N7SZ08 Single 2-Input AND Gate The N7SZ08 is a single 2 input AND Gate in two tiny footprint packages. The device performs much as CX multi gate products in speed and drive. They should be used wherever the need for higher speed and drive are needed. Features Tiny SOT 33 and SOT 3 Packages 2.7 ns T PD at.0 V (typ) Source/Sink 2 ma at V Overvoltage Tolerant Inputs Pin For Pin with NC7SZ08PX, TC7SZ08FU and TC7SZ08AFE Chip Complexity: FETs = 20 Designed for.6 V to. V Operation Pb Free Packages are Available SC 70/SC 88A/SOT 33 DF SUFFIX CASE 9A MARKING DIAGRAMS 2 M 2 = Specific Device Marking M = Date Code* = Pb Free Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. IN B IN A 2 SOT 3 XV SUFFIX CASE 63B 2 M GND 3 OUT Y 2 M = Specific Device Marking = Date Code Figure. Pinout (Top View) IN A IN B & OUT Y Figure 2. ogic Symbol PIN ASSIGNMENT Pin 2 3 FUNCTION TABE Function In B In A GND Out Y Input Output Y = AB A B Y ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. Semiconductor Components Industries, C, 200 March, 200 Rev. 0 Publication Order Number: N7SZ08/D
N7SZ08 MAXIMUM RATINGS Symbol Parameter Value Unit DC Supply Voltage 0. to 7.0 V V IN DC Input Voltage 0. to 7.0 V V OUT DC Output Voltage 0. to 0. V I IK DC Input Diode Current 0 ma I OK DC Output Diode Current 0 ma I OUT DC Output Sink Current 0 ma I CC DC Supply Current per Supply Pin 00 ma T STG Storage Temperature Range 6 to 0 C T ead Temperature, mm from Case for 0 Seconds 260 C T J Junction Temperature Under Bias 0 C JA Thermal Resistance SOT 33 (Note ) SOT 3 30 96 C/W P D Power Dissipation in Still Air at 8 C SOT 33 SOT 3 86 3 mw MS Moisture Sensitivity evel F R Flammability Rating Oxygen Index: 28 to 3 U 9 V 0 @ 0.2 in ESD ESD Classification uman Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note ) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Measured with minimum pad spacing on an FR board, using 0 mm by inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22 A A, rated to EIA/JESD22 A B. 3. Tested to EIA/JESD22 A A, rated to EIA/JESD22 A A.. Tested to JESD22 C0 A. 2 kv 00 V N/A RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit DC Supply Voltage.6. V V IN DC Input Voltage 0. V V OUT DC Output Voltage 0 + 0. V T A Operating Temperature Range +2 C t r, t f Input Rise and Fall Time = V 0.3 V =.0 V 0. V 0 0 00 20 ns/v 2
N7SZ08 DC EECTRICA CARACTERISTICS Symbol Parameter Condition (V) V I igh evel Input Voltage.6 to.9 to. V I ow evel Input Voltage.6 to.9 to. V O V O igh evel Output Voltage V IN = V I or V I ow evel Output Voltage V IN = V I or V O I O = 00 A I O = 3 ma I O = 8 ma I O = 2 ma I O = 6 ma I O = 2 ma I O = 32 ma I O = 00 A I O = 3 ma I O = 8 ma I O = 2 ma I O = 6 ma I O = 2 ma I O = 32 ma.6 to..6 2.7..6 to..6 2.7. T A = 2 C C T A 2 C Min Typ Max Min Max Unit 0.7 0.7 V 0.7 0.7 0..29.9 2.2 2. 3.8.2 2. 2. 2.7 2..0 0.08 0.20 0.22 0.28 0.38 0.2 0.2 0.2 V 0.3 0.3 0. 0.2 0.3 0. 0. 0. 0. 0..29.9 2.2 2. 3.8 I IN Input eakage Current V IN = or GND 0 to. 0..0 A I CC Quiescent Supply Current V IN = or GND. 0 A 0. 0.2 0.3 0. 0. 0. 0. V V AC EECTRICA CARACTERISTICS t R = t F = ns T A = 2 C C T A 2 C Symbol Parameter Condition (V) Min Typ Max Min Max Unit t P Propagation Delay R = M C = pf.6 2.0 6.3 2 2.0 2.7 ns t P (Figure 3 and ) R = M C = pf.8 2.0 6.2 0 2.0 0. R = M C = pf 2. 0.2 0.8 3. 7.0 0.8 7. R = M C = pf 3.3 0.3 0. 2.6.7 0..0 R = 00 C = 0 pf. 3.3.2.. R = M C = pf.0 0. 0. 2.2. 0.. R = 00 C = 0 pf 0.8 2.7. 0.8.8 CAPACITIVE CARACTERISTICS Symbol Parameter Condition Typical Unit C IN Input Capacitance =. V, V I = 0 V or.0 pf C PD Power Dissipation Capacitance (Note ) 0 Mz, = 3.3 V, V I = 0 V or 2 pf 0 Mz, =. V, V I = 0 V or 30. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD f in + I CC. C PD is used to determine the no load dynamic power consumption; P D = C PD 2 f in + I CC. 3
N7SZ08 t f = 3 ns t f = 3 ns INPUT A and B 90% 0% 0% 90% 0% 0% GND OUTPUT INPUT R C t P t P 0% 0% V O OUTPUT Y V O Figure 3. Switching Waveform A Mz square input wave is recommended for propagation delay tests. Figure. Test Circuit DEVICE ORDERING INFORMATION Device Order Number Package Type Tape and Reel Size N7SZ08DFT2 SC70 /SC 88A/SOT 33 000 / Tape & Reel N7SZ08DFT2G SC70 /SC 88A/SOT 33 (Pb Free) 000 / Tape & Reel N7SZ08XVT2 SOT 3* 000 / Tape & Reel N7SZ08XVT2G SOT 3* 000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *All Devices in Package SOT3 are Inherently Pb Free.
N7SZ08 PACKAGE DIMENSIONS SC 88A, SOT 33, SC 70 CASE 9A 02 ISSUE J S A G B 2 3 D P 0.2 (0.008) M B M N NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y.M, 982. 2. CONTROING DIMENSION: INC. 3. 9A 0 OBSOETE. NEW STANDARD 9A 02.. DIMENSIONS A AND B DO NOT INCUDE MOD FAS, PROTRUSIONS, OR GATE BURRS. INCES MIIMETERS DIM MIN MAX MIN MAX A 0.07 0.087.80 2.20 B 0.0 0.03..3 C 0.03 0.03 0.80.0 D 0.00 0.02 0.0 0.30 G 0.026 BSC 0.6 BSC --- 0.00 --- 0.0 J 0.00 0.00 0.0 0.2 K 0.00 0.02 0.0 0.30 N 0.008 REF 0.20 REF S 0.079 0.087 2.00 2.20 C J K SODERING FOOTPRINT* 0.0 0.097 0.6 0.02 0.0 0.07 0.6 0.02.9 0.078 SCAE 20: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D.
N7SZ08 PACKAGE DIMENSIONS SOT 3 XV SUFFIX CASE 63B 0 ISSUE B D X 2 3 e E Y b P 0.08 (0.003) M X Y A E c NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y.M, 982. 2. CONTROING DIMENSION: MIIMETERS 3. MAXIMUM EAD TICKNESS INCUDES EAD FINIS TICKNESS. MINIMUM EAD TICKNESS IS TE MINIMUM TICKNESS OF BASE MATERIA. MIIMETERS INCES DIM MIN NOM MAX MIN NOM MAX A 0.0 0. 0.60 0.020 0.022 0.02 b 0.7 0.22 0.27 0.007 0.009 0.0 c 0.08 0.3 0.8 0.003 0.00 0.007 D.0.60.70 0.09 0.063 0.067 E.0.20.30 0.03 0.07 0.0 e 0.0 BSC 0.020 BSC 0.0 0.20 0.30 0.00 0.008 0.02 E.0.60.70 0.09 0.063 0.067 STYE : PIN. BASE 2. EMITTER /2 3. BASE 2. COECTOR 2. COECTOR STYE 2: PIN. CATODE 2. ANODE 3. CATODE. CATODE. CATODE SODERING FOOTPRINT* 0.3 0.08 0. 0.077.3 0.03.0 0.039 0. 0. 0.097 0.097 SCAE 20: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 63, Denver, Colorado 8027 USA Phone: 303 67 27 or 800 3 3860 Toll Free USA/Canada Fax: 303 67 276 or 800 3 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800 282 98 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 2 33 790 290 Japan Customer Focus Center Phone: 8 3 773 380 6 ON Semiconductor Website: www.onsemi.com Order iterature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative N7SZ08/D