DN/DR. Multilayer Ceramic Chip Capacitors. Features. Structure. series. series. Arrays. Smoothing. series. series. series. series. series.

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1 yocera's of are designed to meet a wide variety of needs. We offer a complete range of products for both general and specialized applications, including the general-purpose M, the high-voltage, the low profile T, and the N for automotive uses. eatures We maintain factories worldwide in order to supply our global customer bases quickly and efficiently and to maintain our reputation as the highest-volume producer in the industry. ll our products are highly reliable due to their monolithic structure of high-purity and superfine uniform ceramics and their integral internal electrodes. By combining superior manufacturing technology and materials with high dielectric constants, we produce extremely compact components with exceptional specifications. Our stringent quality control in every phase of production from material procurement to shipping ensures consistent manufacturing and superb quality. yocera components are available in a wide choice of dimensions, temperature characteristics, rated voltages, and terminations to meet specific configurational requirements. Structure M eneral U Low SR X Smoothing Multilayer eramic hip apacitors T Low Profile rrays High-Voltage N/R utomotive Low loss xternal Termination lectrodes Nickel Barrier Termination Products Silver Palladium Termination Products nternal lectrodes (Pd, Pd/g, Ni or u) ielectric eramic Layer Temperature compensation :Titanate family High dielectric constant family : Barium Titanate family Relaxor family Termination lectrodes Ni Plating Sn Plating or Sn/Pb Plating Silver Palladium Termination (Pd/g) Tape and Reel Bulk assette Please contact your local VX sales office or distributor for specifications not covered in this catalog. Our products are continually being improved. s a result, the capacitance range of each is subject to change without notice. Please contact an VX sales representative to confirm compatibility with your application.

2 yocera eramic hip apacitors are available for different applications as classified below: Series ieletric Options Typical pplications eatures Terminations vailable Size () M (NP) X5R 21, 42, 63 X7R eneral Purpose Wide ap Range Nickel Barrier 85, 126, 121 Y5V 1812, 222 NT (NP) X7R High Voltage High Voltage & 5V, 63V Nickel Barrier Power ircuits 1V, 2V 3V, 4V 126, 121, , 228, 222 T N/R U (NP) X5R PL 42, 85 X7R (ecoupling) Low Profile Nickel Barrier 126, 121 Y5V (NP) Thermal shock U (75) utomotive Resistivity Nickel Barrier 63, 85, 126 X7R, X8R High Reliability PP Low Loss 126, 121 X5R PBX Nickel Barrier xcellent bias 1812, 222 nverters (NP) R ircuit Low SR Nickel Barrier 42, 63 (NP) igital Signal Reduction in X7R Nickel Barrier 58, 612 Pass line Placing osts Y5V X Power Supply 121, 1812 Y5U Smoothing Nickel Barrier ircuit 222 NT: Negative Temperature coefficient types are available on request. N, X Series: Silver Palladium termination is available on request.

3 Ordering nformation YOR PRT NUMBR: M 21 X7R 14 5 T SRS O M = eneral Purpose = apacitor rrays = High Voltage = Low Loss T = Low Profile U = Low SR N/R = utomotive X = Smoothing SZ O SZ (J) SZ (J) SZ (J) 3 = 21 (63) 21 = 85 (212) 52 = 228 (572) 5 = 42 (15) 316 = 126 (3216) 55 = 222 (575) 15 = 63 (168) 32 = 121 (3225) 12 = 58 (122) 42 = 188 (452) 13 = 612 (1632) 43 = 1812 (4532) LTR O O O = (NPO) X5R = X5R X7R = X7R X8R = X8R Y5V = Y5V Y5U = Y5U Negative dielectric types are available on request. PTN O apacitance expressed in p. 2 significant digits plus number of zeros. or Values < 1p, Letter R denotes decimal point, eg. 1p = 14.1µ = 14 47p = p = 1R5.5p = R5 TOLRN O B=±.1p = ±1% = ±1% = ±.25p = ±2% M = ±2% = ±.5p J = ±5% Z = -2 to +8% VOLT O 6 = 6.3V 1 = 1V 1 = 1V 1 = 1V 2 = 2V 2 = 2V 16 = 16V 25 = 25V 3 = 3V 25 = 25V 5 = 5V 4 = 4V 5 = 5V 63 = 63V TRMNTON O = Nickel Barrier = Silver ( option) B = Silver Palladium ( option) PN O B = Bulk = Bulk assette T = 7" Reel Taping & 4mm avity pitch L = 13" Reel Taping & 4mm avity pitch H = 7" Reel Taping & 2mm avity pitch N = 13" Reel Taping & 2mm avity pitch

