The structural characteristics of microengineered bridges

Size: px
Start display at page:

Download "The structural characteristics of microengineered bridges"

Transcription

1 351 The structural characteristics of microengineered bridges J S Burdess 1, A J Harris 2, D Wood 3 and R Pitcher 4 1 Department of Mechanical, Materials and Manufacturing Engineering, University of Newcastle, Newcastle upon Tyne, UK 2 Department of Electrical Engineering, University of Newcastle, Newcastle upon Tyne, UK 3 School of Engineering Science, University of Durham, UK 4 Druck Limited, Groby, Leicester, UK Abstract: The paper considers the measurement of Young's modulus and internal stress in microengineered bridge structures. Values determined from the results of static tests, obtained from the measurement of compliance using a nanoindenter, are compared with values derived from natural frequency measurements obtained from dynamic testing using a laser vibrometer. Both test procedures use mathematical models ` tted' to experimental data to estimate Young's modulus and internal stress. For the case of boron-doped silicon bridges the dynamic test method is shown to produce the superior estimates. Keywords: doping microbridge, tension, Young's modulus, nanoindenter, natural frequency, silicon, boron NOTATION 1 INTRODUCTION a b C E f h i J k l u x z non-dimensional position of the point of application of force bridge width compliance function Young's modulus function bridge thickness integer performance index non-dimensional stress parameter length of the bridge bridge displacement position on the bridge frequency equation factor Dirac delta function " error in a non-dimensional position on the bridge density stress! natural frequency The MS was received on 5 October 1998 and was accepted after revision for publication on 10 February *Corresponding author: Department of Mechanical, Materials and Manufacturing Engineering, University of Newcastle, Stephenson Building, Newcastle upon Tyne NE1 7RU, UK. When considering the static and dynamic behaviours of microengineered structures it is important to know the values of Young's modulus E of deposited or doped material and the internal stress caused by the fabrication process. It is well known [1, 2] that the di usion of boron into silicon to create an etch stop layer will introduce tensile stresses in the material of 60±80 MPa. Such stressses `sti en' the structure and can have a profound e ect on batch-to-batch repeatability of properties as sensor scale factor and resonant behaviour [3]. For the purposes of inspection and testing, at the wafer stage and onwards, it may be important to assess such a set of parameters, which can then be used as indicators of device quality and reproducibility. For this case an understanding of the requirements and limitations of the testing process is important. In this work, values for E and have been determined for boron-doped silicon and spun-on polyimide by considering the static and dynamic characteristics of a bridge structure. The methods described are based upon measurements of the bridge's natural frequencies using a laser vibrometer system [4] (dynamic method) and a measurement of its point compliance function using a Burkovich nanoindenter [5] (static method). It is important to compare the static and the dynamic C07998 ß IMechE 2000 Proc Instn Mech Engrs Vol 214 Part C

2 352 J S BURDESS, A J HARRIS, D WOOD AND R PITCHER methods of testing, as it is unclear, at this stage, which methodology o ers the most convenient and accurate approach. In this respect the work complements and extends the work presented in reference [6] where Young's modulus was determined from microcantilevers which are de ected by a nanoindenter. The work undertaken by Zhang et al. [7] has demonstrated the use of a frequency approach based upon two modes of vibration. However, for structures which are highly stressed, more measured natural frequencies are required in order to separate the e ects caused by elasticity and internal stress. Also an assessment of the uncertainty in the estimation of elasticity and stress is also an important requirement if either testing methodology is to be used as part of an inspection process. For example there is always an uncertainty in the precise nature of the structure's connection with its substrate and in the case of bridge-type structures this can be regarded as an error in the beam length. Likewise errors corresponding to thickness, sti ness and frequency uncertainties must be evaluated. In this work the non-linear behaviour of bridge structures [8, 9], caused by the e ect of elasticity at `large' amplitudes of vibration, is avoided by keeping excitation amplitudes at resonance su ciently small. Temporal relaxation of internal stress [9] caused by ageing of the boron structures did not appear to be a problem, but this was not speci cally investigated. The procedures described rely only on the construction of a bridge structure to form a test piece and the method can be used to characterize other materials and composites formed from successive deposition of different material layers. In addition the bridge structure could be included on production wafers containing MEMS and used as test pieces to provide a quality assessment of a production process. de ection u and the point compliance C at the position ˆ x=l can be derived from the k2 u ˆ 12Fl 4, a Ebh3 p where k ˆ 12l 2 = Eh 2 and a ˆ x 0 =l: For this case the compliance at the point of application of the force is given by C a,, E ˆu a F ˆ l f k, a bh k 1 where the function f k, a is given in detail in the Appendix. When the factor k 1, i.e. the internal stress is large, the bridge behaves like a taut string and bending e ects can be neglected. For this situation the compliance is independent of E and equation (1) reduces to the simple form C a,, E ˆ l a 1 a bh 2 These theoretical values can now be compared with the experimental values of the compliance, C e a, measured at regular spaced intervals along the length of the bridge, to form an error function J s ˆ X C e a C a,, E Š 2 3 a The summation in equation (3) is taken over the set of measurement points. Estimates for and E are found by minimizing J s in a least-squares sense. 2 THEORY 2.1 Static method Figure 1 shows a bridge structure of length l, crosssection bh and density subjected to a point force F applied at a location distance x 0 from the end x ˆ 0. When the bridge has internal axial stress [10], the 2.2 Dynamic method By applying simple beam theory to a bridge structure having an internal stress [11], it can be shown that the natural frequencies! n of the bridge are given by the solutions to z 2 2 z2 1 2z 1 z 2 sinh z 1 sin z 2 cosh z 1 cos z 2 1 ˆ 0 4 Fig. 1 Bridge Proc Instn Mech Engrs Vol 214 Part C C07998 ß IMechE 2000

3 THE STRUCTURAL CHARACTERISTICS OF MICROENGINEERED BRIDGES 353 where the factors z 1 and z 2 are determined by! n and are the roots of z 4! 2 s! 2 z 2! 2 n b! 2 ˆ 0 5 b p In equation (5) the factors! s ˆ p = l 2 and! b ˆ Eh 2 = 12l 4 can be interpreted as frequencies which determine the taut string and beam behaviours respectively of the bridge. Thus the natural frequencies! n can be regarded as a function of the two unknown quantities! s and! b and, if! ne represent a set of measured values of! n, a mean square error function J! ˆ X! ne! n! s,! b Š 2 6 n can be de ned. This function is minimized to nd! s and! b, and and E are found from the de nitions of! s and! b once the dimensions of the bridge and the material density have been speci ed. 3 MEASUREMENTS Bridge structures were etched from the [110] surface of a silicon wafer of thickness 300 mm using KOH as the etchant and boron doping as an etch stop [12]. The bridges were oriented so that their lengths coincided with the [100] direction and were etched from a cavity, the four walls of which de ne the [111] planes. Two bridges were produced and these were 2.2 and 3.6 mm long (l ), 0.2 mm wide (b) and3mm thick (h). Figures 2 and 3 show scanning electron microscopy plan and edge photographs of the 2.2 mm beam and these were used to estimate values for its length, width and thickness. The errors associated with length, width and Fig. 2 Bridge structure thickness are of the order of 2, 2 and 5 per cent respectively. At a later date, bridge structures manufactured from polyimide were supplied by British Aerospace (Sowerby) and these had dimensions l ˆ 3:5 mm, b ˆ 0:5mm and h ˆ 19 mm: These bridges were produced from a spun-on Hitachi polyimide varnish-type PIQL-150 which was baked at 360 C: 3.1 Static tests Fig. 3 Bridge thickness These tests were only carried out using the silicon bridges, and the compliance function C e a was found by applying loads to each bridge using a Burkovich nanoindenter. The indenter is a precision piece of experimental equipment and is normally used to measure the load versus indentation characteristics of either a material or a surface lm. It is capable of measuring loads as small as a few micronewtons and displacements of the order of nanometres. A full description of the indenter used in these tests has been given in reference [5]. Using the indenter's X±Y table and viewing facilities the end of the bridge was located and a datum point for a set of local coordinates established. In the case of the shorter bridge the indenter was programmed to perform loading and unloading `load versus displacement' tests at intervals of ˆ 0:1 mm along the bridge length. For the longer bridge the data were collected at ˆ 0:2mm intervals. Figure 4 shows a typical load versus displacement plot taken on the 2.2 mm bridge for a nominal location 0.3 mm from the datum point. On loading, the plot is initially non-linear and this is because the ne point of the indenter penetrates into the bridge's surface. Thereafter the curve tends to converge towards a C07998 ß IMechE 2000 Proc Instn Mech Engrs Vol 214 Part C

4 354 J S BURDESS, A J HARRIS, D WOOD AND R PITCHER Fig. 4 Load versus displacement curve for the 2.2 mm bridge at the location x 0 ˆ 0:3mm straight line. During unloading, the curve is linear but does not follow exactly the same gradient as the loading curve. This is attributed to the perfect elastic recovery of the material during unloading as opposed to the inelastic conditions that occur during the loading phase. The indenter is thus programmed to t a `best' straight line to the unloading curve, and the compliance C e a at the measuring point is calculated from the gradient of this line. The compliance calculated from a best straight-line t of the loading curve is useful and is used to provide an estimate of the compliance error. This error is typically of the order of 8 per cent for measurement points located at the end regions of the bridge to about 2 per cent for points located in the central region. Due to the poor de nition of the end of the bridge it was very di cult to locate the datum point precisely and there is an o set error associated with the load point parameter a. To represent this unknown o set a small parameter " is introduced and a is written in the form a ˆ " i l 7 where i is the point number associated with the loading test and is the increment length. The error function (3) is modi ed to include " and the minimization of J s is achieved using the MATLAB [13] non-linear leastsquares routine `curve t' using ", and E as the unknown parameters. When the compliance function is de ned by equation (1) the procedure fails to predict values for E and. However, when equation (2) was used in the expression for J e, the `curve t' routine was successful and the procedure gave stress values of and MPa for the 2.2 and 3.6 mm beams respectively. Figure 5 shows the correlation between the estimated compliance (2) and the measured data associated with the 3.6 mm bridge. The errors in the above values are estimated by repeated application of the `curve t' routine assuming l, h, b and C e to be uniformly distributed random variables over their respective error ranges. The problem associated with the use of the compliance function given by equation (1) is due to the high value of stress within the bridge. Using the values of stress predicted from equation (2) and assuming that E 170 GPa (Young's modulus for undoped silicon), the factor k is of the order of 80 and is thus much greater than unity. In such circumstances the bridge behaves as an ideal taut string and the compliance is essentially independent of E. This independence of E was agged by MATLAB, which issued a warning message that the Jacobian matrix associated with the `curve t' routine was singular. Equation (1) shows that the elasticity of the bridge only becomes important if the curvature of the de ected shape is of the same order as the term k 2 u: The curvatures produced by a `small' point load are not likely to satisfy this requirement when k is large and this, together with the fact that the indentation test is very time consuming to perform, makes the static method an unattractive way of determining both and E. 3.2 Dynamic tests In these tests the bridges were mounted in the laser measurement system shown in Fig. 6. The details of this Proc Instn Mech Engrs Vol 214 Part C C07998 ß IMechE 2000

5 THE STRUCTURAL CHARACTERISTICS OF MICROENGINEERED BRIDGES 355 Fig. 5 Compliance function for the 3.6 mm bridge system have been described fully in reference [4] and here it is su cient to say that the bridge and its substrate are waxed to a piezoelectric disc within the evacuated mount. An alternating voltage applied to the disc excited transverse vibrations into the bridge and these were measured by means of the laser vibrometer. By slowly changing the frequency of the applied voltage with a precision oscillator it was possible to identify the frequencies which produced a resonant response in the bridge. These frequencies could be measured to an accuracy of 10 Hz: The position of the laser spot of the surface of the bridge is generally unimportant although some adjustment was necessary in order to move the spot away from a nodal point. The measured natural frequencies of the 2.2 and 3.6 mm bridges are presented in Table 1. It should be noted here that the measured frequencies are restricted to 250 khz or less due to the limitations of the vibrometer controller. The values of! s and! b (and hence and E ), which minimize the frequency error function J!, are determined from an initial guess by application of the MATLAB [13] functions `fsolve', which determines the natural frequencies! n from equations (4) and (5) for given values of! s and! b, and `curve t', which provides adjusted values for! s and! b so that minimization of J! is achieved. For a given set of measured natural frequencies, such as those shown in Table 1, the `fsolve' and `curve t' routines work well and values of! s and! b are produced which yield frequency matches better than 100 Hz. When the data given in Table 1 are used in this procedure and when the density is taken to be 2330 kg=m 3, the MATLAB algorithms give ˆ 84 2 MPa and E ˆ GPa for the 2.2 mm bridge and ˆ 90 1 MPa and E ˆ GPa for the 3.6 mm beam. As before, the errors in and E are calculated by repeated application of the routines assuming that the Fig. 6 Vibrometer measurement system C07998 ß IMechE 2000 Proc Instn Mech Engrs Vol 214 Part C

6 356 J S BURDESS, A J HARRIS, D WOOD AND R PITCHER Table 1 Measured natural frequencies of silicon bridges Bridge Frequency (khz) for the following mode numbers length (mm) * * measured quantities are random variables uniformly distributed within their error range. The values for the stress compare well with the values obtained from the static tests and other published data [1, 2]. The estimated values of Young's modulus for boron-doped silicon are greater than the value of 166 GPa quoted for [100] undoped silicon [14]. The method of measuring natural frequencies as a means of determining internal stress and Young's modulus is clearly more successful than the method based upon measurements of static compliance. This can be explained by noting that at the higher natural frequencies the mode shape of vibration is approximately u /sin np : For this situation the bridge will only vibrate like a taut string if k= np l: For a given value of k this inequality shows that bridge elasticity becomes more important at the higher mode numbers. Thus, for a bridge with `high' internal stress, it is important to measure as many natural frequencies as possible. For example if the 2.2 mm bridge is considered, calculation of and E using the two lowest modes gives a reasonable estimate for stress, 86 MPa, but a low estimate for Young's modulus, E 134 GPa: As more modes are introduced into the calculation, the results converge to the values quoted above. Vibration tests similar to those described above were carried out on the polyimide bridge and the results shown in Table 2 were obtained. From these data, and taking the density to be 1379 kg=m 3, the internal stress and Young's modulus for the spun-on polyimide specimen were found to be ˆ 6:99 0:16 MPa and E ˆ 8:56 1:36 GPa respectively. An analysis of the errors in the evaluation of Young's modulus shows that, for the silicon and polyimide bridges, the major error Table 2 Mode number Measured natural frequencies of the polyimide bridge Frequency (khz) 1 11:57 0: :17 0: :51 0: :17 0: :65 0: :06 0:25 contribution comes from the estimation of the thickness h of the bridge. In order to calculate and E a value for the material density must be known and this is a disadvantage of this procedure. However, if E could be estimated from compliance tests on an annealed cantilever (in this case no internal stress is present), then can be treated as the unknown variable and found. 4 CONCLUSIONS The paper has considered the measurement of internal stress and Young's modulus of boron-doped silicon by considering the static and dynamic behaviours of a bridge structure. The procedure based upon the static response of the beam uses compliance measurements derived from nanoindenter tests to predict the internal stress. The values of internal stress are predicted to be and MPa for the samples tested and these values compare well with published data. Young's modulus is not predicted by this method because the high value of the internal stress causes the bridge to behave like a taut string rather than a exurally sti beam. The method using the dynamic response of the bridge utilizes measurements of natural frequency as the determining quantity and for the structures tested gives values of 84 2 and 90 1 MPa for internal stress and and GPa for Young's modulus. These values compare well with other published data. The dynamic method overcomes the problem of high stress by measuring the response of the higher modes of vibration where bending e ects start to become signi cant. The measurement of as many natural frequencies as possible is shown to be important for estimation of Young's modulus. For the polyimide bridge the dynamic method gives the internal stress and Young's modulus to be 6:99 0:16 MPa and 8:56 1:36 GPa respectively. The measurement of the thickness of the bridge is the principal source of error associated with the estimation of Young's modulus. Vibration tests were much simpler to perform than the static tests and are shown to produce superior results. A disadvantage of the dynamic test is that a value for material density is needed. Proc Instn Mech Engrs Vol 214 Part C C07998 ß IMechE 2000

