NP-175FR. High luminance of multi-functional epoxy contrast with copper
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1 New: 2018/09/12 Flame retardant copper clad laminate NP-175FR Characteristics Unit Conditioning Typical Values SPEC Test Method Volume resistivity MΩ-cm C-96/35/90 5 x10 9 ~ 5x Surface resistivity MΩ C-96/35/90 5 x10 8 ~ 5x Permittivity 1MHz - C-24/23/ Permittivity 1GHz - C-24/23/ Loss Tangent 1MHz - C-24/23/ Loss Tangent 1GHz - C-24/23/ Arc resistance SEC D-48/50+D-0.5/ Dielectric breakdown KV D-48/ Moisture absorption % D-24/ Flammability - C-48/23/50 94V0 94V0 UL94 Peel strength 1 oz ( 0.5mm) lb/in 288 x10 solder floating Thermal stress SEC 288 x10 solder dipping Pressure cooker (2 atm 120 C) Flexural strength 1/2 hr SEC 288 dipping 600 N/A - 1 hr SEC 288 dipping 600 N/A - 2 hrs SEC 288 dipping 600 N/A - LW N/mm 2 A CW N/mm 2 A Dimensional stability X-Y axis % E-0.5/ Coefficient of thermal expansion X/Y-axis Z-axis before Tg Z-axis after Tg C % % N/A % Glass transition temp C DSC 175 ± T260 min > T288 min > Decomposition temperature (Td 5% W/L) Data shown are nominal values for reference only C TGA NOTE: The average value in the table refers to samples of.062 1/1. Test method per IPC-TM-650
2 New: 2018/09/12 Flame retardant copper clad laminate NP-175FTL Characteristics Unit Conditioning Typical Values SPEC Test Method Volume resistivity MΩ-cm C-96/35/ x Surface resistivity MΩ C-96/35/ x Permittivity 1 MHz - C-24/23/ Permittivity 1 GHz - C-24/23/ Loss Tangent 1 MHz - C-24/23/ Loss Tangent 1 GHz - C-24/23/ Arc resistance SEC D-48/50+D-0.5/ Dielectric breakdown KV D-48/ Moisture absorption % D-24/ Flammability - C-48/23/50 94V0 94V0 UL94 Peel strength 1 oz ( 0.5mm) lb/in 288 Cx10 solder floating Thermal stress SEC 288 C solder dipping Glass transition temp C DSC 175 ± Dimensional stability X-Y axis % E 4/ Coefficient of thermal expansion X/Y-axis Z-axis before Tg Z-axis after Tg C % % N/A % T260 min > T288 min > Decomposition temperature (Td 5% W/L) C TGA Data shown are nominal values for reference only. NOTE: The average value in the table refers to samples of.020 1/1. Test method per IPC-TM-650
3 CONSTRUCTION: mm CONSTRUCTION mm CONSTRUCTION 0.05 sp ply 0.30 sp plies ply plies ply plies plies 0.45 sp plies ply plies plies plies 0.13 sp ply plies ply plies p plies plies ply plies p plies plies plies plies 1.2, 1.1, 1.0, mm INCLUDE CLADDING, ALL OTHERS EXCLUDE CLADDING PRODUCT SIZE & (mm) COPPER CLADDING oz (µm) SIZE mm TOLERANCE Q (9) 3.0 (102) (0.1) to (1.0) T (12) 4.0 (140) H (17) 5.0 (175) 1.0 (35) 6.0 (210) 48.8 x x x x x x 1080 IPC-4101E SPEC CLASS C/M 2.0 (70) Keeping the core and prepreg in the same grain direction is crucial to ensure the flatness of multilayer boards. Grain direction is shown on the certificate of conformance. We recommend to evaluate the drilling property. Different oxide treatment may result in variations in the heat resistance properties of the laminates after processing. Pre-production batch runs are recommended to ensure compatibility of materials with chemicals.
4 Flame retardant prepreg We recommend to evaluate the drilling property. NP-175FB Different oxide treatment may result in variations in the heat resistance properties of the laminates after processing. Pre-production batch runs are recommended to ensure compatibility of materials with chemicals. Specification: IPC-4101E is applicable Data shown are nominal values for reference only. (Remained Copper 100%) Glass style RC% RF% GT sec (171 C) VC% After Pressed Thickness (per ply) 7628HR 52 ± 3 31 ± ± ± MR 49 ± 3 28 ± ± ± ± 3 21 ± ± ± ± 3 27 ± ± ± HR 60 ± 3 40 ± ± ± MR 56 ± 3 34 ± ± ± ± 3 28 ± ± ± ± ± 3 35 ± ± ± ± 3 35 ± ± ± ± 3 40 ± ± ± HR 70 ± 3 50 ± ± ± MR 67 ± 3 45 ± ± ± ± 3 40 ± ± ± ± 3 42 ± ± ± 0.3 mm Storage Stability Storage Condition: 20 C, 50% RH for 3 months : max. 5 C for 6 months
5 Recommended press cycles: Suggestions: 1. Heating rate of material between 70 and /min is acceptable /min would be better. 2. Temperature of material over 170 must be held for at least 60min. to allow epoxy resin to fully cure. 3. The pressure should be kept below 100psi during cooling to ambient temperature. 4. Cooling rate of material should be kept under 2.5 /min when the temperature of material is over 100, in order to avoid introducing twist. CERTIFICATION UL UL File No.: E98983 ANSI TYPE: FR-4.0 UL 746 Recognition Minimum Clad cond. Max. Material Thickness Area Thickness Min. Max. Diameter Solder Lts UL 94 Max. Temp Time Flame Operating (mm) (mic) (mic) (mm) C sec Class Temp (0.051) (9) (210) 2.0 (50.8) V-0 130
NP-180R. U.L. file number E98983
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