4 Temperature haracteristics and Tolerance High ielectric onstant ielectric Temperature Range max X5R 55 to 85 X7R 55 to 125 ±15% X8R 55 to 15 Y5U 3 to to 56% Y5V 3 to to 82% Temperature ompensation Type lectric ode P R S T U SL 1B/ Value (p) N15 N22 N33 N47 N to P R S T U SL J PJ RJ SJ TJ UJ SL H PH RH SH TH UJ SL 1 PH RH SH TH UJ SL = ±25ppm/, J = ±12ppm/, H = ±6ppm/, = ±3ppm/ e.g. = ±3ppm/, PH = 15±6ppm/ Note: ll parts will be marked as "" but will conform to the above table. vailable Tolerances ielectric materials, capacitance values and tolerances are available in the following combinations only: ielectric Standard Tolerance apacitance 3 =±.25p 5p O NT 1 X5R X7R Y5U Y5V 5 =±.5p 4 J=±5% =±1% M=±2% 6 =±1% M=±2% M=±2% Z= 2% to +8% Z= 2% to +8% 2 <1p 1p 12 Series 6 Series 3 Series 3 Series Note: 1 NT : Negative Temperature ompensation types are available on request as shown on product pages. 2 Nominal values below 1p are available in the standard values of.5p, 1.p, 1.5p, 2.p, 3.p, 4.p, 5.p, 6.p, 7.p, 8.p, 9.p, 1p. 3 B = ±.1p is available for 5p and below on request. 4 = ±1% or = ±2% is available for >1p on request. 5 = ±.25p is available for values 5p< < 1p on request. 6 J = ±5% for X7R(X5R) is available on request. Standard Number (Option)

5 M Series Nickel Barrier Terminations eatures We offer a diverse product line ranging from ultra-compact (.6.3 mm) to large ( mm) components configured for a variety of temperature characteristics, rated voltages, and packages. We offer the choice and flexibility for almost any applications. pplication This standard type is ideal for use in a wide range of applications, from commercial to industrial equipment. Temperature ompensation ielectrics Size (mm) Temperature haracteristics Rated Voltage (V) apacitance (p) R5.5 1R 1. 1R M3 M5 M15 M21 M316 M32.6±.3 1.±.5 1.6±.1 2.±.1 3.2±.2 (21).3±.3 (42).5±.5 (63).8±.1 (85) 1.25±.1 (126) 1.6±.15 (121) O O P to U O P to U P to O U T SL T SL T SL M M M B B B B 12 :Standard, 24 :Option P T :Option O H P to U T SL O 2.5±.2 3.2±.2 M ± ±.3 M55 5. ±.4 P to U T SL O O 5.7 ±.4 Size Thickness (mm) Taping(178 dia reel) Taping(33 dia reel) M3 M5 M15 M21, M316, M32 M B H O V.3±.3.5±.5.8±.1.6±.1.85± ± ±.1 1.4max 1.6 max 1.6±.15 2.±.2 2.5±.2 15kp(P8) 1kp(P8) 4kp(P8) 4kp(P8) 4kp(P8) 3kp(8) 3kp(8) 3kp(8) 2.5kp(8) 2.5kp(8) 2kp(8) 1kp(8) 5kp(P8) 1kp(P8) 1kp(P8) 1kp(P8) 1kp(8) 1kp(8) 1kp(8) 5kp(8) 5kp(8) 5kp(8) Size Thickness (mm) Taping(178 dia reel) Taping(33 dia reel) Note : P8 = 8mm width paper tape 8 = 8mm width plastic tape 12 = 12mm width plastic tape 1 1kp for M55 M43, M55 J O V 1.15±.1 1.4max 1.6±.15 2.max 2.±.2 2.5max 2.5±.2 1.5kp(12) 1 1.5kp(12) 1kp(12) 1kp(12) 1kp(12).5kp(12).5kp(12)

