8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash. ATtiny25 ATtiny25V. Appendix B. Appendix B ATtiny25/V Specification at +125 C
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1 Appendix B ATtiny25/ Specification at +125 C This document contains information specific to devices operating at temperatures up to 125 C. Only deviations are covered in this appendix, all other information can be found in the complete datasheet. The complete datasheet can be found at 8-bit Microcontroller with 2/4/8K Bytes In-System Programmable Flash ATtiny25 ATtiny25 Appendix B Rev. 2586N-Appendix B AR 8/11
2 1. Memories 1.1 EEPROM Data Memory The EEPROM has an endurance of at least 5, write/erase cycles. 2 ATtiny N-Appendix B AR 8/11
3 ATtiny25 2. Electrical Characteristics 2.1 DC Characteristics Table 2-1. DC Characteristics. T A = -4 C to +125 C Symbol Parameter Condition Min. Typ. (1) Max. Units IL IH IL1 IH1 IL2 IH2 Input Low-voltage, except XTAL1 and RESET pin Input High-voltage, except XTAL1 and RESET pin Input Low-voltage, XTAL1 pin, External Clock Selected Input High-voltage, XTAL1 pin, External Clock Selected Input Low-voltage, RESET pin Input High-voltage, RESET pin IL3 Input Low-voltage, RESET pin as I/O IH3 Input High-voltage, RESET pin as I/O Output Low-voltage, (4) OL Port B (except RESET) (6) OH Output High-voltage, (5) Port B (except RESET) (6) I IL I IH Input Leakage Current I/O Pin Input Leakage Current I/O Pin CC = CC = CC = CC = CC (2).6 CC (2) Notes: 1. Typical values at 25 C. 2. Min means the lowest value where the pin is guaranteed to be read as high. 3. Max means the highest value where the pin is guaranteed to be read as low..2 CC (3).3 CC (3) CC +.5 CC +.5 CC = CC (3) CC = CC = CC (2).7 CC (2) CC +.5 CC +.5 CC = CC (3) CC = CC (2) CC = CC = CC = CC = I OL = 1 ma, CC = 5 I OL = 5 ma, CC = 3 I OH = -1 ma, CC = 5 I OH = -5 ma, CC = 3 CC = 5.5, pin low (absolute value) CC = 5.5, pin high (absolute value) CC (2).6 CC (2) CC CC (3).3 CC (3) CC +.5 CC <.5 1 µa <.5 1 µa R RST Reset Pull-up Resistor CC = 5.5, input low 3 6 kω R pu I/O Pin Pull-up Resistor CC = 5.5, input low 2 5 kω I CC Power Supply Current (7) Active 1 MHz, CC = ma Active 4 MHz, CC = ma Active 8 MHz, CC = ma Idle 1 MHz, CC = ma Idle 4 MHz, CC = ma Idle 8 MHz, CC = ma Power-down mode (8) WDT enabled, CC = µa WDT disabled, CC = µa 2586N-Appendix B AR 8/11 3
4 4. Although each I/O port can sink more than the test conditions (1 ma at CC = 5, 5 ma at CC = 3) under steady state conditions (non-transient), the sum of all I OL, for all ports, should not exceed 6 ma. If I OL exceeds the test condition, OL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition. 5. Although each I/O port can source more than the test conditions (1 ma at CC = 5, 5 ma at CC = 3) under steady state conditions (non-transient), the sum of all I OH, for all ports, should not exceed 6 ma. If I OH exceeds the test condition, OH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition. 6. The RESET pin must tolerate high voltages when entering and operating in programming modes and, as a consequence, has a weak drive strength as compared to regular I/O pins. See Figure 3-19, Figure 3-2, Figure 3-21, and Figure 3-22 (starting on page 18). 7. alues are with external clock using methods described in Minimizing Power Consumption on page 37. Power Reduction is enabled (PRR = xff) and there is no I/O drive. 8. Brown-Out Detection (BOD) disabled. 