IDB30E60. Fast Switching EmCon Diode. Product Summary V RRM 600 V I F 30 A V F 1.5 V T jmax 175 C

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Transcription:

Fast Switching EmCon Diode Feature 600 V EmCon technology Fast recovery Soft switching Low reverse recovery charge Low forward voltage 175 C operating temperature Easy paralleling Product Summary V RRM 600 V I F 30 A V F 1.5 V T jmax 175 C Type Package Ordering Code IDB30E60 PG-TO263-3 - Marking D30E60 Pin 1 PIN 2 PIN 3 NC C A Maximum Ratings, at T j = 25 C, unless otherwise specified Parameter Symbol Value Unit Repetitive peak peak reverse reverse voltage voltage V RRM V R R M 600 600 V V Continuous Continous forward current current I F A T C = =25 C 25 C I F 52.3 52.3 A T C = =90 C 90 C 34.9 34.9 Surge non repetitive forward current Surge non repetitive forward current I FSM I F S M 117 117 A T C = 25 C, t p = ms, sine halfwave T C =25 C, t p = ms, sine halfwave Maximum repetitive forward current Maximum repetitive forward current I FRM I F R M 81 81 A T C = 25 C, t p limited by t j,max, D = 0.5 T C =25 C, t p limited by T jmax, D=0.5 Power dissipation TPower C = 25 C dissipation P tot P t o t 142.9 W T C = =25 C 90 C 142.9 80.9 Operating T C =90 C junction temperature T j -40 +175 80.9 Storage Operating temperature and storage temperature T j, T s t g stg -55...+175-55...+150 C C Soldering temperature T S T 260 C 1.6mm reflow soldering, (0.063 in.) MSL1 from case for s S 260 Rev.2.4 Page 1

Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - case R thjc - - 1.05 K/W Thermal resistance, junction - ambient, leaded R thja - - 62 SMD version, device on PCB: @ min. footprint R thja - - 62 @ 6 cm 2 cooling area 1) - 35 - Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Reverse leakage current I R µa V R =600V, T j =25 C - - 50 V R =600V, T j =150 C Forward voltage drop I F =, T j =25 C I F =, T j =150 C V F - - 2500 V - 1.5 2-1.5-1 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Rev.2.4 Page 2

Electrical Characteristics, at T j = 25 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Dynamic Characteristics Reverse recovery time t rr ns V R =400V, I F =, di F /dt=00a/µs, T j =25 C - 126 - V R =400V, I F =, di F /dt=00a/µs, T j =125 C V R =400V, I F =, di F /dt=00a/µs, T j =150 C Peak reverse current V R =400V, I F =, di F /dt=00a/µs, T j =25 C V R =400V, I F =, di F /dt=00a/µs, T j =125 C V R =400V, I F =, di F /dt=00a/µs, T j =150 C Reverse recovery charge V R =400V, I F =, di F /dt=00a/µs, T j =25 C V R =400V, I F =, di F /dt=00a/µs, T j =125 C V R =400V, I F =, di F /dt=00a/µs, T j =150 C Reverse recovery softness factor V R =400V, I F =, di F /dt=00a/µs, T j =25 C V R =400V, I F =, di F /dt=00a/µs, T j =125 C V R =400V, I F =, di F /dt=00a/µs, T j =150 C - - 171 178 - - A - 19 - - 22 - - 24 - nc - 10 - - 1950 - - 2150 - S - 4 - - 4.6 - - 4.8 - Rev.2.4 Page 3

1 Power dissipation P tot = f (T C ) parameter: T j 175 C W 150 2 Diode forward current I F = f(t C ) parameter: T j 175 C 55 A 120 45 1 40 Ptot 0 90 80 IF 35 30 70 60 50 25 20 40 15 30 20 5 0 25 50 75 0 125 C 175 0 25 50 75 0 125 C 175 T C T C 3 Typ. diode forward current I F = f (V F ) 4 Typ. diode forward voltage V F = f (T j ) 90 2 A V IF 70 60 50 40-55 C 25 C 0 C 150 C VF 1.8 1.7 1.6 1.5 1.4 30 20 1.3 1.2 1.1 0 0 0.5 1 1.5 V 2.5 V F Rev.2.4 Page 4 1-60 -20 20 60 0 C 160 T j

5 Typ. reverse recovery time t rr = f (di F /dt) parameter: V R = 400V, T j = 125 C 500 ns 6 Typ. reverse recovery charge Q rr =f(di F /dt) parameter: V R = 400V, T j = 125 C 2600 nc 400 2200 trr 350 Qrr 2000 300 1800 250 1600 200 150 1400 1200 0 200 300 400 500 600 700 800 A/µs 00 di F /dt 7 Typ. reverse recovery current I rr = f (di F /dt) parameter: V R = 400V, T j = 125 C 26 A 00 200 300 400 500 600 700 800 A/µs 00 di F /dt 8 Typ. reverse recovery softness factor S = f(di F /dt) parameter: V R = 400V, T j = 125 C 12 22 Irr 20 18 16 14 S 9 8 7 12 6 5 8 4 6 200 300 400 500 600 700 800 A/µs 00 di F /dt Rev.2.4 Page 5 3 200 300 400 500 600 700 800 A/µs 00 di F /dt

9 Max. transient thermal impedance Z thjc = f (t p ) parameter : D = t p /T 1 K/W IDP30E60 0 ZthJC -1-2 -3 D = 0.50 0.20 0. 0.05 0.02 single pulse 0.01-4 -7-6 -5-4 -3-2 s 0 t p Rev.2.4 Page 6

Rev.2.4 Page 7 2007-09-01

Published by Infineon Technologies AG, 81726 München 2009 Infineon Technologies AG All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev.2.4 Page 8