CBF CCP COPPER FOIL. Product Specification. Both shiny side Copper Foil with equal roughness on the two sides.

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1 CBF L I - I O N B A T T E R Y U S E C O P P E R F O I L Both shiny side Copper Foil with equal roughness on the two sides. Anode material for secondary Li-ion battery. Drum side SEM image μm Thickness by weight g/m 2 75 ±10% 85 ±10% 105 ±10% at 23 kg/mm 2 >40 >40 >40 at 180 kg/mm 2 >8 >10 >10 at 23 % >2 >2 >2 at 180 % >3 >5 >8 Roughness of Shiny side (Rz) μm <1.6 <1.6 <1.6 Roughness of Matte side (Rz) μm <1.6 <1.6 <1.6

2 HTE HIGH TEMPERATURE ELONGATION Single side treated Copper Foil following IPC-4562 class 3. Surface plated with Zn/Cr. Glass Fiber Copper Clad Laminates ( FR-4, CEM-1, CEM-3, High Tg, HF ) Multi-layer Printed Circuit Board. Shiny side SEM image μm oz 1/3 1/2 1 2 Thickness by weight g/m 2 107±10% 153±10% 305±10% 610±10% Purity % >99.8 >99.8 >99.8 >99.8 at 23 kg/mm 2 >21 >21 >28 >28 at 180 kg/mm 2 >15 >15 >15 >15 at 23 % >3 >4 >5 >5 at 180 % >2 >3 >3 >3 Roughness of Shiny side (Ra) μm <0.43 <0.43 <0.43 <0.43 Roughness of Matte side (Rz) μm <7 <8 <10 <14 Peel kg/cm >1.1 >1.3 >1.7 >1.9 lb/in >6.0 >7.3 >9.5 >10.6 Peel Tested with Standard FR-4 material(6 sheets 7628P Prepreg)

3 DSTF D R U M S I D E T R E A T E D F O I L Copper Foil with treatment on Drum side. Inner layer application using low profile foils Suitable for fine patterns. Treated side SEM image μm oz 1/2 1 2 Thickness by weight g/m 2 153±10% 305±10% 610±10% Purity % >99.8 >99.8 >99.8 at 23 kg/mm 2 >21 >28 >28 at 180 kg/mm 2 >15 >15 >15 at 23 % >4 >5 >5 at 180 % >3 >3 >3 Roughness of treated side (Rz) μm <5.0 <5.0 <5.0 Roughness of Matte side (Rz) μm <6.0 <8.0 <10.0 Peel kg/cm >0.8 >0.8 >0.9 lb/in >4.5 >4.5 >5.0 Peel Tested with Standard FR-4 material(6 sheets 7628P Prepreg)

4 VLP V E R Y L O W P R O F I L E C O P P E R F O I L High Flexibility High tensile strength Very low profile High peel strength Specialized for 2-Layers and 3-Layers Flexible Copper Clad Laminate(FCCL). Drum side SEM image μm Thickness by weight g/m 2 79 ±10% 107 ±10% 153 ±10% at 23 kg/mm 2 >40 >40 >40 at 180 kg/mm 2 >10 >10 >10 at 23 % >2 >2 >2 at 180 % >3 >5 >8 Roughness of Matte side (Rz) μm <3.0 <3.0 <3.0

5 LTL C O P P E R F O I L W I T H A D H E S I V E Copper foil containing Phenolic resin Adhesive. Paper Phenolic Copper Clad Laminates(FR-1, FR-2, HB). Single side Printed Circuit Boards. Shiny side SEM image μm oz 1/2 1 2 Thickness by weight g/m 2 153±10% 305 ±10% 610 ±10% Purity % >99.8 >99.8 >99.8 at 23 kg/mm 2 >21 >28 >28 at 23 % >2 >3 >3 Roughness of Shiny side (Ra) μm <0.43 <0.43 <0.43 Peel kg/cm >1.2 >1.7 >1.9 Adhesive content g/m 2 24~29 24~29 30~35 JIS-C-6481 Volatile content % 1.5~ ~ ~4.0 JIS-C-6481 Surface resistance C-96/20/65 Ω 1 x x x JIS-C-6481 C-96/20/65 +C-96/40/90 Ω 1 x x x JIS-C-6481

6 LTC C O P P E R F O I L W I T H A D H E S I V E Copper foil containing Anti-Tracking Adhesive. Paper Phenolic Copper Clad Laminates(FR-1, FR-2) Single side Printed Circuit Boards. Shiny side SEM image μm oz 1/2 1 2 Thickness by weight g/m 2 153±10% 305 ±10% 610 ±10% Purity % >99.8 >99.8 >99.8 at 23 kg/mm 2 >21 >28 >28 at 23 % >2 >3 >3 Roughness of Shiny side (Ra) μm <0.43 <0.43 <0.43 Surface resistance Peel kg/cm >1.2 >1.7 >1.9 Adhesive content g/m 2 30~34 30~34 33~37 JIS-C-6481 Volatile content % 1.0~ ~ ~3.5 JIS-C-6481 C-96/20/65 Ω 1 x x x JIS-C-6481 C-96/20/65 +C-96/40/90 Ω 1 x x x JIS-C-6481 Tracking resistance drops >50 >50 >50 JIS-C-6481