HD74HC4511. BCD-to-Seven Segment Latch/Decoder/Driver. Description. Features

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Transcription:

HD74HC4511 BCD-to-Seven Segment Latch/Decoder/Driver Description The HD74HC4511 provides the functions of a 4-bit storage latch, a BCD-to-seven-segment decoder, and an output driver. Lamp test (LT), blanking (BI), and latch enable (LE) inputs are used to test the display, to turn off or pulse-modulate the brightness of the display, and to store a BCD code, respectively. Features High Speed Operation: t pd (A, B, C, D to a g) = 31 ns typ (C L = 50 pf) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: V CC = 2 to 6 V Low Input Current: 1 µa max Low Quiescent Supply Current: I CC (static) = 4 µa max (Ta = 25 C)

HD74HC4511 Function Table Inputs Outputs LE BI LT D C B A a b c d e f g Display X X L X X X X H H H H H H H 8 X L H X X X X L L L L L L L Blank L H H L L L L H H H H H H H 0 L H H L L L H L H H L L L L 1 L H H L L H L H H L H H L H 2 L H H L L H H H H H H L L H 3 L H H L H L L L H H L L H H 4 L H H L H L H H L H H L H H 5 L H H L H H L L L H H H H H 6 L H H L H H H H H H L L L L 7 L H H H L L L H H H H H H H 8 L H H H L L H H H H L L H H 9 L H H H L H L L L L L L L L Blank L H H H L H H L L L L L L L Blank L H H H H L L L L L L L L L Blank L H H H H L H L L L L L L L Blank L H H H H H L L L L L L L L Blank L H H H H H H L L L L L L L Blank H H H X X X X * 1 * 1 Note: 1. Depends upon the BCD code previously applied when LE = O a f g b e c d 2

HD74HC4511 3 Pin Arrangement 1 2 3 4 5 6 7 8 B C LT BI LE D A GND C LT BI LE D A V CC f g a b c d e f g a b c d 16 15 14 13 12 11 10 9 e B (Top view)

HD74HC4511 DC Characteristics Ta = 40 to Ta = 25 C +85 C Item Symbol V CC (V) Min Typ Max Min Max Unit Test Conditions Input voltage V IH 2.0 1.5 1.5 V 4.5 3.15 3.15 6.0 4.2 4.2 V IL 2.0 0.5 0.5 V 4.5 1.35 1.35 6.0 1.8 1.8 Output voltage V OH 2.0 1.9 2.0 1.9 V Vin = V IH or V IL I OH = 20 µa 4.5 4.4 4.5 4.4 6.0 5.9 6.0 5.9 4.5 4.18 4.13 I OH = 4 ma 6.0 5.68 5.63 I OH = 5.2 ma V OL 2.0 0.0 0.1 0.1 V Vin = V IH or V IL I OL = 20 µa 4.5 0.0 0.1 0.1 6.0 0.0 0.1 0.1 4.5 0.26 0.33 I OL = 4 ma 6.0 0.26 0.33 I OL = 5.2 ma Input current Iin 6.0 ±0.1 ±1.0 µa Vin = V CC or GND Quiescent supply current I CC 6.0 4.0 40 µa Vin = V CC or GND, Iout = 0 µa 4

HD74HC4511 AC Characteristics (C L = 50 pf, Input t r = t f = 6 ns) Ta = 40 to Ta = 25 C +85 C Item Symbol V CC (V) Min Typ Max Min Max Unit Test Conditions Propagation delay t PLH 2.0 400 500 ns A, B, C or D to a g time t PHL 4.5 31 80 100 6.0 68 86 t PLH 2.0 250 315 BI to a g t PHL 4.5 25 50 63 6.0 43 54 t PLH 2.0 150 190 LT to a g t PHL 4.5 17 30 38 6.0 26 33 t PLH 2.0 400 500 LE to a g t PHL 4.5 35 80 100 6.0 68 86 Pulse width t w 2.0 80 100 ns 4.5 16 6 20 6.0 14 17 Setup time t su 2.0 100 125 ns 4.5 20 4 25 6.0 17 21 Hold time t h 2.0 5 5 ns 4.5 5 0 5 6.0 5 5 Output rise time t TLH 2.0 60 75 ns 4.5 4 12 15 6.0 10 13 Output fall time t THL 2.0 75 95 ns 4.5 5 15 19 6.0 13 16 Input capacitance Cin 5 10 10 pf 5

19.20 20.00 Max 16 9 Unit: mm 6.30 7.40 Max 1 1.3 8 1.11 Max 2.54 ± 0.25 0.48 ± 0.10 0.51 Min 2.54 Min 5.06 Max 7.62 0.25 + 0.13 0.05 0 15 Hitachi Code JEDEC EIAJ Weight (reference value) DP-16 Conforms Conforms 1.07 g

Unit: mm 10.06 10.5 Max 16 9 5.5 1 8 0.80 Max 1.27 *0.42 ± 0.08 0.40 ± 0.06 0.10 ± 0.10 2.20 Max 0.15 *0.22 ± 0.05 0.20 ± 0.04 + 0.20 7.80 0.30 1.15 0.70 ± 0.20 0 8 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DA Conforms 0.24 g

Unit: mm 9.9 10.3 Max 16 9 1 8 3.95 1.27 0.635 Max + 0.11 0.14 0.04 1.75 Max *0.22 ± 0.03 0.20 ± 0.03 + 0.10 6.10 0.30 1.08 0 8 *0.42 ± 0.08 0.40 ± 0.06 0.15 0.25 M + 0.67 0.60 0.20 *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) FP-16DN Conforms Conforms 0.15 g

Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi s or any third party s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/e/product/sicd_frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Stra e 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.

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