7 THE STRUCTURAL CHARACTERISTICS OF MICROENGINEERED BRIDGES 357 ACKNOWLEDGEMENT The authors would like to express their thanks to the Engineering and Physical Sciences Research Council for providing the funding for this work under the Mechanical Characterization of Micromechanical Structures GR/J43356 Contract. REFERENCES 1 Bourouina, T., Vauge, C. and Hekki, H. Variational method for tensile stress evaluation and application to heavily boron-doped square shaped diaphragms. Sensors and Actuators A, June 1995, 49(1±2), 21±27. 2 Ding, X., Ko, W. H. and Mansour, J. M. Residual stress and mechanical properties of boron-doped p** plus-silicon lms. Sensors and Actuators A, April 1990, 23(1±3), 866± Burdess, J. S., Harris, A. J., Cruickshank, J. J., Wood, D. and Cooper, G. Silicon membrane gyroscope with electrostatic actuation and sensing. In Micromechanical and Microfabrication Process Technology, Proceedings of the SPIE, Vol. 2642, 1995, pp. 74±83 (SPIE, Bellingham, Washington). 4 Burdess, J. S., Harris, A. J., Wood, D., Pitcher, R. J. and Glennie, D. A system for the mechanical characterisation of microstructures. J. Microelectromech. Systems, December 1997, 6(4). 5 Page, T. F., Oliver, W. C. and McHargue, C. J. The deformation behaviour of ceramic crystals subjected to very low load (nano) indentations. J. Mater. Res., February 1992, 7(2), 450± Weighs, T. P., Hong, S., Bravman, J. C. and Nix, W. D. Mechanical de ection of cantilever microbeams: a new technique for testing the mechanical properties of thin lms. J. Mater. Res., September±October 1988, 3(5), 931± Zhang, L. M., Uttamchandi, D. and Culshaw, B. Measurement of the mechanical properties of silicon microresonators. Sensors and Actuators A, 1991, 29, 79±84. 8 Zook, J. D., Burns, D. W., Guckel, H., Sniegowski, J. J., Engelstad, R. L. and Feng, Z. Characteristics of polysilicon resonant microbeams. Sensors and Actuators A, 1992, 35, 51±59. 9 Pember, A., Smith, J. and Kemhadjian, H. Long term stability of silicon bridge oscillators fabricated using the boron etch stop. Sensors and Actuators A, 1995, 46±47, 51± Roark, R. R. Formulas for Stress and Strain (McGraw-Hill, New York). 11 Rao, S. S. Mechanical Vibrations, 1986 (Addison-Wesley, Reading, Massachusetts). 12 Marden, M. Fundamentals of Microfabrication, 1997 (CRC Press, Boca Raton, Florida). 13 MATLAB, Optimization Toolbox, User's Guide, 1996 (The Math Works Incorporated). 14 Auld, B. A. Acoustic Fields and Waves in Solids, Vol. 2, 1973 (John Wiley, New York). APPENDIX The compliance function f k, a for a bridge structure with internal stress is given by f k, a ˆ where C 4 C a3 C 3 C a4 cosh ka 1Š C 3 C a3 C 2 C a4 sinh ka kaš C 2 3 C 2C 4 C 2 ˆ sinh k, C 3 ˆ cosh k 1, C 4 ˆ sinh k k C a3 ˆ cosh k 1 a Š 1 C a4 ˆ sinh k 1 a Š k 1 a C07998 ß IMechE 2000 Proc Instn Mech Engrs Vol 214 Part C

8

December 1999 FINAL TECHNICAL REPORT 1 Mar Mar 98

December 1999 FINAL TECHNICAL REPORT 1 Mar Mar 98 REPORT DOCUMENTATION PAGE AFRL-SR- BL_TR " Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instruct the collection

More information

Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications

Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications Sensor devices Outline 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications Introduction Two Major classes of mechanical

More information

Dynamic response of tubular joints with an annular void subjected to a harmonic torsional load

Dynamic response of tubular joints with an annular void subjected to a harmonic torsional load SPECIAL ISSUE PAPER 361 Dynamic response of tubular joints with an annular void subjected to a harmonic torsional load A Vaziri and H Nayeb-Hashemi* Department of Mechanical, Industrial and Manufacturing

More information

10 Measurement of Acceleration, Vibration and Shock Transducers

10 Measurement of Acceleration, Vibration and Shock Transducers Chapter 10: Acceleration, Vibration and Shock Measurement Dr. Lufti Al-Sharif (Revision 1.0, 25/5/2008) 1. Introduction This chapter examines the measurement of acceleration, vibration and shock. It starts

More information

Lecture 20. Measuring Pressure and Temperature (Chapter 9) Measuring Pressure Measuring Temperature MECH 373. Instrumentation and Measurements

Lecture 20. Measuring Pressure and Temperature (Chapter 9) Measuring Pressure Measuring Temperature MECH 373. Instrumentation and Measurements MECH 373 Instrumentation and Measurements Lecture 20 Measuring Pressure and Temperature (Chapter 9) Measuring Pressure Measuring Temperature 1 Measuring Acceleration and Vibration Accelerometers using

More information

EE C245 ME C218 Introduction to MEMS Design

EE C245 ME C218 Introduction to MEMS Design EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 16: Energy

More information

CONSIDERATIONS ON NANOHARDNESS MEASUREMENT

CONSIDERATIONS ON NANOHARDNESS MEASUREMENT CONSIDERATIONS ON NANOHARDNESS MEASUREMENT Z. Rymuza 1, M. Misiak 1 and J.T. Wyrobek 2 1 Institute of Micromechanics and Photonics, Department of Mechatronics Warsaw University of Technology, Chodkiewicza

More information

MODELING OF T-SHAPED MICROCANTILEVER RESONATORS. Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Cané

MODELING OF T-SHAPED MICROCANTILEVER RESONATORS. Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Cané Stresa, Italy, 5-7 April 007 MODELING OF T-SHAPED MICROCANTILEVER RESONATORS Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Centro Nacional de Microelectrónica

More information

Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving

Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving Presented at the COMSOL Conference 2009 Milan University of Brescia Department of Electronics for Automation Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving Marco Baù, VF V.

More information

Determining thermal noise limiting properties of thin films

Determining thermal noise limiting properties of thin films Determining thermal noise limiting properties of thin films Courtney Linn Institute for Gravitational Research University of Glasgow Summer 2011 Abstract In order to make thermally stable mirrors to be

More information

Reduced-order modelling and parameter estimation for a quarter-car suspension system

Reduced-order modelling and parameter estimation for a quarter-car suspension system 81 Reduced-order modelling and parameter estimation for a quarter-car suspension system C Kim and PIRo* Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North

More information

Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM).

Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM). Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM). Byoungyoul Park 1, Tao Chen 1, Cyrus Shafai 1 1 Electrical and Computer Engineering, University of

More information

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4 Issued: Wednesday, Mar. 5, 2014 PROBLEM SET #4 Due (at 9 a.m.): Tuesday Mar. 18, 2014, in the EE C247B HW box near 125 Cory. 1. Suppose you would like to fabricate the suspended cross beam structure below

More information

Characterization of MEMS Devices

Characterization of MEMS Devices MEMS: Characterization Characterization of MEMS Devices Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap Characterization of MEMS

More information

Finite Element Analysis of Piezoelectric Cantilever

Finite Element Analysis of Piezoelectric Cantilever Finite Element Analysis of Piezoelectric Cantilever Nitin N More Department of Mechanical Engineering K.L.E S College of Engineering and Technology, Belgaum, Karnataka, India. Abstract- Energy (or power)

More information

Modeling, Simulation and Optimization of the Mechanical Response of Micromechanical Silicon Cantilever: Application to Piezoresistive Force Sensor

Modeling, Simulation and Optimization of the Mechanical Response of Micromechanical Silicon Cantilever: Application to Piezoresistive Force Sensor Available online at www.sciencedirect.com ScienceDirect Physics Procedia 55 (2014 ) 348 355 Eight International Conference on Material Sciences (CSM8-ISM5) Modeling, Simulation and Optimization of the

More information

Integrating MEMS Electro-Static Driven Micro-Probe and Laser Doppler Vibrometer for Non-Contact Vibration Mode SPM System Design

Integrating MEMS Electro-Static Driven Micro-Probe and Laser Doppler Vibrometer for Non-Contact Vibration Mode SPM System Design Tamkang Journal of Science and Engineering, Vol. 12, No. 4, pp. 399 407 (2009) 399 Integrating MEMS Electro-Static Driven Micro-Probe and Laser Doppler Vibrometer for Non-Contact Vibration Mode SPM System

More information

MEMS Mechanical Fundamentals

MEMS Mechanical Fundamentals ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING MEMS Mechanical Fundamentals Dr. Lynn Fuller webpage: http://people.rit.edu/lffeee Electrical and Microelectronic Engineering Rochester Institute

More information

Lecture 19. Measurement of Solid-Mechanical Quantities (Chapter 8) Measuring Strain Measuring Displacement Measuring Linear Velocity

Lecture 19. Measurement of Solid-Mechanical Quantities (Chapter 8) Measuring Strain Measuring Displacement Measuring Linear Velocity MECH 373 Instrumentation and Measurements Lecture 19 Measurement of Solid-Mechanical Quantities (Chapter 8) Measuring Strain Measuring Displacement Measuring Linear Velocity Measuring Accepleration and

More information

1. Narrative Overview Questions

1. Narrative Overview Questions Homework 4 Due Nov. 16, 010 Required Reading: Text and Lecture Slides on Downloadable from Course WEB site: http://courses.washington.edu/overney/nme498.html 1. Narrative Overview Questions Question 1

More information

Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing

Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing ScieTech 014 Journal of Physics: Conference Series 495 (014) 01045 doi:10.1088/174-6596/495/1/01045 Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing H. F. Hawari, Y. Wahab,

More information

1106. Numerical investigation of dynamical properties of vibroactive pad during hot imprint process

1106. Numerical investigation of dynamical properties of vibroactive pad during hot imprint process 1106. Numerical investigation of dynamical properties of vibroactive pad during hot imprint process B. Narijauskaitė 1, A. Palevičius 2, G. Janušas 3, R. Šakalys 4 International Studies Centre, Kaunas

More information

9-11 April 2008 Measurement of Large Forces and Deflections in Microstructures

9-11 April 2008 Measurement of Large Forces and Deflections in Microstructures 9-11 April 28 Measurement of Large Forces and Deflections in Microstructures Kai Axel Hals 1, Einar Halvorsen, and Xuyuan Chen Institute for Microsystem Technology, Vestfold University College, P.O. Box

More information

SENSOR DEVICES MECHANICAL SENSORS

SENSOR DEVICES MECHANICAL SENSORS SENSOR DEVICES MECHANICAL SENSORS OUTLINE 4 Mechanical Sensors Introduction General mechanical properties Piezoresistivity Piezoresistive sensors Capacitive sensors Applications INTRODUCTION MECHANICAL

More information

874. The squeeze film effect on micro-electromechanical resonators

874. The squeeze film effect on micro-electromechanical resonators 874. The squeeze film effect on micro-electromechanical resonators Shih-Chieh Sun 1, Chi-Wei Chung, Chao-Ming Hsu 3, Jao-Hwa Kuang 4 1,, 4 Department of Mechanical and Electromechanical Engineering National

More information

DESIGN AND SIMULATION OF UNDER WATER ACOUSTIC MEMS SENSOR

DESIGN AND SIMULATION OF UNDER WATER ACOUSTIC MEMS SENSOR DESIGN AND SIMULATION OF UNDER WATER ACOUSTIC MEMS SENSOR Smitha G Prabhu 1, Nagabhushana S *2 1 Dept. Of Electronics and communication, Center for Nano Materials and MEMS, 2 Dept. of Electronics and Communication,

More information

Computation Models for Studying the Dynamic Behaviour of MEMS Structures. Determination of Silicon Dynamic Young s Modulus (E dynamic )

Computation Models for Studying the Dynamic Behaviour of MEMS Structures. Determination of Silicon Dynamic Young s Modulus (E dynamic ) ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY Volume 14, Number 4, 2011, 365 379 Computation Models for Studying the Dynamic Behaviour of MEMS Structures. Determination of Silicon Dynamic Young

More information

Piezoelectric Resonators ME 2082

Piezoelectric Resonators ME 2082 Piezoelectric Resonators ME 2082 Introduction K T : relative dielectric constant of the material ε o : relative permittivity of free space (8.854*10-12 F/m) h: distance between electrodes (m - material

More information

The New Boundary Condition Effect on The Free Vibration Analysis of Micro-beams Based on The Modified Couple Stress Theory

The New Boundary Condition Effect on The Free Vibration Analysis of Micro-beams Based on The Modified Couple Stress Theory International Research Journal of Applied and Basic Sciences 2015 Available online at www.irjabs.com ISSN 2251-838X / Vol, 9 (3): 274-279 Science Explorer Publications The New Boundary Condition Effect

More information

Mechanical characterization of single crystal BaTiO 3 film and insitu. XRD observation of microstructure change due to

Mechanical characterization of single crystal BaTiO 3 film and insitu. XRD observation of microstructure change due to 76 Chapter 4 Mechanical characterization of single crystal BaTiO 3 film and insitu XRD observation of microstructure change due to mechanical loading 4.1 Introduction Ferroelectric materials have many

More information

Strain Measurement. Prof. Yu Qiao. Department of Structural Engineering, UCSD. Strain Measurement

Strain Measurement. Prof. Yu Qiao. Department of Structural Engineering, UCSD. Strain Measurement Strain Measurement Prof. Yu Qiao Department of Structural Engineering, UCSD Strain Measurement The design of load-carrying components for machines and structures requires information about the distribution

More information

Magneto-Mechanical Modeling and Simulation of MEMS Sensors Based on Electroactive Polymers

Magneto-Mechanical Modeling and Simulation of MEMS Sensors Based on Electroactive Polymers Magneto-Mechanical Modeling and Simulation of MEMS Sensors Based on Electroactive Polymers F.J.O. RODRIGUES, L.M. GONÇALVES, J.H. CORREIA, P.M. MENDES University of Minho, Dept. Industrial Electronics,

More information

CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS

CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS 61 CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS 4.1 INTRODUCTION The analysis of cantilever beams of small dimensions taking into the effect of fringing fields is studied and

More information

Natural vibration frequency of classic MEMS structures

Natural vibration frequency of classic MEMS structures Natural vibration frequency of classic MEMS structures Zacarias E. Fabrim PGCIMAT, UFRGS, Porto Alegre, RS, Brazil Wang Chong, Manoel Martín Pérez Reimbold DeTec, UNIJUI, Ijuí, RS, Brazil Abstract This

More information

Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving

Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving Excerpt from the Proceedings of the COMSOL Conference 2009 Milan Contactless Excitation of MEMS Resonant Sensors by Electromagnetic Driving M. Baù *, V. Ferrari, D. Marioli Department of Electronics for

More information

HEALTH MONITORING OF PLATE STRUCTURE USING PIEZO ELECTRIC PATCHES AND CURVATURE MODE SHAPE

HEALTH MONITORING OF PLATE STRUCTURE USING PIEZO ELECTRIC PATCHES AND CURVATURE MODE SHAPE ISSN (Online) : 2319-8753 ISSN (Print) : 2347-6710 International Journal of Innovative Research in Science, Engineering and Technology An ISO 3297: 2007 Certified Organization, Volume 2, Special Issue

More information

Optimizing the Design of Polymer Based Unimorph Actuator using COMSOL Multiphysics Vineet Tiwari, Rashiya Sharma, R. K. Dwivedi and Geetika Srivastava

Optimizing the Design of Polymer Based Unimorph Actuator using COMSOL Multiphysics Vineet Tiwari, Rashiya Sharma, R. K. Dwivedi and Geetika Srivastava Optimizing the Design of Polymer Based Unimorph Actuator using COMSOL Multiphysics Vineet Tiwari, Rashiya Sharma, R. K. Dwivedi and Geetika Srivastava Department of Physics and Materials Science & Engineering

More information

Nonlinear Finite Element Modeling of Nano- Indentation Group Members: Shuaifang Zhang, Kangning Su. ME 563: Nonlinear Finite Element Analysis.

