NL7SZ6 Single Input Buffer The NL7SZ6 is a single input Buffer in two tiny footprint packages. The device performs much as LCX multi gate products in speed and drive. Features Tiny SOT 33 and SOT 3 Packages Source/Sink 2 m at olts Over oltage Tolerant Inputs and Outputs Chip Complexity: FETs = 20 Designed for.6 to. CC Operation These Devices are Pb Free and are RoHS Compliant SC 88 (SC 70 /SOT 33) DF SUFFIX CSE 9 MRKING DIGRMS LR M NC GND 2 3 CC Y SOT 3 X SUFFIX CSE 63B LR M LR = Device Code M = Date Code* = Pb Free Package (Note: Microdot may be in either location) Figure. Pinout (Top iew) *Date Code orientation and/or position may vary depending upon manufacturing location. Y Figure 2. Logic Symbol PIN SSIGNMENT Pin Function NC 2 IN 3 GND OUT Y CC FUNCTION TBLE Input L H Y Output L H ORDERING INFORMTION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. Semiconductor Components Industries, LLC, 202 pril, 202 Rev. 0 Publication Order Number: NL7SZ6/D
NL7SZ6 MXIMUM RTINGS Symbol Parameter alue Units CC DC Supply oltage 0. to +7.0 I DC Input oltage Output in High or Low State (Note 2) 0. I +7.0 O DC Output oltage I < GND 0. O +7.0 I IK DC Input Diode Current O < GND 0 m I OK DC Output Diode Current 0 m I OUT DC Output Sink Current ±0 m I CC DC Supply Current per Supply Pin ±00 m I GND DC Ground per Supply Pin ±00 m T STG Storage Temperature Range 6 to +0 C T L Lead Temperature, mm from Case for 0 Seconds 260 C T J Junction Temperature Under Bias +0 C J Thermal Resistance SOT 33 SOT 3 P D Power Dissipation in Still ir at 8 C SOT 33 SOT 3 30 360 0 80 C/W mw MSL Moisture Sensitivity Level F R Flammability Rating Oxygen Index: 28 to 3 UL 9 0 @ 0.2 in ESD ESD Classification Human Body Model (Note 3) Machine Model (Note ) Charged Device Model (Note ) Class IC Class N/ I Latchup Latchup Performance bove CC and Below GND at 8 C (Note 6) 00 m Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Measured with minimum pad spacing on an FR board, using 0 mm by inch, 2 ounce copper trace with no air flow. 2. I O bsolute Maximum Rating Must be Obtained. 3. Tested to EI/JESD22, rated to EI/JESD22 B.. Tested to EI/JESD22, rated to EI/JESD22.. Tested to JESD22 C0. 6. Tested to EI/JESD78. RECOMMENDED OPERTING CONDITIONS Symbol Parameter Min Max Units CC DC Supply oltage Operations Only Data Retention IN DC Input oltage 0. OUT DC Output oltage 0. T Operating Temperature Range +2 C.6... t r, t f Input Rise and Fall Time CC = 2. ±0.2 CC = ±0.3 CC =.0 ±0. 0 0 0 20 0 ns/ 2
NL7SZ6 DEICE JUNCTION TEMPERTURE ERSUS TIME TO 0.% BOND FILURES Junction Temperature C Time, Hours Time, Years 80,032,200 7.8 90 9,300 7.9 00 78,700 2 0 79,600 9. 20 37,000.2 30 7,800 0 8,900.0 NORMLIZED FILURE RTE FILURE RTE OF PLSTIC = CERMIC UNTIL INTERMETLLICS OCCUR T J = 30 C T J = 20 C T J = 0 C T J = 00 C 0 00 000 TIME, YERS Figure 3. Failure Rate vs. Time Junction Temperature T J = 90 C T J = 80 C DC ELECTRICL CHRCTERISTICS Symbol Parameter Condition CC () T = 2 C C T 2 C Min Typ Max Min Max Units IH High Level Input oltage.6 to.9 to. IL Low Level Input oltage.6 to.9 to. 0.7 CC 0.7 CC 0.7 CC 0.7 CC 0.2 CC 0.2 CC 0.3 CC 0.3 CC OH High Level Output oltage IN = IL or IH I OH = 00 I OH = 3 m I OH = 8 m I OH = 2 m I OH = 6 m I OH = 2 m I OH = 32 m.6 to..6 2.7. CC 0..29.9 2.2 2. 