Single 2-Input AND Gate The is an advanced high speed CMOS 2 input AND gate fabricated with silicon gate CMOS technology. The internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. The input structure provides protection when voltages up to 7.0 are applied, regardless of the supply voltage. This allows the to be used to interface.0 circuits to circuits. Features igh Speed: t PD = 3. ns (Typ) at CC =.0 ow Power Dissipation: I CC =.0 A (Max) at T A = 2 C Power Down Protection Provided on Inputs Balanced Propagation Delays Pin and Function Compatible with Other Standard ogic Families Chip Complexity: FETs = 62 These Devices are Pb Free and are RoS Compliant N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable IN B CC SC 88A / SOT 33 / SC 70 DF SUFFIX CASE 49A TSOP / SOT 23 / SC 9 DT SUFFIX CASE 483 2 M MARKING DIAGRAMS = Device Code = Date Code* = Pb Free Package M 2 M 2 M (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. IN A 2 PIN ASSIGNMENT IN B 2 IN A GND 3 4 OUT Y 3 GND 4 OUT Y CC Figure. Pinout (Top iew) FUNCTION TABE Inputs Output A B Y IN A & OUT Y IN B Figure 2. ogic Symbol ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, C, 203 February, 203 Rev. 20 Publication Order Number: /D
MAXIMUM RATINGS Symbol Parameter alue Unit CC DC Supply oltage 0. to 7.0 IN DC Input oltage 0. to +7.0 OUT DC Output oltage 0. to CC 0. I IK DC Input Diode Current 20 ma I OK DC Output Diode Current 20 ma I OUT DC Output Sink Current 2. ma I CC DC Supply Current per Supply Pin 2 ma T STG Storage Temperature Range 6 to 0 C T ead Temperature, mm from Case for 0 Seconds 260 C T J Junction Temperature Under Bias 0 C JA Thermal Resistance SC70 /SC 88A (Note ) TSOP P D Power Dissipation in Still Air at 8 C SC70 /SC 88A TSOP 30 230 0 200 C/W mw MS Moisture Sensitivity evel F R Flammability Rating Oxygen Index: 28 to 34 U 94 0 @ 0.2 in ESD ESD Withstand oltage uman Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) 2000 200 N/A I ATCUP atchup Performance Above CC and Below GND at 2 C (Note ) 00 ma Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Measured with minimum pad spacing on an FR4 board, using 0 mm by inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22 A4 A. 3. Tested to EIA/JESD22 A A. 4. Tested to JESD22 C0 A.. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit CC DC Supply oltage. IN DC Input oltage 0.0. OUT DC Output oltage 0.0 CC T A Operating Temperature Range +2 C t r, t f Input Rise and Fall Time CC = 3.3 ± 0.3 CC =.0 ± 0. 0 0 00 20 ns/ Device Junction Temperature versus Time to 0.% Bond Failures Junction Temperature C Time, ours Time, Years 80,032,200 7.8 90 49,300 47.9 00 78,700 20.4 0 79,600 9.4 20 37,000 4.2 30 7,800 40 8,900.0 NORMAIZED FAIURE RATE FAIURE RATE OF PASTIC = CERAMIC UNTI INTERMETAICS OCCUR TJ = 30 C TJ = 20 C TJ = 0 C TJ = 00 C TJ = 90 C TJ = 80 C 0 00 000 TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature 2
DC EECTRICA CARACTERISTICS Symbol Parameter Test Conditions CC () T A = 2 C T A 8 C C to 2 C Min Typ Max Min Max Min Max Unit I Minimum igh evel Input oltage 4... 2. 3. 3.8. 2. 3. 3.8. 2. 3. 3.8 I Maximum ow evel Input oltage 4.. 0. 0.9.3.6 0. 0.9.3.6 0. 0.9.3.6 O Minimum igh evel Output oltage IN = I or I IN = I or I I O = 0 A 4..9 2.9 4.4 4..9 2.9 4.4.9 2.9 4.4 IN = I or I I O = 4 ma I O = 8 ma 4. 2.8 3.94 2.48 3.80 2.34 3.66 O Maximum ow evel Output oltage IN = I or I IN = I or I I O = 0 A 4. 0.0 0.0 0.0 0. 0. 0. 0. 0. 0. 0. 0. 0. IN = I or I I O = 4 ma I O = 8 ma 4. 