IRGPC50F Fast Speed IGBT

Similar documents
IGBT Designer s Manual

IRGPC40UD2 UltraFast CoPack IGBT

IRGB4055PbF IRGS4055PbF

=25 C Avalanche Energy, single pulse 65 I C. C Soldering Temperature, for 10 seconds 300, (0.063 in. (1.6mm) from case)

IRGB30B60KPbF IRGS30B60KPbF IRGSL30B60KPbF

n-channel Solar Inverter Induction Heating G C E Gate Collector Emitter

IRGB4056DPbF. n-channel Lead Free Package INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE

IRGP30B60KD-EP V CES = 600V I C = 30A, T C =100 C. t sc > 10µs, T J =150 C. V CE(on) typ. = 1.95V. Absolute Maximum Ratings. Thermal Resistance

IRGB30B60K IRGS30B60K IRGSL30B60K

Absolute Maximum Ratings Parameter Max. Units

IRGPS40B120UP INSULATED GATE BIPOLAR TRANSISTOR UltraFast IGBT

Parameter Max. Units V CES Collector-to-Emitter Breakdown Voltage 600 I T C = 25 C Continuous Collector Current

IRGIB15B60KD1P INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. n-channel. Absolute Maximum Ratings

IRGS4062DPbF IRGSL4062DPbF

V CE(sat) IGBT IXSH/IXSM 40 N V 75 A 2.5 V High Speed IGBT IXSH/IXSM 40 N60A 600 V 75 A 3.0 V

250 P C = 25 C Power Dissipation 160 P C = 100 C Power Dissipation Linear Derating Factor

IRGP20B120UD-E. UltraFast CoPack IGBT INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. Features V CES = 1200V

IRGB8B60KPbF IRGS8B60KPbF IRGSL8B60KPbF C

IRGP4263PbF IRGP4263-EPbF

IRGP30B120KD-E. Motor Control Co-Pack IGBT INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. Features V CES = 1200V

IRGB4062DPbF IRGP4062DPbF

IRG7PH35UDPbF IRG7PH35UD-EP

IRGP20B60PDPbF SMPS IGBT. n-channel WARP2 SERIES IGBT WITH ULTRAFAST SOFT RECOVERY DIODE

n-channel Standard Pack Orderable part number Form Quantity IRG7PH35UD1MPbF TO-247AD Tube 25 IRG7PH35UD1MPbF

SMPS IGBT. n-channel. Thermal Resistance Parameter Min. Typ. Max. Units

IRG7PH42UDPbF IRG7PH42UD-EP

CID Insulated Gate Bipolar Transistor with Silicon Carbide Schottky Diode Zero Recovery Rectifier

IRGB4B60K IRGS4B60K IRGSL4B60K

IRG7PA19UPbF. Key Parameters V CE min 360 V V CE(ON) I C = 30A 1.49 V I RP T C = 25 C 300 A T J max 150 C. Features

IRGP50B60PDPbF. n-channel SMPS IGBT WARP2 SERIES IGBT WITH ULTRAFAST SOFT RECOVERY DIODE

IRGR3B60KD2PbF INSULATED GATE BIPOLAR TRANSISTOR WITH ULTRAFAST SOFT RECOVERY DIODE. n-channel. Absolute Maximum Ratings Parameter Max.

STARPOWER IGBT GD40PIK120C5S. General Description. Features. Typical Applications. Equivalent Circuit Schematic SEMICONDUCTOR

± 20 Transient Gate-to-Emitter Voltage

225 P C = 25 C Power Dissipation 40 P C = 100 C Power Dissipation Linear Derating Factor

V (4TYP) U (5TYP) L 0.69± ±0.25 M N P Q R S M6 Metric M6 T 0.63 Min Min.

225 P C = 25 C Power Dissipation 160 P C = 100 C Power Dissipation Linear Derating Factor

IRGB10B60KDPbF IRGS10B60KDPbF IRGSL10B60KDPbF

IRGP4063DPbF. n-channel

MMIX4B22N300 V CES. = 3000V = 22A V CE(sat) 2.7V I C90

T C MEASURED POINT G1 E1 E2 G2 W - (4 PLACES) G2 E2 E1 G1

50MT060ULS V CES = 600V I C = 100A, T C = 25 C. I27123 rev. C 02/03. Features. Benefits. Absolute Maximum Ratings Parameters Max Units.

C N V (4TYP) U (5TYP) Dimensions Inches Millimeters L 0.69± ±0.25 M N P Q

AUTOMOTIVE GRADE. Standard Pack

IXBK55N300 IXBX55N300

20MT120UF "FULL-BRIDGE" IGBT MTP. UltraFast NPT IGBT V CES = 1200V I C = 40A T C = 25 C. 5/ I27124 rev. D 02/03. Features.

