RoHS Pb WIP212P L Series Engineering 1. Scope Feature High saturation current realized by material properties and structure design Low DC resistance to achieve high conversion efficiency and lower temperature rising Low Profile: 2. mm 2. mm 1.2 mm. Magnetically shielded structure to accomplish high resolution in EMC protection. Halogen free, Lead Free, RoHS Compliance. Applications WIP212P L series is generic applied in portable DC to DC converter line. Smart phone, PAD DC/DC converter Thin-type power supply module, 2. Explanation of Part Number W I P 2 2 1 2 P 2 R 2 M L 1 2 3 4 1 : Series Name: Wire-wound type power inductor 2 : Size Code: The first two digitals: length(mm), The last two digitals: width(mm) 3 : Thickness in mm 4:Material code: Iron powder :Initial inductance value: 2R2 = 2.2 μh 6:Model code, Tolerance of ±%. 7:Electrode type. 6 7 TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 1 of
3. Construction & Dimensions 3.1. End termination: Ni/Sn 3.2. Construction & Dimension : L W T E [mm] [mm] [mm] [mm] 2.±.2 2.±.2 1.2 max..6±.2 3.3. Recommend Land Pattern Dimensions : A A C [mm] [mm] [mm] 2. 1.2 2.8. C 4. General specifications 4.1. Temperature s Operating Temperature range : - to + 12 Storage Temperature range : - to + 12 * The detail operating temperature describing can refer to.1 (7). TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 2 of
. Performance Characteristics.1. s Li [μh] RDC [mω] Isat [A] Irms [A] INPAQ Initial inductance DC Resistance Saturation Current Heat Rating Current Part Number @1mA Typical Maximum Typical Maximum Typical Maximum WIP212P-R47ML.47 21 2.3 4.77 4. 4. WIP212P-R68ML.68 29 3 4.1 3.69 3.7 3.33 WIP212P-1RML 1. 41 49 3.4 3.6 3.4 3.6 WIP212P-1RML 1. 64 77 3.2 2.88 2. 2.2 WIP212P-2R2ML 2.2 88 4 3 2. 2.1 1.89 WIP212P-4R7ML 4.7 196 23 1.9 1.8 1. 1. Note 1: Customized design is available, please contact us. Nore 2: All test referenced to 26 ambient Note 3: tolerance +/- % Note 4: is measured with Agilent LCR meter 428A. Test frequency at 1MHz. Note : DC resistance is measured with HIOKI micro-ohm meter RM342-1. Note 6: Isat means that DC current will cause a % inductance reduction form initial value. Note 7: Irms means that DC current will cause coil temp. rising to whichever is smaller. TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 3 of
.2. Current Characteristic...4..3..2..1.. WIP212P-R47ML. 1 1. 2 2. 3 3. 4 4....6....4..3..2. WIP212P-R68ML. 1 1. 2 2. 3 3. 4 4. DC ias [A] DC ias [A] 1. 1..9.9.8.8.7..6.. WIP212P-1RML 6 4 3 2 1. 1 1. 2 2. 3 3. 4 4. DC ias [A] 1.8 1. 1. 1. 1. 1. 1. 1. 1..9.8. WIP212P-1RML 6 4 3 2 1. 1 1. 2 2. 3 3. DC ias [A] 2. 2. 2. 1.8 1. 1. 1. 1. WIP212P-2R2ML. 1 1. 2 2. 3 6 4 3 2 1. 4. 4. 3. 3. 2. 2. WIP212P-4R7ML.2..7 1 1.2 1. 1.7 2 6 4 3 2 1 DC ias [A] DC ias [A] TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 4 of
6. Reliability and Test Condition Test item Test condition Criteria Resistance to Solder Heat Adhesive Test Temperature Cycle Dry Heat Test Humidity Test 1. Solder temperature : 2 ± 2. Flux : Rosin 3. DIP time : ± 1 sec 1. Reflow temperature : 24 It shall be Soldered on the substrate applying direction parallel to the substrate 2. Apply force(f) : N 3. Test time : sec 1. Temperature:- ~ 12 For minutes each 2. Cycle: cycles 3. Measurement: At ambient temperature 24 hours after test completion 1. Temperature: 8 ± 2 2. Testing time: hrs 3. Applied current: Full rated current 4. Measurement: At ambient temperature 24 hours after test completion 1. Temperature: ± 2 2. Humidity: 9-9 % RH 3. Applied current: Full rated current 4. Testing time: hrs. Measurement: At ambient temperature 24 hours after test completion 1. More than 9 % of terminal electrode should be covered with new solder 2. No mechanical damage 3. value should be within ± % of the initial value 1. No mechanical damage 2. Soldering the products on PC after the pulling test force > N 1. No mechanical damage 2. should be within ±% of the initial value 1. No mechanical damage 2. should be within ± % of the initial value 1. No mechanical damage 2. should be within ±% of the initial value TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 1 of
7. Taping Package and Label Marking 7.1. Carrier tape dimensions 7.2. Taping reel dimensions PART SIZE (EIA SIZE) 2 (8) Qty.(pcs) 3, OX reels / inner box TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 2 of
7.3. Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 7.4. Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. 7.. Quantity of products in the taping package (1) Standard quantity:pcs/reel (2) Shipping quantity is a multiple of standard quantity. 8. Precautions for Handling 8.1. Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples) Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board. Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely. Do not break the board by hand. We recommend to use the machine or the jig to break it. 8.2. Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over C in the process of soldering. We recommend to take preheating and gradual cooling. TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 3 of
8.3. Recommendable reflow soldering Profile Feature Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Ts min ) - Temperature Min (Ts max ) - Time(ts min to ts min ) Time maintained above: - Temperature (TL) - Time (tl) Reference IPC-c--1 Pb free Assembly 3 /second max -18 seconds 217 - seconds Peak Temperature (T p ) 2 +/ - Time within of actual Peak - seconds Temperature (T p ) Ramp-Down Rate 6 /second max. Time 2 to Peak Temperature 8 minutes max TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page 4 of
8.4. Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 28 C for the period within 3 seconds by using soldering gun under W. (2) The soldering gun tip shall not touch this product directly. 8.. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. 8.6. Taping Package Storage Condition Storage Temperature : to Relative Humidity: < 6%RH Storage Time : 12 months max TITLE : WIP212P L Series Engineering All s are subject to change without notice. SPEC REV.: A Page of