : mm Solder Land B A Inductor C TYPE A B C SB/PB 60808 0.8 2.4~3.4 0.6 SB/PB 20209.2 3.0~4.0.0 SB/PB 326 2.0 4.2~5.2.2 SB/PB 3266 2.0 4.2~5.2.2 SB 32253 2.0 5.5~6.5.8 SB 4566 3.0 5.5~6.5.2 SB/PB 45325 3.0 5.5~6.5 2.4
6 TYPICAL ELECTICAL CHAACTEISTIC Test Instruments: HP429A Impedance/Material Analyzer 000 00 PB SEIES 000 00 SB 3266 SEIES 0 0 0. 0 00 000 0. 0 00 000 000 SB 60808 SEIES 00 SB 32253 SEIES 00 0 0. 0 00 000 0 0. 0 00 000 000 00 SB 20209 SEIES 000 00 SB 4566 SEIES 0 0 0. 0 00 000 0. 0 00 000 00 SB 326 SEIES 00 SB 45325 SEIES 0 0 0. 0 00 000 PBY326T-800-S 0. PBY326T-500Y-S 0 00 000
7 TYPICAL ELECTICAL CHAACTEISTIC Test Instruments: HP429A Impedance/Material Analyzer 0 SBK60808T-300 Y-S 00 SBY20209T- Y-S 0. 0 00 0. 0 00 00 SBK60808T-22 Y-S 00 SBK20209T-800 Y-S 0 0 0. 0 00 0. 0 00 00 SBK60808T-60 Y-S 00 SBK20209T-5 Y-S 0 X L 0 X L 0. 0 00 0. 0 00
8 TYPICAL ELECTICAL CHAACTEISTIC Test Instruments: HP429A Impedance/Material Analyzer SBK20209T-60Y-S SBK326T-60Y-S 00 00 0 0 0. 0 00 0. 0 00 0 SBY326T-320Y-S 000 SBK326T-22Y-S 00 0 0. 0 00 0 00 00 SBK326T-2Y-S 000 SBK326T-202Y-S 0 00 0 0. 0 00 0 00
9 TYPICAL ELECTICAL CHAACTEISTIC 0 SBY32253T-320Y-S 00 Test Instruments: HP429A Impedance/Material Analyzer SBY4566T-600Y-S 0.0 0.0 0 00 0. 0 00 00 SBY32253T-600Y-S 00 SBY45325T-700Y-S 0 0 0. 0.0 0 00 0. 0 00 00 SBY32253T-900Y-S 00 SBY45325T-2Y-S 0 0 X L 0. 0 00 0. 0 00
SB, PB, CL SEIES ELIABILITY TEST NO ITEM TEST CONDITIONS EMAKS Thrmal Shock Temperature : -40 C + 85 C, Kept Stabilized Inductance value shall be within ± % of the initial value. (Temperature Cycle) For 30 Minutes Each Q-factor shall be within ± 30% of the initial value. Cycle : 0 Cycles Impedance shall be within ± 20% of the initial value. 2 Humidity esistance Humidity : 90% to 95% H DC value shall be within ± 20% of the initial value. Temperature : 40 ± 2 C NO -4 Measurement : After placing for 24 hours min. Testing Time : 00 ± 2 Hours NO 2-3 Applied current : ated current (maximum value) 3 High Temperature Temperature : 85 ± 2 C NO 5 Cycle : 5 cycles esistance Humidity : 20% Testing Time : 00 ± 2 Hours 4 Low Temperature Temperature : -40 ± 2 C Storage Life Test Time : 00 ± 2 Hours 5 Temperature and Step Temperature Humidity Time Humidity Cycle 25 ± 2 C 95 ~ 0% H 3 Hours 2 55 ± 2 C 95 ~ 96% H 9.5 Hours 3 25 ± 2 C 95 ~ 0% H 9.5 Hours 6 Vibration Frequency : Hz to 55 Hz Amplitude :.5mm Direction : X, Y, Time : 2 Hours Each 7 I eflow Soldering Solder : H63A (Eutectic Solder) Impedance shall be within ± 20% of the initial value. Solder Temperature : 230 ± 5 C DC value shall be within ± 20% of the initial value. Time : 6 Minutes Cycles : 8 Soldering Heat Preheat : 20 to 50 C, 60 Seconds The chip must have no cracks. esistance Solder : H63A (Eutectic Solder) More than 75% of the terminal electrode must be covered Solder Temperature : 260 ± 5 C with solder. Flux : osin Dip time : ± Seconds 9 Terminal Strength The terminal electrode and the ferrite must not be damaged by the forces applied on the test conditions. W Spec : 60808 series : 0.5Kg 20209 series : Kg Other series : 2 Kg Bending Strength The terminal electrode and the ferrite must not 0.5 Chip be damaged by the forces applied on the test conditions. Spec : 475325, 4566 : 8 Kg 3266, 326, 32253 : 6 Kg 20209, 60808 : 3 Kg Flexure Strength Test Board No mechanical damage shall be noticed even when the 20 board is bent 2 mm..0.6 2 A 40 45 45 0