MMIX4B12N300 V CES = 3000V. = 11A V CE(sat) 3.2V. High Voltage, High Gain BIMOSFET TM Monolithic Bipolar MOS Transistor

IXGH 40N60B2D1 IXGT 40N60B2D1. Mounting torque (M3) 1.13/10 Nm/lb.in.

HiPerFAST TM IGBT with Diode C2-Class High Speed IGBTs

IXBK55N300 IXBX55N300

Obsolete Product(s) - Obsolete Product(s)

IRF5851. HEXFET Power MOSFET. Ultra Low On-Resistance Dual N and P Channel MOSFET Surface Mount Available in Tape & Reel Low Gate Charge.

AUTOMOTIVE GRADE. Standard Pack

IXBX50N360HV. = 3600V = 50A V CE(sat) 2.9V. BiMOSFET TM Monolithic Bipolar MOS Transistor High Voltage, High Frequency. Advance Technical Information

500V N-Channel MOSFET

W - DIA. (4 TYP.) AE AG AH AJ R

C2D10120A Silicon Carbide Schottky Diode Zero Recovery Rectifier

KDG25R12KE3. Symbol Description Value Units V CES Collector-Emitter Blocking Voltage 1200 V V GES Gate-Emitter Voltage ±20 V

TSP10N60M / TSF10N60M

IXBH42N170 IXBT42N170

V CE I C (T C =100 C) V CE(sat) (T C =25 C) 1.55V. Symbol V GE I C I CM I LM I F I FM. t SC P D T L. R θ JA

V CE I C (T C =100 C) V CE(sat) (T C =25 C) 1.55V. Symbol V GE I C. 20 A 10 Forward Current T C =100 C 5 I FM. t SC P D T L.

IXXH75N60C3D1 V CES = 600V I C110. XPT TM 600V IGBT GenX3 TM w/ Diode. = 75A V CE(sat) 2.3V t fi(typ) = 75ns

IRGB4B60KD1PbF IRGS4B60KD1PbF IRGSL4B60KD1PbF

C N V (4TYP) U (5TYP)

A I DM. W/ C V GS Gate-to-Source Voltage ± 20. Thermal Resistance Symbol Parameter Typ. Max. Units

Absolute Maximum Ratings

CM200EXS-24S. Chopper IGBT NX-Series Module 200 Amperes/1200 Volts

HiPerFAST TM IGBT with Diode

V DSS R DS(on) max I D. 100V GS = 10V 7.3A. 58 P A = 25 C Maximum Power Dissipation 2.5 Linear Derating Factor

IXGH60N60C3 = 600V I C110. GenX3 TM 600V IGBT V CES. = 60A V CE(sat) 2.5V t fi (typ) = 50ns. High Speed PT IGBT for kHz Switching TO-247 AD

GP1M003A080H/ GP1M003A080F GP1M003A080HH/ GP1M003A080FH

IGBT PIM Module, 15 A

N-CHANNEL MOSFET 1 D2 P-CHANNEL MOSFET. Top View SO-8

1200 V 600 A IGBT Module

DETAIL "A" #110 TAB (8 PLACES) X (4 PLACES) Y (3 PLACES) TH1 TH2 F O 1 F O 2 DETAIL "A"

ECONO2 PIM. Parameter Symbol Test Conditions Ratings Units. Parameter Symbol Min Typical Maximum Units

Absolute Maximum Ratings

Six-Pack XPT IGBT MIXA30W1200TED. V CES = 1200 V I C25 = 43 A V CE(sat) = 1.8 V. Part name (Marking on product) MIXA30W1200TED

HiPerFAST TM IGBT ISOPLUS247 TM

IXXH80N65B4H1 V CES. XPT TM 650V IGBT GenX4 TM w/ Sonic Diode = 650V I C110. = 80A V CE(sat) 2.1V = 52ns. t fi(typ)

SSF7NS65UF 650V N-Channel MOSFET

ECONO2 6PACK. Parameter Max. Units. Parameter Min Typical Maximum Units

10 23, 24 21, 22 19, , 14

N-Channel 30-V (D-S) MOSFET With Sense Terminal

IXYH10N170CV1 V CES = 1700V I C110. High Voltage XPT TM IGBT w/ Diode. = 10A V CE(sat) 3.8V = 70ns. t fi(typ) Advance Technical Information TO-247 AD