Nonlinear Finite Element Modeling of Nano- Indentation Group Members: Shuaifang Zhang, Kangning Su. ME 563: Nonlinear Finite Element Analysis. ME 563: Nonlinear Finite Element Analysis Spring 2016 Nonlinear Finite Element Modeling of Nano- Indentation Group Members: Shuaifang Zhang, Kangning Su Department of Mechanical and Nuclear Engineering,

More information

Institute for Electron Microscopy and Nanoanalysis Graz Centre for Electron Microscopy

Institute for Electron Microscopy and Nanoanalysis Graz Centre for Electron Microscopy Institute for Electron Microscopy and Nanoanalysis Graz Centre for Electron Microscopy Micromechanics Ass.Prof. Priv.-Doz. DI Dr. Harald Plank a,b a Institute of Electron Microscopy and Nanoanalysis, Graz

More information

PERFORMANCE OF HYDROTHERMAL PZT FILM ON HIGH INTENSITY OPERATION

PERFORMANCE OF HYDROTHERMAL PZT FILM ON HIGH INTENSITY OPERATION PERFORMANCE OF HYDROTHERMAL PZT FILM ON HIGH INTENSITY OPERATION Minoru Kuribayashi Kurosawa*, Hidehiko Yasui**, Takefumi Kanda** and Toshiro Higuchi** *Tokyo Institute of Technology, Dept. of Advanced

More information

Development and Characterization of High Frequency Bulk Mode Resonators

Development and Characterization of High Frequency Bulk Mode Resonators Excerpt from the Proceedings of the COMSOL Conference 008 Hannover Development and Characterization of High Frequency Bulk Mode Resonators Hossein Pakdast 1*, Zachary James Davis 1 1 DTU Nanotech, Technical

More information

Foundations of MEMS. Chang Liu. McCormick School of Engineering and Applied Science Northwestern University. International Edition Contributions by

Foundations of MEMS. Chang Liu. McCormick School of Engineering and Applied Science Northwestern University. International Edition Contributions by Foundations of MEMS Second Edition Chang Liu McCormick School of Engineering and Applied Science Northwestern University International Edition Contributions by Vaishali B. Mungurwadi B. V. Bhoomaraddi

More information

MECH 466. Micro Electromechanical Systems. Laboratory Manual Laboratory #3: Stiction of MEMS and Strength of MEMS Materials

MECH 466. Micro Electromechanical Systems. Laboratory Manual Laboratory #3: Stiction of MEMS and Strength of MEMS Materials MECH 466 Micro Electromechanical Systems Laboratory Manual Laboratory #: Stiction of MEMS and Strength of MEMS Materials Department of Mechanical Engineering, University of Victoria N. Dechev, 2011, University

More information

ANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM BEHAVIOR UNDER THE EFFECT OF EXTERNAL SOLICITATIONS

ANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM BEHAVIOR UNDER THE EFFECT OF EXTERNAL SOLICITATIONS Third International Conference on Energy, Materials, Applied Energetics and Pollution. ICEMAEP016, October 30-31, 016, Constantine,Algeria. ANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM

More information

Vibro-Impact Dynamics of a Piezoelectric Energy Harvester

Vibro-Impact Dynamics of a Piezoelectric Energy Harvester Proceedings of the IMAC-XXVIII February 1 4, 1, Jacksonville, Florida USA 1 Society for Experimental Mechanics Inc. Vibro-Impact Dynamics of a Piezoelectric Energy Harvester K.H. Mak *, S. McWilliam, A.A.

More information

Curvature of a Cantilever Beam Subjected to an Equi-Biaxial Bending Moment. P. Krulevitch G. C. Johnson

Curvature of a Cantilever Beam Subjected to an Equi-Biaxial Bending Moment. P. Krulevitch G. C. Johnson UCRL-JC-30440 PREPRINT Curvature of a Cantilever Beam Subjected to an Equi-Biaxial Bending Moment P. Krulevitch G. C. Johnson This paper was prepared for submittal to the Materials Research Society Spring

More information

Optimal Design and Evaluation of Cantilever Probe for Multifrequency Atomic Force Microscopy

Optimal Design and Evaluation of Cantilever Probe for Multifrequency Atomic Force Microscopy 11 th World Congress on Structural and Multidisciplinary Optimisation 07 th -12 th, June 2015, Sydney Australia Optimal Design and Evaluation of Cantilever Probe for Multifrequency Atomic Force Microscopy

More information

Characterisation Programme Polymer Multi-scale Properties Industrial Advisory Group 22 nd April 2008