2.2 Clock Characteristics Calibrated Internal RC Oscillator Accuracy It is possible to manually calibrate the internal oscillator to be more accurate than default factory calibration. Please note that the oscillator frequency depends on temperature and voltage. oltage and temperature characteristics can be found in Figure 3-36 on page 27 and Figure 3-37 on page 27. Table 2-2. Calibration Accuracy of Internal RC Oscillator Calibration Method Target Frequency CC Temperature Notes: 1. Accuracy of oscillator frequency at calibration point (fixed temperature and fixed voltage) MHz in ATtiny15 Compatibility Mode. 3. oltage range for ATtiny oltage range for ATtiny25. Accuracy at given oltage & Temperature (1) Factory Calibration 8. MHz (2) 3 25 C ±1% User Calibration Fixed frequency within: 6 8 MHz Fixed voltage within: (3) (4) Fixed temperature within: -4 C to +125 C ±1% 2.3 System and Reset Characteristics Power-On Reset Table 2-3. Characteristics of Power-On Reset. T A = -4 C to +125 C Symbol Parameter Min (1) Typ (1) Max (1) Units POR Release threshold of power-on reset (2) POA Activation threshold of power-on reset (3) SR ON Power-On Slope Rate.1 /ms Note: 1. alues are guidelines, only 2. Threshold where device is released from reset when voltage is rising 3. The Power-on Reset will not work unless the supply voltage has been below POT (falling) 4 ATtiny N-Appendix B AR 8/11
5 ATtiny Brown-Out Detection Table 2-4. BODLEEL Fuse Coding. T A = -4 C to +125 C BODLEEL[2:] Fuses Min (1) Typ (1) Max (1) Units 111 BOD Disabled XX Reserved Note: 1. BOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to CC = BOT during the production test. This guarantees that a Brown-out Reset will occur before CC drops to a voltage where correct operation of the microcontroller is no longer guaranteed. 2.5 Serial Programming Characteristics Table 2-5. Serial Programming Characteristics, T A = -4 C to +125 C, CC = (Unless Otherwise Noted) Symbol Parameter Min Typ Max Units 1/t CLCL Oscillator Frequency ( CC = ) 4 MHz t CLCL Oscillator Period ( CC = ) 25 ns 1/t CLCL Oscillator Frequency ( CC = ) 1 MHz t CLCL Oscillator Period ( CC = ) 1 ns 1/t CLCL Oscillator Frequency ( CC = ) 2 MHz t CLCL Oscillator Period ( CC = ) 5 ns t SHSL SCK Pulse Width High 2 t CLCL* ns t SLSH SCK Pulse Width Low 2 t CLCL* ns t OSH MOSI Setup to SCK High t CLCL ns t SHOX MOSI Hold after SCK High 2 t CLCL ns t SLI SCK Low to MISO alid 1 ns Note: 1. 2 t CLCL for f ck < 12 MHz, 3 t CLCL for f ck >= 12 MHz 2586N-Appendix B AR 8/11 5
6 2.6 ADC Characteristics Table 2-6. ADC Characteristics, Single Ended Channels. T A = -4 C to +125 C Symbol Parameter Condition Min Typ Max Units Resolution 1 Bits Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset errors) Integral Non-linearity (INL) (Accuracy after offset and gain calibration) Differential Non-linearity (DNL) Gain Error Note: 1. alues are guidelines only. REF = 4, CC = 4, ADC clock = 2 khz REF = 4, CC = 4, ADC clock = 1 MHz REF = 4, CC = 4, ADC clock = 2 khz Noise Reduction Mode REF = 4, CC = 4, ADC clock = 1 MHz Noise Reduction Mode REF = 4, CC = 4, ADC clock = 2 khz REF = 4, CC = 4, ADC clock = 2 khz REF = 4, CC = 4, ADC clock = 2 khz 2 LSB 3 LSB 1.5 LSB 2.5 LSB 1 LSB.5 LSB 2.5 LSB Offset Error REF = 4, CC = 4, 1.5 LSB ADC clock = 2 khz Conversion Time Free Running Conversion µs Clock Frequency 5 1 khz IN Input oltage GND REF Input Bandwidth 38.4 khz AREF External Reference oltage 2. CC Internal oltage Reference INT Internal 2.56 Reference (1) CC > R REF 32 kω R AIN Analog Input Resistance 1 MΩ ADC Output 123 LSB 6 ATtiny N-Appendix B AR 8/11