IXBT24N170 IXBH24N170

IRLML2030TRPbF HEXFET Power MOSFET

A I DM W/ C V GS. Thermal Resistance Symbol Parameter Typ. Max. Units

SGB02N120. Fast IGBT in NPT-technology. Power Semiconductors 1 Rev. 2_3 Jan 07

L K K K K P P1 N GU EU GV EV GW EW GU GVGW GB E LABEL H H

Converter - Brake - Inverter Module XPT IGBT

PD A N-CHANNEL MOSFET 1 D2 P-CHANNEL MOSFET. Top View SO-8. 1

A I DM. W/ C V GS Gate-to-Source Voltage ± 16. Thermal Resistance Symbol Parameter Typ. Max. Units

Converter - Brake - Inverter Module (CBI 1) Trench IGBT

IXYX40N450HV = 4500V = 40A 3.9V. High Voltage XPT TM IGBT. Preliminary Technical Information TO-247PLUS-HV. Symbol Test Conditions Maximum Ratings T C

D1 D2 D3 T1 T2 T3 5 D4 D5 D6 T4 T5 T6 7

IXBT12N300 IXBH12N300

AO4620 Complementary Enhancement Mode Field Effect Transistor

IXYX25N250CV1 IXYX25N250CV1HV

STARPOWER IGBT GD1000HFL170P2S. General Description. Features. Typical Applications SEMICONDUCTOR. Molding Type Module. 1700V/1000A 2 in one-package

Transcription:

INSULATED GATE BIPOLAR TRANSISTOR PD - 9.695A Fast Speed IGBT Features Switching-loss rating includes all "tail" losses Optimized for medium operating frequency ( to khz) See Fig. for urrent vs. Frequency curve G V ES = 6V V E(sat).7V E n-channel @V GE = 5V, I = 39A Description Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, highcurrent applications. Absolute Maximum Ratings TO-247A Parameter Max. Units V ES ollector-to-emitter Voltage 6 V I @ T = 25 ontinuous ollector urrent 7 I @ T = ontinuous ollector urrent 39 A I M Pulsed ollector urrent 28 I LM lamped Inductive Load urrent 28 V GE Gate-to-Emitter Voltage ± V E ARV Reverse Voltage Avalanche Energy mj P D @ T = 25 Maximum Power Dissipation W P D @ T = Maximum Power Dissipation 78 T J Operating Junction and -55 to +5 T STG Storage Temperature Range Soldering Temperature, for sec. 3 (.63 in. (.6mm) from case) Mounting torque, 6-32 or M3 screw. lbf in (.N m) Thermal Resistance Parameter Min. Typ. Max. Units R θj Junction-to-ase.64 R θs ase-to-sink, flat, greased surface.24 /W R θja Junction-to-Ambient, typical socket mount 4 Wt Weight 6 (.2) g (oz) -87 Revision

Electrical haracteristics @ T J = 25 (unless otherwise specified) Parameter Min. Typ. Max. Units onditions V (BR)ES ollector-to-emitter Breakdown Voltage 6 V V GE = V, I = 25µA V (BR)ES Emitter-to-ollector Breakdown Voltage V V GE = V, I =.A V (BR)ES/ T J Temp. oeff. of Breakdown Voltage.62 V/ V GE = V, I =.ma V E(on) ollector-to-emitter Saturation Voltage.4.7 I = 39A V GE = 5V 2. V I = 7A See Fig. 2, 5.7 I = 39A, T J = 5 V GE(th) Gate Threshold Voltage 3. 5.5 V E = V GE, I = 25µA V GE(th) / T J Temp. oeff. of Threshold Voltage -4 mv/ V E = V GE, I = 25µA g fe Forward Transconductance 2 3 S V E = V, I = 39A I ES Zero Gate Voltage ollector urrent 25 µa V GE = V, V E = 6V V GE = V, V E = 6V, T J = 5 I GES Gate-to-Emitter Leakage urrent ± na V GE = ±V Switching haracteristics @ T J = 25 (unless otherwise specified) Parameter Min. Typ. Max. Units onditions Q g Total Gate harge (turn-on) 84 I = 39A Q ge Gate - Emitter harge (turn-on) 25 n V = 4V See Fig. 8 Q gc Gate - ollector harge (turn-on) 5 67 V GE = 5V t d(on) Turn-On Delay Time 24 T J = 25 t r Rise Time 5 ns I = 39A, V = 48V t d(off) Turn-Off Delay Time 27 54 V GE = 5V, R G = 5.Ω t f Fall Time 2 36 Energy losses include "tail" E on Turn-On Switching Loss.7 E off Turn-Off Switching Loss 4.3 mj See Fig. 9,,, 4 E ts Total Switching Loss 6. 9. t d(on) Turn-On Delay Time 25 T J = 5, t r Rise Time 49 ns I = 39A, V = 48V t d(off) Turn-Off Delay Time 44 V GE = 5V, R G = 5.Ω t f Fall Time 4 Energy losses include "tail" E ts Total Switching Loss 9. mj See Fig., 4 L E Internal Emitter Inductance 3 nh Measured 5mm from package ies Input apacitance 3 V GE = V oes Output apacitance 34 pf V = 3V See Fig. 7 res Reverse Transfer apacitance 4 ƒ =.MHz Notes: Repetitive rating; V GE =V, pulse width limited by max. junction temperature. ( See fig. 3b ) V =8%(V ES ), V GE =V, L=µH, R G = 5.Ω, ( See fig. 3a ) Repetitive rating; pulse width limited by maximum junction temperature. Pulse width 8µs; duty factor.%. Pulse width 5.µs, single shot. -88

