Low F SMD Schottky Barrier Diode FEATURES - Metal-on-silicon schottky barrier - Surface device type mounting - Moisture sensitivity level - Matte Tin(Sn) lead finish with Nickel(Ni) underplate - Packing code with suffix "G" means green compound (halogen-free) MECHANICAL DATA - Case: SOT- 23, molded plastic - Terminal: Matte tin plated, lead free, solderable per MIL-STD-22, Method 28 guaranteed - High temperature soldering guaranteed: 26 o C/s - Weight:.8g (approximately) SOT-23 MAXIMUM RATINGS AND ELECTRICAL CHARACTERSTICS (T A =25 unless otherwise noted) PARAMETER SYMBOL ALUE UNIT Power Dissipation P D mw Repetitive Peak Reverse oltage RRM 4 Reverse oltage R 4 Repetitive Peak Forward Current I FRM ma Mean Forward Current I O ma Non-Repetitive Peak Forward Surge Current (Note ) I FSM.6 A Thermal Resistance (Junction to Ambient) (Note 2) R θja 357 o C/W Junction and Storage Temperature Range T J, T STG -65 to +25 o C PARAMETER SYMBOL MIN MAX UNIT Reverse Breakdown oltage I R =μa (BR) 4 - I F =ma Forward oltage I F =ma I F =4mA Junction Capacitance R =, f=.mhz C J - 5. pf Reverse Recovery Time I F =I R =ma, R L =Ω, I RR =ma t rr - 5. ns Notes :. Test Condition : 8.3ms single half sine-wave superimposed on rated load Notes : 2. alid provided that electrodes are kept at ambient temperature I R -.38 -.5 -. Reverse Leakage Current R =3 -.2 F μa Document Number: DS_S46 ersion: F4
RATINGS AND CHARACTERISTICS CURES (TA=25 unless otherwise noted) Fig. Power Derating Curve Fig. 2 Maximum Non-Repetitve Peak Forward Surge Current Per Leg P D - Power Dissipation (mw) 25 5 75 25 Peak Forward Surge Current (ma) 6 3 8.3 ms single half sine wave T A - Ambient Temperature ( o C) Numbers of Cycles at 6 Hz Fig. 3 Typical Forward Characteristics Fig. 4 Typical Reverse Characteristics T A =25 C Instantaneous Forward Current (ma).... T A = -4 C T A = C T A = 25 C T A =7 C T A = 25 C..2.4.6.8..2 I R - Instantaneous Reverse Current (ma). T A =7 C T A =25 C T A = C T A = -4 C 2 3 4 F, Instantaneous Forward oltage (m) R - Reverse oltage () Fig. 5 Typical Total Capacitance S. Reverse oltage Fig. 6 Typical Transient Thermal Junction Capacitance (pf) 4 2 f=.mhz 5 5 2 Transient Thermal Impedance ( o C/W)...... Reverse oltage () Pulse Duration (sec) Document Number: DS_S46 ersion: F4
ORDERING INFORMATION (Note ) PACKING CODE PACKAGE PACKING MARKING BAS4 BAS4-4 BAS4-5 BAS4-6 -xx G SOT-23 3K / 7" Reel Note : Part No. Suffix -xx would be used for special requirement 43 44 45 46 EXAMPLE PREFERRED P/N DESCRIPTION BAS4 BAS4 Multiple manufacture BAS4 G BAS4 G Multiple manufacture Green compound BAS4-D G BAS4 -D G Define manufacture Green compound Document Number: DS_S46 ersion: F4
PACKAGE OUTLINE DIMENSIONS DIM. Unit(mm) Unit(inch) Min Max Min Max A 2.7 3..6.22 B..5.43.59 C.3.5.2.2 D.78 2.4.7.8 E 2. 2.64.83.4 F.89.3.35.5 G H.55 REF. REF.22 REF.4 REF SUGGEST PAD LAYOUT DIM. Z X Y C E Unit(mm) Typ. 2.8.7.9.9. Unit(inch) Typ...3.4.7.4 PIN CONFIGURATION Document Number: DS_S46 ersion: F4
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