7 ATtiny25 Table 2-7. ADC Characteristics, Differential Channels (Unipolar Mode). T A = -4 C to +125 C Symbol Parameter Condition Min Typ Max Units Resolution Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) Gain Error Offset Error Note: 1. alues are guidelines only. Gain = 1x 1 Bits Gain = 2x 1 Bits Gain = 1x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 2x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 1x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 2x REF = 4, CC = 5 ADC clock = 5-2 khz 1. LSB 2. LSB 4. LSB 1. LSB Gain = 1x 1. LSB Gain = 2x 15. LSB Gain = 1x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 2x REF = 4, CC = 5 ADC clock = 5-2 khz 3. LSB 4. LSB Conversion Time Free Running Conversion 7 28 µs Clock Frequency 5 2 khz IN Input oltage GND CC DIFF Input Differential oltage REF /Gain Input Bandwidth 4 khz AREF External Reference oltage 2. CC - 1. Internal oltage Reference INT Internal 2.56 Reference (1) CC > R REF Reference Input Resistance 32 kω R AIN Analog Input Resistance 1 MΩ ADC Conversion Output 123 LSB 2586N-Appendix B AR 8/11 7
8 Table 2-8. ADC Characteristics, Differential Channels (Bipolar Mode). T A = -4 C to +125 C Symbol Parameter Condition Min Typ Max Units Resolution Absolute accuracy (Including INL, DNL, and Quantization, Gain and Offset Errors) Integral Non-Linearity (INL) (Accuracy after Offset and Gain Calibration) Gain Error Offset Error Note: 1. alues are guidelines only. Gain = 1x 1 Bits Gain = 2x 1 Bits Gain = 1x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 2x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 1x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 2x REF = 4, CC = 5 ADC clock = 5-2 khz 8. LSB 8. LSB 4. LSB 5. LSB Gain = 1x 4. LSB Gain = 2x 5. LSB Gain = 1x REF = 4, CC = 5 ADC clock = 5-2 khz Gain = 2x REF = 4, CC = 5 ADC clock = 5-2 khz 3. LSB 4. LSB Conversion Time Free Running Conversion 7 28 µs Clock Frequency 5 2 khz IN Input oltage GND CC DIFF Input Differential oltage REF /Gain Input Bandwidth 4 khz AREF External Reference oltage 2. CC - 1. Internal oltage Reference INT Internal 2.56 Reference (1) CC > R REF Reference Input Resistance 32 kω R AIN Analog Input Resistance 1 MΩ ADC Conversion Output LSB 8 ATtiny N-Appendix B AR 8/11
9 ATtiny25 3. Typical Characteristics 3.1 Active Supply Current The data contained in this section is largely based on simulations and characterization of similar devices in the same process and design methods. Thus, the data should be treated as indications of how the part will behave. The following charts show typical behavior. These figures are not tested during manufacturing. All current consumption measurements are performed with all I/O pins configured as inputs and with internal pull-ups enabled. A sine wave generator with rail-to-rail output is used as clock source. The power consumption in Power-down mode is independent of clock selection. The current consumption is a function of several factors such as: operating voltage, operating frequency, loading of I/O pins, switching rate of I/O pins, code executed and ambient temperature. The dominating factors are operating voltage and frequency. The current drawn from capacitive loaded pins may be estimated (for one pin) as C L * CC *f where C L = load capacitance, CC = operating voltage and f = average switching frequency of I/O pin. The parts are characterized at frequencies higher than test limits. Parts are not guaranteed to function properly at frequencies higher than the ordering code indicates. The difference between current consumption in Power-down mode with Watchdog Timer enabled and Power-down mode with Watchdog Timer disabled represents the differential current drawn by the Watchdog Timer. Figure 3-1. Active Supply Current vs. CC (Internal RC oscillator, 8 MHz) C I CC (ma) CC () 2586N-Appendix B AR 8/11 9