6 M Series Nickel Barrier Terminations X5R ielectric Size (mm) Rated Voltage (V) apacitance (p) X5R 6 : Standard, 12 : Option imentional tolerances (L, W, T) is ±.15mm for 15X5R334 to 15, 21X5R335 to 475. ±.2mm for 316X5R685 to16 X7R ielectric Size (mm) Rated Voltage (V) apacitance (p) X7R 6 : Standard, 12 : Option Y5V ielectric Size (mm) M3 M5 M15 M21 M316 M32 1.6±.1 2.±.1 3.2±.2 3.2±.2 4.5±.3.±. 1.±.5 (1812) (21).±. (42).5±.5 (63).8±.1 (85) 1.25±.1 (126) 1.6±.15 (121) 2.5±.2 3.2± M M3 M5 M15 M21 M316 M32 M43 (21).±..± M 5.7±.4 3.2±.2 4.5±.3 (42) 1.±.5 (63) 1.6±.1 (85) 2.±.1 (126) 3.2±.2 (121) (1812) (222).5±.5.8± ±.1 1.6± ±.2 3.2±.2 5.±.4 M Rated Voltage (V) apacitance (p) M M Y5V 3 : Standard, 6 : Option Tolerance (W, T) for M316Y5V16 is ±.2mm. B B B B B B B B B B O O 5.7 M M55 ±.4 M3.±. M5 M15 M21 M316 M32 3.2±.2 (1812) ±.3 (222) 1.±.5 1.6±.1 2.±.1 3.2±.2 (21). (42).5±.5 (63).8±.1 (85) 1.25±.1 (126) 1.6±.15 (121) ± ±. ±.2 ± B B B B H V V V O O J O J H V O V M55 M43 O J V J

7 lectrical haracteristics apacitance-temperature (temperature compensation) ging (change of capacitance over time) 1 at 1MHz, 1Vrms or temperature compensation : 1MHz, 1 Vrms/for high dielectric constant : 1,kHZ, 1 Vrms 1 apacitance(%) 5-5 P R S T U apacitance(%) -1-2 X7R, X8R Y5U Y5V nitial value should be after 48hr of Heat treatment Temperature( ) , 1, 1, uration(hrs) apacitance-temperature (high dielectric constant) mpedance-requency apacitance(%) Y5U, X7R, Y5V, X8R Y5U at V Y5U at RV/2 X7R at V X7R at RV/2 Y5V at V Y5V at RV/2 at 1kHz, 1Vrms X8R at V X8R at RV/2 mpedance(ω) W5R(B)/Y5V.1µ W5R(B)/Y5V.1µ W5R(B)1Y5V 1µ Y5V 1µ Y5V 1µ W5R(B)1p H 1p H 1p H 1p H 1p at 1Vrms Temperature( ) , 1, requency(mhz) Bias Voltage Rated at 25V : Y5U Rated at 25V :, X7R, Y5V 2 or temperature compensation at 1MHz, 1Vrms or high dielectric constant at 1kHz, 1Vrms H Rated at 25V : Y5U Rated at 25V :, X7R, Y5V 25 or temperature compensation : 1MHz 1 Vrms/for high dielectric constant : 1kHz /(%) Y5V Y5U W5R apacitance(%) Y5V Y5U X7R V Voltage(Vrms) Please verify individual characteristics at the design stage to ensure total suitability

8 Test onditions and Standards Test conditions and Specification for Temperature ompensation type( to U SL characteristics) Test tems Specification (: nominal capacitance) Test onditions apacitance Value Q nsulation resistance (R) ielectric Resistance Within tolerance 3p: Q 1 <3p: Q 4+2 1,MΩ or 5MΩ µ min, whichever is less No problem observed 1p 1MHz±1%.5 to >1p 1kHz±1% 5Vrms Measured after the rated voltage is applied for one minute at normal room temperature and humidity. ( 5) ( 1) pply 3 times of the rated voltage for 1 to 5 seconds. ppearance No problem observed Microscope(1 magnification) Termination strength 2 No problem observed Bending strength 2 No mechanical damage at 1mm bent Vibration test ppearance No significant change is detected. Within tolerance 3p: Q 1 Q <3p: Q 4+2 Soldering ppearance No significant change is detected. heat resistance ±2.5% or ±.25p max, whichever is larger. Solderability Q R Withstand voltage 3p: Q 1 <3p: Q 4+2 1,MΩ or 5MΩ µ min, whichever is smaller Resists without problem Ni/Br termination: 9% min g/pd termination: 75% min Temperature ppearance No significant change is detected. cycle 4 ±2.5% or ±.25p max, whichever is larger. Q R Withstand voltage 3p: Q 1 <3p: Q 4+2 1,MΩ or 5MΩ µ min, whichever is samller Resists without problem Humidity ppearance No significant change is detected. test 6 ±7.5% or ±.75p max, whichever is larger. Q R 3p: Q 2 <3p: Q 1+1/3 5MΩ or 25MΩ µ min, whichever is smaller High- ppearance No significant change is detected. temperature with loading ±3% or ±.3p max, whichever is larger. 3p: Q 35 Q 1p <3p: Q 275+5/2 <1p: Q 2+1 R 1,MΩ or 5MΩ µ min, whichever is smaller pply a sideward force of 5g(5N) to a PB-mounted sample. lass epoxy PB (t=1.6mm); fulcrum Spacing: 9mm; for 1 seconds. Vibration frequency: 1 to 55(Hz) mplitude: 1.5mm Sweeping condition: Hz/min n X, Y and Z directions: 2 hours each Total 6 hours Soak the sample in 27 ±5 solder for 1±.5seconds( 3) and place in a room at normal temperature and humidity; measure after 24±2hours. (Preheating onditions) Order Temperature Time 1 8 to 1 2minutes 2 15 to 2 2minutes Soak the sample in 23 ±5 Sn62 solder for 4±1second (ycle) Normal room temperature (3min) Lowest operation temperature (3min) Normal room temperature (3min) Highest operation temperature (3min) fter five cycles( 4), measure after 24±2hours. Measure the test sample after storing it 24±2hours at a temperature of 4 ±2 and a relative humidity of 9-95% Rh. for 5+24/ hours. fter applying( 1) twice of the rated voltage at a temperature of 125±3 for 1+48/ hours, measure the sample after storing 24±2hours. 1 or the, use 1.5 times when the rated voltage is 5V; use a 1.2 times when the rated voltage exceeds 1V. The charge and discharge current of the capacitor must not exceed 5m. 2 xcept T 3 3±.5 seconds for Silver Palladium terminations. 4 1 cycles for Nickel Barrier termination N. (lumina Substrate) 5 or the over 1V, apply 5V for 1minute at normal room temperature and humidity. 6 xclude capacitors with rated voltage of over 2V.

9 Test onditions and Standards Test conditions and Specification for High ielectric Type (X5R, X7R, Y5V & Y5U) Test tems apacitance Value tanδ(%) nsulation resistance (R) Specification X7R/X5R Y5U Y5V Within tolerance 2.5%max, 3.5%max( 2).4%max( 13), 5.%max( 3) 5.%max( 12) 1,MΩ or 5MΩ µ max, whichever is less 5.%max, 7.%max( 14) 9.%max( 4), 12.5%max( 5) Test ondition o previous treatment( 9, 15) apacitance ire Vol 1µ 1kHz±1% 1.±.1Vrms >1µ 12Hz±1%.5±.1Vrms Measured after the rated voltage is applied for 2minutes at normal room temperature and humidity. ( 11) ielectric Resistance 1 No problem observed ( 1) pply 2.5 times of the rated voltage for 1 to 5 seconds. ppearance No problem observed Microscope(1 magnification) Termination strength 6 No problem observed Bending strength test 6 No problem observed at 1mm bent Vibration ppearance No significant change is detected. test Within tolerance tanδ(%) Satisfies the initial value. Soldering ppearance No significant change is detected. heat resistance Within ±7.5% Within ±2% Within ±2% Solderability tanδ(%) R Withstand voltage Satisfies the initial value. 1,MΩ or 5MΩ µ max, whichever is smaller Resists without problem Ni/Br termination: 9% min g/pd termination: 75%min Temperature ppearance No significant change is detected. cycle 8 Within ±7.5% Within ±2% Within ±2% tanδ(%) R Withstand voltage Satisfies the initial value. 1,MΩ or 5MΩ µ max, whichever is smaller Resists without problem Humidity ppearance No significant change is detected. test 12 Within ±12.5% Within ±3% Within ±3% tanδ(%) R 2% max of 15% max of initial value initial value 5MΩ or 25MΩ µ max, whichever is smaller High- ppearance No significant change is detected. temperature with loading Within ±12.5% Within ±3% Within ±3% tanδ(%) 2% max of 15% max of initial value initial valueinitial value R 1,MΩ or 5MΩ µ max, whichever is smaller pply a sideward force of 5g(5N) to a PB-mounted sample. lass epoxy PB (t=1.6mm); fulcrum Spacing: 9mm; for 1 seconds. Vibration frequency: 1 to 55(Hz) mplitude: 1.5mm Sweeping condition: Hz/min n X, Y and Z directions: 2 hours each Total 6 hours o previous treatment( 9) Soak the sample in 27 ±5 solder for 1±.5seconds( 7) and place in a room at normal temperature and humidity; measure after 48±4hours. (Preheating onditions) Order Temperature Time 1 8 to 1 2minutes 2 15 to 2 2minutes Soak the sample in 23 ±5 Sn62 solder for 4±1second o previous treatment( 9) (ycle) Normal room temperature (3min) Lowest operation temperature (3min) Normal room temperature (3min) Highest operation temperature (3min) fter five cycles( 8), measure after 48±4hours. o previous treatment( 1) fter storing it at a temperature of 4 ±2 and a relative humidity of 9-95% for 5+24/ hours, measure the sample after storing 48±4hours. o previous treatment( 1) fter applying twice ( 1) of the rated voltage at the highest operating temperature for 1+48/ hours, measure the sample after storing 48±4hours. *1 or, use 1.5 times when the rated voltage is 25V and 5V; Use 1.2 times when the rated voltage exceeds 63V. The charge/discharge current of the capacitor must not exceed 5m. *2 pply to X5R 16V/25V type, X7R 1V/16V type, M316X7R564 to 15(25V type). *3 pply to X5R 6.3V/1V type, T5X7R123 to 223(1V type),x7r 6.3V type. *4 pply to Y5V 16V type, M32Y5V335 to 16 (25V Type). xcept 12.5% for T21Y5V15/16V. *5 pply to Y5V 6.3V/1V type. *6 xclude T with thickness of less than.66mm. *7 3±.5 sec. for gpd termination. *8 1 cycles for Nickel Barrier termination N/R. (lumina Substrate) *9 eep specimen at 15 +/ 1 for one hour, leave specimen at room ambient for 48±4 hours. *1 pply the same test condition for one hour, then leave the specimen at room ambient for 48±4 hours. *11 or the over 1V, apply 5V for 1 minutes at room ambient. *12 xclude capacitors with rated voltage of over 2V. *13 apply to. *14 pply to 25V of M15 Y5V 154 over, M21Y5V15 over, 316Y5V155 over. *15 Measurement condition 1kHz, 1Vrms for Y5V, < 47µ type.

10 imensions imensions L W T P P~P xternal imensions P xternal Terminations lectrode Tape & Reel Size O J O imensions (mm) L W P min P max P to P min T max ±.3.3± ±.5.5± ±.1.8± ± ± ±.2 1.6± ±.2 2.5± ±.3 2.± ±.3 3.2± ±.4 2.± ±.4 5.± X43 Type L : 4.7±.4mm T21, T316 : (L) 3.2±.2mm and (W)1.6±.2mm T (Thickness) depends on capacitance value. Standard thickness is shown on the appropriate product pages. R 15, 21 size (L)(W)(T) Tolerance ±.15mm (please refer product specifications) Bulk assette Size (mm) L W T P P to P min max min ±.7.8±.7.8± ± ±.1.6±.1/1.25± ±.1 1.6±.1.6±