3.8 CC.2 2. 2. 2.7 2..0 CC 0..29.9 2.2 2. 3.8 OL Low Level Output oltage IN = IH or OH I OL = 00 I OL = m I OL = 8 m I OL = 2 m I OL = 6 m I OL = 2 m I OL = 32 m.6 to..6 2.7. 0.0 0.08 0.20 0.22 0.28 0.38 2 0. 0.2 0.3 0. 0. 0. 0.2 0.3 0. 0. I IN Input Leakage Current IN =. or GND 0 to. ±0. ±.0 I OFF Power Off Leakage Current IN =. or OUT =. 0 0 I CC Quiescent Supply Current IN =. or GND. 0 C ELECTRICL CHRCTERISTICS t R = t F = ns Symbol Parameter Condition CC () T = 2 C C T 2 C Min Typ Max Min Max Units t PLH t PHL Propagation Delay (Figure and ) R L = M C L = pf.6.8 2. ± 0.2 3.3 ± 0.3.0 ± 0. 0. 0..3. 2.9 2..8. 9. 6.. 3.9 0. 0. 2 0 7.0.7. ns R L = 00 C L = 0 pf 3.3 ± 0.3.0 ± 0.. 2.9 2..0.3..2. 3
NL7SZ6 CPCITIE CHRCTERISTICS Symbol Parameter Condition Typical Units C IN Input Capacitance CC =., I = 0 or CC pf C PD Power Dissipation Capacitance (Note 7) 0 MHz, CC = 3.3, I = 0 or CC 2 0 MHz, CC =., I = 0 or CC 30 7. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. verage operating current can be obtained by the equation: I CC(OPR) = C PD CC f in + I CC. C PD is used to determine the no load dynamic power consumption; P D = C PD CC 2 f in + I CC CC. pf t f = 3 ns t f = 3 ns INPUT and B 90% 0% 0% 90% 0% 0% CC GND INPUT R L C L OUTPUT t PHL t PLH OL OUTPUT Y 0% 0% OH MHz square input wave is recommended for propagation delay tests. Figure. Switching Waveform Figure. Test Circuit ORDERING INFORMTION NL7SZ6DFT2G NL7SZ6XT2G Device Package Shipping SC 88/SC 70 /SOT 33 (Pb Free) SOT 3 (Pb Free) 3000/Tape & Reel 000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D.
NL7SZ6 PCKGE DIMENSIONS SC 88 (SC 70 /SOT 33) DF SUFFIX CSE 9 02 ISSUE K S G B 2 3 D PL 0.2 (0.008) M B M N NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.M, 982. 2. CONTROLLING DIMENSION: INCH. 3. 9 0 OBSOLETE. NEW STNDRD 9 02.. DIMENSIONS ND B DO NOT INCLUDE MOLD FLSH, PROTRUSIONS, OR GTE BURRS. INCHES MILLIMETERS DIM MIN MX MIN MX 0.07 0.087.80 2.20 B 0.0 0.03..3 C 0.03 0.03 0.0 D 0.00 0.02 0.0 0.30 G 0.026 BSC 0.6 BSC H --- 0.00 --- 0.0 J 0.00 0.00 0.0 0.2 K 0.00 0.02 0.0 0.30 N 0.008 REF 0.20 REF S 0.079 0.087 0 2.20 C J H K
NL7SZ6 PCKGE DIMENSIONS SOT 3 X SUFFIX CSE 63B ISSUE B D X 2 3 e E Y b PL 0.08 (0.003) M X Y L H E c NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y.M, 982. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MXIMUM LED THICKNESS INCLUDES LED FINISH THICKNESS. MINIMUM LED THICKNESS IS THE MINIMUM THICKNESS OF BSE MTERIL. MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX 0.0 0. 0.60 0.020 0.022 0.02 b 0.7 0.22 0.27 0.007 0.009 0.0 c 0.08 0.3 0.003 0.00 0.007 D.0.60.70 0.09 0.063 0.067 E.0.20.30 0.03 0.07 0.0 e 0.0 BSC 0.020 BSC L 0.0 0.20 0.30 0.00 0.008 0.02 H E.0.60.70 0.09 0.063 0.067 SOLDERING FOOTPRINT* 0.3 0.08 0.077.3 0.03.0 0.039 0. 0. 0.097 0.097 SCLE 20: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 63, Denver, Colorado 8027 US Phone: 303 67 27 or 800 3 3860 Toll Free US/Canada Fax: 303 67 276 or 800 3 3867 Toll Free US/Canada Email: orderlit@onsemi.com N. merican Technical Support: 800 282 98 Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: 2 33 790 290 Japan Customer Focus Center Phone: 8 3 87 00 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NL7SZ6/D