10 Figure 3-2. Active Supply Current vs. CC (Internal RC Oscillator, 1 MHz) C 1 I CC (ma) CC () Figure 3-3. Active Supply Current vs. CC (Internal RC Oscillator, 128 khz) C I CC (ma) CC () 1 ATtiny N-Appendix B AR 8/11
11 ATtiny Idle Supply Current Figure 3-4. Idle Supply Current vs. CC (Internal RC Oscillator, 8 MHz)I C 1.2 I CC (ma) CC () Figure 3-5. Idle Supply Current vs. CC (Internal RC Oscilllator, 1 MHz) C.35 I CC (ma) CC () 2586N-Appendix B AR 8/11 11
12 Figure 3-6. Idle Supply Current vs. CC (Internal RC Oscillator, 128 khz) C.7 I CC (ma) CC () 3.3 Power-down Supply Current Figure 3-7. Power-down Supply Current vs. CC (Watchdog Timer Disabled) I CC (ua) CC () -4 C 12 ATtiny N-Appendix B AR 8/11
13 ATtiny25 Figure 3-8. Power-down Supply Current vs. CC (Watchdog Timer Enabled) 16 I CC (ua) C 4 2 CC () 3.4 Pin Pull-up Figure 3-9. I/O Pin Pull-up Resistor Current vs. Input oltage ( CC = 1.8) I OP (ua) C OP () 2586N-Appendix B AR 8/11 13
14 Figure 3-1. I/O Pin Pull-up Resistor Current vs. Input oltage ( CC = 2.7) I OP (ua) OP () -4 C Figure I/O Pin Pull-up Resistor Current vs. Input oltage ( CC = 5) I OP (ua) OP () -4 C 14 ATtiny N-Appendix B AR 8/11
15 ATtiny25 Figure Reset Pull-up Resistor Current vs. Reset Pin oltage ( CC = 1.8) I RESET (ua) C RESET () Figure Reset Pull-up Resistor Current vs. Reset Pin oltage ( CC = 2.7) I RESET (ua) RESET () -4 C 2586N-Appendix B AR 8/11 15
16 Figure Reset Pull-up Resistor Current vs. Reset Pin oltage ( CC = 5) I RESET (ua) RESET () -4 C 3.5 Pin Driver Strength Figure I/O Pin Output oltage vs. Sink Current ( CC = 3) 1.2 OL () I OL (ma) 16 ATtiny N-Appendix B AR 8/11
17 ATtiny25 Figure I/O Pin Output oltage vs. Sink Current ( CC = 5) OL () I OL (ma) Figure I/O Pin Output oltage vs. Source Current ( CC = 3) OH () I OH (ma) 2586N-Appendix B AR 8/11 17
18 Figure I/O Pin Output oltage vs. Source Current ( CC = 5) OH () I OH (ma) Figure Reset Pin Output oltage vs. Sink Current ( CC = 3) OL () C -45 C I OL (ma) 18 ATtiny N-Appendix B AR 8/11
19 ATtiny25 Figure 3-2. Reset Pin Output oltage vs. Sink Current ( CC = 5) OL ().4.3 C -45 C I OL (ma) Figure Reset Pin Output oltage vs. Source Current ( CC = 3) OH () C I OH (ma) N-Appendix B AR 8/11
20 Figure Reset Pin Output oltage vs. Source Current ( CC = 5) OH () C I OH (ma) 3.6 Pin Threshold and Hysteresis Figure I/O Pin Input Threshold oltage vs. CC ( IH, IO Pin Read as 1 ) C 2 Threshold () CC () 2 ATtiny N-Appendix B AR 8/11
21 ATtiny25 Figure I/O Pin Input Threshold oltage vs. CC ( IL, IO Pin Read as ) C 2 Threshold () CC () Figure I/O Pin Input Hysteresis vs. CC.6.5 Input Hysteresis (m) C.1 CC () 2586N-Appendix B AR 8/11 21
22 Figure Reset Input Threshold oltage vs. CC ( IH, IO Pin Read as 1 ) C 2 Threshold () CC () Figure Reset Input Threshold oltage vs. CC ( IL, IO Pin Read as ) C Threshold () CC () 22 ATtiny N-Appendix B AR 8/11
23 ATtiny25 Figure Reset Pin Input Hysteresis vs. CC Input Hysteresis (m) C.1.5 CC () 3.7 BOD Threshold Figure BOD Threshold vs. Temperature (BOD Level is 4.3) Rising CC 4.36 Threshold () Falling CC Temperature (C) 2586N-Appendix B AR 8/11 23