11 Packaging Options Tape and Reel Reel R W2 W1 B Reel (code : T) ode Reel 7-inch Reel (O : T, H) 13-inch Reel (O : L, N) ode Reel 7-inch Reel (O : T, H) 13-inch Reel (O : L, N) B 178±2. φ6min 33±2. φ1±1. (Unit : mm) 13±.5 21±.8 W1 W2 R 1.±1.5 2.± max ±1. arrier tape (Paper arrier Tape) arrier tape width 8mm. or size 42(188) or over, Tape width 12mm and W1 : 14±1.5, W2 : 2.5mm max arrier Tape Type ode B (Unit : mm) eed Hole J Punched rectangular hole to hold capacitor 3 (.6.3).37±.3.67±.3 5 (1..5).65± ±.1 15 (1.6.8) 1.±.2 1.8±.2 B 12 ( ) 1.5±.2 2.3±.2 13 ( ) 2.±.2 3.6±.2 H 1.1max 21 ( ) 1.5±.2 2.3± ( ) 2.±.2 3.6±.2 (Plastic arrier Tape) eed Hole J Rectangular hole to accept capacitor 2.8max 32 ( ) 2.9±.2 3.6±.2 42 (4.5 2.) 2.4±.2 4.9±.2 43 ( ) 3.6±.2 4.9±.2 52 (5.7 2.) 2.4±.2 6.±.2 55 (5.7 5.) 5.3±.2 6.±.2 B max 5 or X type, B : 5.2±.2mm (Unit : mm) Package quantity (Shown on the appropriate product pages.) Bulk assette H.6max (Unit : mm) Slider Shutter 11 onnection rea ode arrier Tape Paper 8mm 8mm Plastic 12mm ode arrier Tape Paper 8mm Plastic Package Quantity M5 is optional 8mm 12mm or 3, 5type, : 2.±.5mm 8.±.3 3.5±.5 4.± ±.1 12.±.3 5.5±.5 8.±.1 H J 2.±.5 4.± or 42type, 52type : 4.±.1mm Type Thickness (mm) Quantity per case (pcs) 5.5 5, , , ,

12 Precautions ircuit esign 1. Once application and assembly environments have been checked, the capacitor may be used in conformance with the rating and performance which are provided in both the catalog and the specifications. Use exceeding that which is specified may result in inferior performance or cause a short, open, smoking, or flaming to occur, etc. 2. Please consult the manufacturer in advance when the capacitor is used in devices such as: devices which deal with human life, i.e. medical devices; devices which are highly public orientated; and devices which demand a high standard of liability. ccident or malfunction of devices such as medical devices, space equipment and devices having to do with atomic power could generate grave consequence with respect to human lives or, possibly, a portion of the public. apacitors used in these devices may require high reliability design different from that of general purpose capacitors. 3. Please use the capacitors in conformance with the operating temperature provided in both the catalog and the specifications. Be especially cautious not to exceed the maximum temperature. n the situation the maximum temperature set forth in both the catalog and specifications is exceeded, the capacitor s insulation resistance may deteriorate, power may suddenly surge and short-circuit may occur. The capacitor has a loss, and may self-heat due to equivalent resistance when alternating electric current is passed therethrough. s this effect becomes especially pronounced in high frequency circuits, please exercise caution. When using the capacitor in a (self-heating) circuit, please make sure the surface of the capacitor remains under the maximum temperature for usage. lso, please make certain temperature rises remain below 2º. 4. Please keep voltage under the rated voltage which is applied to the capacitor. lso, please make certain the peak voltage remains below the rated voltage when voltage is super-imposed to the voltage. n the situation where or pulse voltage is employed, ensure average peak voltage does not exceed the rated voltage. xceeding the rated voltage provided in both catalog and specifications may lead to defective withstanding voltage or, in worst case situations, may cause the capacitor to smoke or flame. 5. When the capacitor is to be employed in a circuit in which there is continuous application of a high frequency voltage or a steep pulse voltage, even though it is within the rated voltage, please inquire to the manufacturer. n the situation the capacitor is to be employed using a high frequency voltage or a extremely fast rising pulse voltage, even though it is within the rated voltage, it is possible capacitor reliability will deteriorate. 6. t is a common phenomenon of high-dielectric products to have a deteriorated amount of static electricity due to the application of voltage. ue caution is necessary as the degree of deterioration varies depending on the quality of capacitor materials, capacity, as well as the load voltage at the time of operation. 7. o not use the capacitor in an environment where it might easily exceed the respective provisions concerning shock and vibration specified in the catalog and specifications. n addition, it is a common piezo phenomenon of high dielectric products to have some Voltage due to vibration or to have noise due to Voltage change. Please contact sales in such case. 8. f the electrostatic capacity value of the delivered capacitor is within the specified tolerance, please consider this when designing the respective product in order that the assembled product function appropriately. Storage 1. f the component is stored in minimal packaging (a heat-sealed or chuck-type plastic bag), the bag should be kept closed. Once the bag has been opened, reseal it or store it in a desiccator. 2. eep storage place temperature +5 to +35 degree, humidity 45 to 7% RH. 3. The storage atmosphere must be free of gas containing sulfur and chlorine. lso, avoid exposing the product to saline moisture. f the product is exposed to such atmospheres, the terminals will oxidize and solderability will be effected. 4. Precautions 1)-3) apply to chip capacitors packaged in carrier tapes and bulk cases. 5. The solderability is assured for 12 months from our final inspection date (six months for silver palladium) if the above storage precautions are followed. 6. hip capacitors may crack if exposed to hydrogen (H2) gas while sealed or if coated with silicon, which generates hydrogen gas.