LO AD U RR ENT (A) 8 6 4 Square wave: 6% of ra ted voltage For both: Duty cycle: 5% T J = 25 T s in k = 9 Gate drive as specified Power D issipation = 4W Triangular wave: lam p v oltage: 8 % of rated Ideal diodes. f, F re quency (kh z) Fig. - Typical Load urrent vs. Frequency (For square wave, I=I RMS of fundamental; for triangular wave, I=I PK ) I, ollector-to-em itter urrent (A) T = 25 J T J = 5 V G E = 5 V 2 µs P U L S E W ID TH. V E, ollector-to-em itter V oltage (V) I, ollector-to-emitter urrent (A ) T J = 2 5 T J = 5 V = V 5µs P UL S E W IDTH 5 5 V G E, G ate -to-e m itter V olta ge (V ) Fig. 2 - Typical Output haracteristics Fig. 3 - Typical Transfer haracteristics -89 Revision

M aximum D ollector urrent (A ) 7 6 5 4 3 V G E = 5 V V E, ollecto r-to -Em itter Vo ltag e (V) 3. 2.5 2..5 V G E = 5 V 8 µs P UL S E W ID TH I = 78 A I = 39 A I = A 25 5 75 25 5 T, ase Tem perature ( ) Fig. 4 - Maximum ollector urrent vs. ase Temperature. -6-4 - 4 6 8 4 6 T, ase Tem perature ( ) Fig. 5 - ollector-to-emitter Voltage vs. ase Temperature T he rm al R espons e (Z thj ). D =.5.2.. 5. 2. S ING L E P U L S E (TH E R M A L R E S PO N S E) 2. P e ak T J = P D M x Z th J + T...... t, R ectangular Pulse Duration (sec) N otes :. D uty fa c tor D = t / t 2 PDM t t 2 Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-ase -9

, apacitance (pf ) 7 6 5 4 3 2 V GE = V, f = MHz ies = ge + gc, ce SHORTED res = gc oes = ce + gc ies oes res V G E, Gate-to-Em itter Voltage (V ) 6 2 8 4 V E = 4 8 V I = 3 9A V E, ollector-to-em itter V oltage (V) Fig. 7 - Typical apacitance vs. ollector-to-emitter Voltage 3 6 9 2 Q, Total G ate harge (n ) g Fig. 8 - Typical Gate harge vs. Gate-to-Emitter Voltage Total Switching Losses (m J) 7.5 7. 6.5 6. V = 4 8 V V G E = 5 V T = 25 I = 3 9A To ta l S w itc hing Lo sse s (m J) R G = 2. Ω V GE = 5V V = 48 V I = 7 8A I = 39 A I = 2 A 5.5 3 4 5 R G, Gate Resistance ( Ω ) Fig. 9 - Typical Switching Losses vs. Gate Resistance W -6-4 - 4 6 8 4 6 T, ase Temperature ( ) Fig. - Typical Switching Losses vs. ase Temperature -9

Total Sw itching Losses (m J ) 25 5 5 R G = 2. Ω T = 5 V = 48 V V G E = 5 V I, o lle c to r-to -E m itte r u rre n t (A ) V G EE= V T = 2 5 J S A FE O P E RA TIN G A RE A 4 6 8 I, ollecto r-to-e m itter urrent (A ) Fig. - Typical Switching Losses vs. ollector-to-emitter urrent V, o lle cto r-to-e m itte r V olta g e (V ) E Fig. 2 - Turn-Off SOA Refer to Section D for the following: Appendix : Section D- page D-5 Fig. 3a - lamped Inductive Load Test ircuit Fig. 3b - Pulsed ollector urrent Test ircuit Fig. 4a - Switching Loss Test ircuit Fig. 4b - Switching Loss Waveform Package Outline 3 - JEDE Outline TO-247A (TO-3P) Section D - page D-3-92

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/