24 Figure 3-3. BOD Threshold vs. Temperature (BOD Level is 2.7) Rising CC 2.76 Threshold () Falling CC Temperature (C) Figure BOD Threshold vs. Temperature (BOD Level is 1.8) Rising CC Threshold () Falling CC Temperature (C) 24 ATtiny N-Appendix B AR 8/11
25 ATtiny25 Figure Bandgap oltage vs. Supply oltage Bandgap oltage () C cc () Figure Bandgap oltage vs. Temperature Bandgap oltage () Temperature 2586N-Appendix B AR 8/11 25
26 3.8 Internal Oscillator Speed Figure Watchdog Oscillator Frequency vs. CC Frequency (MHz) C 15 C CC () Figure Watchdog Oscillator Frequency vs. Temperature Frequency (MHz) Temperature 26 ATtiny N-Appendix B AR 8/11
27 ATtiny25 Figure Calibrated 8 MHz RC Oscillator Frequency vs. CC 8.3 Frequency (MHz) C -4 C CC () Figure Calibrated 8 MHz RC Oscillator Frequency vs. Temperature Frequency (MHz) Temperature 2586N-Appendix B AR 8/11 27
28 Figure Calibrated 8 MHz RC Oscillator Frequency vs. OSCCAL alue C Frequency (MHz) OSCCAL 3.9 Current Consumption of Peripheral Units Figure Brownout Detector Current vs. CC C 2 I CC (ua) CC () 28 ATtiny N-Appendix B AR 8/11
29 ATtiny25 Figure 3-4. ADC Current vs. CC (AREF = A CC ) C 15 I CC (ua) 1 5 CC () Figure Analog Comparator Current vs. CC C 3 I CC (ua) CC () 2586N-Appendix B AR 8/11 29
30 Figure Programming Current vs. CC 12-4 C 1 8 I CC (ma) CC () 3.1 Current Consumption in Reset and Reset Pulsewidth Figure Reset Supply Current vs. CC (.1-1. MHz, Excluding Current Through The Reset Pull-up).25 I CC (ma) Frequency (MHz) 3 ATtiny N-Appendix B AR 8/11
31 ATtiny25 Figure Reset Supply Current vs. CC (1-2 MHz, Excluding Current Through The Reset Pull-up) 3 I CC (ma) Frequency (MHz) Figure Minimum Reset Pulse Width vs. CC 25 2 Pulsewidth (ns) CC () -4 C 2586N-Appendix B AR 8/11 31
32 4. Ordering Information 4.1 ATtiny25 Speed (MHz) Supply oltage () Temperature Range Package (1) Ordering Code (2) Extended (-4 C to +125 C) 2M1 ATTINY25-1MF ATTINY25-1MFR Extended (-4 C to +125 C) Notes: 1. All packages are Pb-free, halide-free and fully green, and they comply with the European directive for Restriction of Hazardous Substances (RoHS). 2. Code indicator: R: tape & reel 2M1 ATTINY25-2MF ATTINY25-2MFR Package Types 2M1 2-pad, 4 x 4 x.8 mm Body, Quad Flat No-Lead/Micro Lead Frame Package (QFN/MLF) 32 ATtiny N-Appendix B AR 8/11
33 ATtiny N-Appendix B AR 8/11 33
34 Headquarters International Atmel Corporation 2325 Orchard Parkway San Jose, CA USA Tel: (+1)(48) Fax: (+1)(48) Atmel Asia Limited Unit 1-5 & 16, 19F BEA Tower, Millennium City Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) Fax: (+852) Atmel Munich GmbH Business Campus Parkring 4 D Garching b. Munich GERMANY Tel: (+49) Fax: (+49) Atmel Japan 9F, Tonetsu Shinkawa Bldg Shinkawa Chuo-ku, Tokyo JAPAN Tel: (+81)(3) Fax: (+81)(3) Product Contact Web Site Technical Support avr@atmel.com Sales Contact Literature Requests Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN ATMEL S TERMS AND CONDI- TIONS OF SALE LOCATED ON ATMEL S WEB SITE, ATMEL ASSUMES NO LIABILITY WHATSOEER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIE, SPECIAL OR INCIDEN- TAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EEN IF ATMEL HAS BEEN ADISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel s products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life. 211 Atmel Corporation. All rights reserved. Atmel, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 2586N-Appendix B AR 8/11
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