13 Surface Mounting nformation imensions for recommended typical land b Land Pattern Sample capacitor a Soldering resist When mounting the capacitor to the substrate, it is important to consider carefully that the amount of solder (size of fillet) used has a direct effect upon the capacitor once it is mounted. a) The greater the amount of solder, the greater the stress to the elements. s this may cause the substrate to break or crack, it is important to establish the appropriate dimensions with regard to the amount of solder when designing the land of the substrate. b) n the situation where two or more devices are mounted onto a common land, separate the device into exclusive pads by using soldering resist c (Unit : mm) Size L W a b c to.35.2 to.3.25 to to.5.35 to.45.4 to to 1..8 to 1..6 to to to to to to to to to to to to to to to to to to to to to to 4.7 : Please refer product specifications. N/R utomotire Series (Unit : mm) Size L W a b c to.9.8 to 1..7 to to to to to to to 1.8 deal Solder Thickness ;; ; hip apacitor T/3 to T/2 ; Solder T Typical mounting problems PB tem Poor example Recommended example/separated by solder resist Multiple parts mount Solder resist Solder resist Mount with leaded parts Leaded parts Leaded parts Wire soldering after mounting Wire Soldering iron Solder resist Solder resist Solder resist Overview

14 Surface Mounting nformation Mounting esign The chip could crack if the PB warps during processing after the chip has been soldered. Recommended chip position on PB to minimize stress from PB warpage (Not recommended) (deal) ctual Mounting 1) f the position of the vacuum nozzle is too low, a large force may be applied to the chip capacitor during mounting, resulting in cracking. 2) uring mounting, set the nozzle pressure to a static load of 1 to 3 gf. 3) To minimize warpage of the PB from the shock of the vaccum nozzle, provide a support pin on the back of the PB to minimize PB flexture. rack Support pin 4) When the positioning hook begins to wear, unstable force may be applied to the chip, resulting in cracking. 5) To reduce the possibility of chipping and cracks, minimize vibration to chips stored in a bulk case. 6) The discharge pressure must be adjusted to the part size. Verify the pressure during setup to avoid fracturing or cracking the chips. Resin Mold 1) f a large amount of resin is used for molding the chip, cracks may occur due to contraction stress during curing. To avoid such cracks, use a low shrinkage resin. 2) The insulation resistance of the chip will degrade due to moisture absorption. Use a low moisture absorption resin. 3) heck carefully that the resin does not generate a decomposition gas or reaction gas during the curing process or during normal storage. Such gases may crack the chip capacitor or damage the device itself.

15 Surface Mounting nformation Soldering Method 1) eramic is easily damaged by rapid heating or cooling. f some heat shock is unavoidable, limit the temperature difference ( T) to within 13. 2) Please see our recommended soldering conditions. PB Mounting Precautions f the PB becomes excessively bent either before or after mounting of the chip capacitor, the chip capacitor may crack or chip. Take precautions to reduce PB flexure. Special Precautions for Using Soldering rons Preheat the capacitors to approx. 15. Solder quickly on a hot plate using a soldering iron adjusted to 25 to 28. Reflow 3 25 Temperature Recommendable Temperature Profile Preheat Peak temperature 23 ±5 15seconds maximum More than18, 4seconds maximum ool at normal room temperature after removing from furnace. 6seconds 6seconds Minimize soldering time. Wave 3 25 Preheat ool at normal room temperature Temperature T 23 to to 12sec. 3sec. max q f a chip capacitor smaller than type M316 is used with a wave soldering tank, use the Nickel-barrier type to minimize solder leaching. This may not be necessary with a static soldering tank.) w nsure that the chip capacitor is preheated adequately. e nsure that the temperature difference ( T) does not exceed 13. r ooling after soldering should be as slow as possible. Solding ron 3 25 Preheat ooling Temperature T 25 to to 12sec. 3sec. max o not place the soldering iron on the chip.