0.36 0.36 0.44 0.44 0.2 0.2 I IN I CC Maximum Input eakage Current Maximum Quiescent Supply Current IN =. or GND 0 to. 0..0.0 A IN = CC or GND..0 0 40 A AC EECTRICA CARACTERISTICS Input t r = t f = ns ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ T ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ A = 2 C T A 8 C T A 2 C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Symbol Parameter Test Conditions Min Typ Max Min Max Min Max ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Unit t ÎÎÎÎ P, Maximum Propagation Delay, C = 0 pfîîîî 4..9 t P ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ CC = 3.3 ± 0.3 C = ÎÎÎ 8.8 2.3 ÎÎÎ ÎÎÎ 0. 2. ns 4.0ÎÎÎÎÎÎ 6. ÎÎ ÎÎÎÎÎÎÎÎÎÎ Input A or B to Y ÎÎÎÎÎÎÎÎÎ ÎÎ CC =.0 ± 0. C ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ = ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ C = 0 pfîîîî 3. 4.2 ÎÎÎ.9 7.9ÎÎÎÎÎ 7.0 9.0 9.0ÎÎÎÎÎÎ.0 ÎÎ ÎÎÎÎ C IN ÎÎÎÎÎÎÎ Maximum Input Ca- ÎÎÎÎÎÎÎÎÎÎÎÎ.ÎÎÎ 0ÎÎÎÎÎ ÎÎÎÎÎÎ 0 ÎÎ pf pacitance Typical @ 2 C, CC =.0 C PD Power Dissipation Capacitance (Note 6) pf 6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD CC f in + I CC. C PD is used to determine the no load dynamic power consumption; P D = C PD 2 CC f in + I CC CC. 3
CC Input A or B 0% 0% CC GND INPUT OUTPUT C * t P t P O Output Y 0% CC O *Includes all probe and jig capacitance. A Mz square input wave is recommended for propagation delay tests. Figure 4. Switching Waveforms Figure. Test Circuit DEICE ORDERING INFORMATION DFTG Device Package Shipping NCG08DFTG* DFT2G NCG08DFT2G* DTTG SC70 /SC 88A/SOT 33 (Pb Free) SOT23 /TSOP /SC9 (Pb Free) 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable. 4
PACKAGE DIMENSIONS SC 88A (SC 70 /SOT 33) CASE 49A 02 ISSUE K S A G 4 B 2 3 D P 0.2 (0.008) M B M N NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.M, 982. 2. CONTROING DIMENSION: INC. 3. 49A 0 OBSOETE. NEW STANDARD 49A 02. 4. DIMENSIONS A AND B DO NOT INCUDE MOD FAS, PROTRUSIONS, OR GATE BURRS. INCES MIIMETERS DIM MIN MAX MIN MAX A 0.07 0.087.80 2.20 B 0.04 0.03..3 C 0.03 0.043 0.80.0 D 0.004 0.02 0.0 0.30 G 0.026 BSC 0.6 BSC --- 0.004 --- 0.0 J 0.004 0.00 0.0 0.2 K 0.004 0.02 0.0 0.30 N 0.008 REF 0.20 REF S 0.079 0.087 0 2.20 C J K
PACKAGE DIMENSIONS TSOP CASE 483 02 ISSUE 2X 2X NOTE 0.0 T 0.20 T 0.0 4 2 3 G A B C D X 0.20 C A B T S SEATING PANE J K DETAI Z M DETAI Z SODERING FOOTPRINT* NOTES:. DIMENSIONING AND TOERANCING PER ASME Y4.M, 994. 2. CONTROING DIMENSION: MIIMETERS. 3. MAXIMUM EAD TICKNESS INCUDES EAD FINIS TICKNESS. MINIMUM EAD TICKNESS IS TE MINIMUM TICKNESS OF BASE MATERIA. 4. DIMENSIONS A AND B DO NOT INCUDE MOD FAS, PROTRUSIONS, OR GATE BURRS.. OPTIONA CONSTRUCTION: AN ADDITIONA TRIMMED EAD IS AOWED IN TIS OCATION. TRIMMED EAD NOT TO EXTEND MORE TAN 0.2 FROM BODY. MIIMETERS DIM MIN MAX A 0 BSC B.0 BSC C 0.90.0 D 0.2 0.0 G 0.9 BSC 0.0 0.0 J 0.0 0.26 K 0.20 0.60.2. M 0 0 S 0 0.9 0.037.9 0.074 2.4 0.094.0 0.039 0.7 0.028 SCAE 0: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCIC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent Marking.pdf. SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 63, Denver, Colorado 8027 USA Phone: 303 67 27 or 800 344 3860 Toll Free USA/Canada Fax: 303 67 276 or 800 344 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800 282 98 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 42 33 790 290 Japan Customer Focus Center Phone: 8 3 87 00 6 ON Semiconductor Website: www.onsemi.com Order iterature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative /D