Durability and Survivability of Piezoelectric Wafer Active Sensors Mounted on Aluminum Structures for Aerospace Vehicle Health Monitoring
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1 Durability and Survivability of Piezoelectric Wafer Active Sensors Mounted on Aluminum Structures for Aerospace Vehicle Health Monitoring Victor Giurgiutiu, Bin Lin, James Doane University of South Carolina AEROMAT-2005 Integrated Systems Health Monitoring Session 6-9 June 2005, Orlando, FL Acknowledgments: Air Force Office of Scientific Research grant # FA , Capt. Clark Allred, PhD, program manager Air Force Research Laboratory contract through Universal Technologies, Inc. Dr. Blackshire, Dr. Nagy
2 Outline Introduction to piezoelectric wafer active sensors () SHM E/M Impedance Durability and survivability of Temperature cycling Outdoor exposure Submersion exposure Large strains and fatigue loads Conclusions 2
3 Piezoelectric Wafer Active Sensors () Conventional ultrasonic transducer 7 mm PIEZO ELEMENT Rivet head ~ V(t) t t Lamb wave 3 P-wave λ/2
4 Passive Sensors Monitor the health of the structure over time Sensor can listen to the structure but can not interact with the structure SHM Technology Active Sensors Interact with the structure by sending a signal and then listen to the structure s response 4
5 Impedance-based Structural Health Monitoring New Structural Health Monitoring (SHM) method. Real-time structural damage assessment. The electrical impedance of the PZT material can be directly related to the mechanical impedance of a host structural component. The change in the structure s impedance is attributed to the change in integrity of the structure due to damage. The real part of electric impedance is more reactive to damage or changes in the structure s integrity than the imaginary part Electromechanical Impedance is Quality Control Method 0 Re Z, Ohms mm Crack Rivet head Piezoelectric active sensors #1 #2 #3 # Frequency, khz Sensor 1 Sensor 2 Sensor 3 Sensor 4 5 From Dr. Giurgiutiu and Dr. Zagrai s paper
6 Objective Explore the durability and survivability issues on associated with various environmental conditions and fatigue Improve properties, layer deteriorates in time under environmental attacks (temperature, humidity, etc.). Improve properties, layer deteriorates in time under fatigue attacks Bond layer, 0.2-mm thick Substrate structure, 1-mm thick -structure bond layer 6
7 Durability under Thermal Cyclic Temperature (F) Time (min) y (FREE) Initial measurement Oven after 1 cycles Oven after 500 cycles Oven after 0 cycles Oven after 1500 cycles (Bonded) Bonded Oven after 1 cycles Oven after 500 cycles Oven after 0 cycles Oven after 1500 cycles Oven after 1600 cycles Oven after 1700 cycles Re(Z) (Ohms) 0 Oven after 1700 cycles Re(Z) (Ohms)
8 Development of suitable damage metrics and damage identification algorithms The damage index is a scalar quantity that serves as a metric of the damage present in the structure. RMSD Damage Index Re(Z) (Ohms) (Bonded) Bonded Oven after 1 cycles Oven after 500 cycles Oven after 0 cycles Oven after 1500 cycles Oven after 1600 cycles Oven after 1700 cycles RMSD = N 0 Re( Zi) Re( Zi ) N 0 Re( Zi ) 2 2 RMSD Cycles
9 Acoustic Microscope Imaging 00 E/M Impedance 02 Bonded Oven after 1700 cycles Adhesive/ Bad 02 Re(Z) (Ohms) (Bonded) Good Re(Z) Scanning Area: mm x mm Collaboration with Prof. Nagy
10 Outdoor Exposure of Temperature MAX MIN AVE /25/ /25/ /25/2003 1/25/2004 2/25/2004 3/25/2004 4/25/2004 5/25/2004 6/25/2004 7/25/2004 8/25/2004 9/25/2004 (F) 11/25/ /25/2004 1/25/2005 2/25/2005 3/25/2005 4/25/2005 5/25/2005 Rainfall / 25/ / 25/ / 25/ / 25/ / 25/ / 25/ 2004 (inch) 11/ 25/ / 25/ / 25/ / 25/ 2005 Adhesive M-Bond 200- cyanoacrylat e adhesive with catalyst M-Bond AE- 2-part % epoxy system adhesive No coating M-Coat A- Polyurethane M-Coat C-Silicon M-Coat D-Acrylic Protective coating
11 Free Impedance Spectrum under Outdoor Exposure Settling in effect Impedance spectrum (Free 43 ) Baseline 1 week week 20 week 30 week 40 week 50 week 60 week 70 week No significant change Re(Z) Damage index shows the impedance spectrum remains constant. RMSD Damage index (Free 43) Weeks 11
12 Bonded Impedance Spectrum under Outdoor Exposure Settling in effect. Significant change has been recorded. 12 Damage index shows the impedance changes Damage Index ( 22) RMSD Cycles
13 Displacement Field Imaging 00 (Bonded) 60 week 0 Re(Z) Bonded 0 Re(Z) Collaboration with Dr. Blackshire
14 submersion tests Distilled water Saline solution Hydraulic fluid MIL-PRF Synthetic hydrocarbon Hydraulic fluid MIL-PRF Synthetic hydrocarbon Hydraulic fluid MIL-PRF Mineral Aircraft lube oil MIL-PRF-7808L Grade 3 Turbine engine synthetic Aviation kerosene 14 RESULTS: 60 weeks without failure except in saline solution which failed after 15 weeks
15 Impedance Spectrum under Submersion Exposure A little impedance changes in distilled water Distilled Water Baseline 8 week 13 week 28 week 54 week The submerged in saline solution survived only a little over 85days due to the detachment of the soldered connection Re(Z) The corrosive effect of the saline solution Saline Water 1week 3 week 8 week 13 week Re(Z) (Ohms)
16 Large Strain and Fatigue Testing Specimen MTS Testing Machine Data Acquisition PC Large strain specimen Fatigue specimen 1-mm diameter hole 7-mm Wheatstone bridge Impedance Analyzer 16
17 Large-Strain Testing Minimal changes up to 4000 µε (0.84Y) Failure at 7300 µε (1.13Y) Re(z) (Ohms) µε microstrain 4000 microstrain 5000 microstrain 6000 microstrain
18 Fatigue Survivability Tests F1 F2 F3 F4 F5 Max load 24 N 1560 N 1335 N 1156 N 67 N Min load 2 N 156 N 134 N 116 N 7 N Mean load 1157 N 858 N 734 N 636 N 587 N Cycles to failure 178 kc 670 kc 1.3 Mc 6.25 Mc 12.2 Mc Stress concentration Maximum Stress, MPa E+04 1.E+05 1.E+06 1.E+07 Cycles to failure, N
19 Conclusions Piezoelectric wafer active sensors () are a promising technology for active structural health monitoring Durability and survivability of Temperature cycling Outdoor exposure Submersion exposure Large strains and fatigue loads Further work needs to be performed to better understand and gain confidence in this emerging technology 19
20 20 Thank you!
V. 1 (p.1 of 10) / Color: No / Format: Letter / Date: 2/11/2015 6:50:23 PM. SPIE USE: DB Check, Prod Check, Notes: ABSTRACT 1.
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