Characterisation Programme Polymer Multi-scale Properties Industrial Advisory Group 22 nd April 2008 Characterisation Programme 6-9 Polymer Multi-scale Properties Industrial Advisory Group nd April 8 SE: Improved Design and Manufacture of Polymeric Coatings Through the Provision of Dynamic Nano-indentation

More information

Strain Measurements. Isaac Choutapalli

Strain Measurements. Isaac Choutapalli Note that for axial elongation (Eaxiai > 0), Erransverse (from Equation C.6), and therefore Strain Measurements Isaac Choutapalli Department of Mechanical Engineering The University of Texas - Pan American

More information

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4 Issued: Wednesday, March 4, 2016 PROBLEM SET #4 Due: Monday, March 14, 2016, 8:00 a.m. in the EE C247B homework box near 125 Cory. 1. This problem considers bending of a simple cantilever and several methods

More information

b. The displacement of the mass due to a constant acceleration a is x=

b. The displacement of the mass due to a constant acceleration a is x= EE147/247A Final, Fall 2013 Page 1 /35 2 /55 NO CALCULATORS, CELL PHONES, or other electronics allowed. Show your work, and put final answers in the boxes provided. Use proper units in all answers. 1.

More information

Measurement Techniques for Engineers. Motion and Vibration Measurement

Measurement Techniques for Engineers. Motion and Vibration Measurement Measurement Techniques for Engineers Motion and Vibration Measurement Introduction Quantities that may need to be measured are velocity, acceleration and vibration amplitude Quantities useful in predicting

More information

Abstract. 1 Introduction

Abstract. 1 Introduction In R. A. Adey et al., eds., Simulation and Design of Microsystems and Microstructures (Proceedings of the 1st International Conference on Simulation and Design of Microsystems and Microstructures), Computational

More information

DYNAMIC ROTARY TORQUE MEASUREMENT USING SURFACE ACOUSTIC WAVES

DYNAMIC ROTARY TORQUE MEASUREMENT USING SURFACE ACOUSTIC WAVES DYNAMIC ROTARY TORQUE MEASUREMENT USING SURFACE ACOUSTIC WAVES Abstract A. Lonsdale Technical Director Sensor Technology Ltd The subject of torque measurement has previously been addressed extensively.

More information

Mechanical Characterization of Released Thin Films by Contact

Mechanical Characterization of Released Thin Films by Contact 15 Chapter 2 Mechanical Characterization of Released Thin Films by Contact Loading 2.1 Introduction The design of reliable and functional micro/nano electro mechanical systems (MEMS/NEMS) relies on the

More information

A new cantilever beam-rigid-body MEMS gyroscope: mathematical model and linear dynamics

A new cantilever beam-rigid-body MEMS gyroscope: mathematical model and linear dynamics Proceedings of the International Conference on Mechanical Engineering and Mechatronics Toronto, Ontario, Canada, August 8-10 2013 Paper No. XXX (The number assigned by the OpenConf System) A new cantilever

More information

SENSORS and TRANSDUCERS

SENSORS and TRANSDUCERS SENSORS and TRANSDUCERS Tadeusz Stepinski, Signaler och system The Mechanical Energy Domain Physics Surface acoustic waves Silicon microresonators Variable resistance sensors Piezoelectric sensors Capacitive

More information

Una Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos

Una Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos Una Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos J. F. Cárdenas-García, PhD, PE Becario Prometeo Escuela Politécnica Nacional Quito, ECUADOR 1 of 69 Outline Motivation

More information

A flexoelectric microelectromechanical system on silicon

A flexoelectric microelectromechanical system on silicon A flexoelectric microelectromechanical system on silicon Umesh Kumar Bhaskar, Nirupam Banerjee, Amir Abdollahi, Zhe Wang, Darrell G. Schlom, Guus Rijnders, and Gustau Catalan Supporting Information Figure

More information

Experimental Validation of Damping Model for a MEMS Bistable Electrostatic Energy Harvester

Experimental Validation of Damping Model for a MEMS Bistable Electrostatic Energy Harvester Journal of Physics: Conference Series 557 (24) 24 doi:.88/742-6596/557//24 Experimental Validation of Damping Model for a MEMS Bistable Electrostatic Energy Harvester C H Nguyen, D S Nguyen 2 and E Halvorsen

More information

Module 6: Smart Materials & Smart Structural Control Lecture 33: Piezoelectric & Magnetostrictive Sensors and Actuators. The Lecture Contains:

Module 6: Smart Materials & Smart Structural Control Lecture 33: Piezoelectric & Magnetostrictive Sensors and Actuators. The Lecture Contains: The Lecture Contains: Piezoelectric Sensors and Actuators Magnetostrictive Sensors and Actuators file:///d /chitra/vibration_upload/lecture33/33_1.htm[6/25/2012 12:42:09 PM] Piezoelectric Sensors and Actuators

More information

THE USE OF frequency (rather than amplitude) to encode

THE USE OF frequency (rather than amplitude) to encode 164 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 7, NO. 2, JUNE 1998 Electrothermal Frequency Tuning of Folded and Coupled Vibrating Micromechanical Resonators Richard R. A. Syms Abstract The use of

More information

1 Static Plastic Behaviour of Beams

1 Static Plastic Behaviour of Beams 1 Static Plastic Behaviour of Beams 1.1 Introduction Many ductile materials which are used in engineering practice have a considerable reserve capacity beyond the initial yield condition. The uniaxial

More information

A non-linear elastic/perfectly plastic analysis for plane strain undrained expansion tests

A non-linear elastic/perfectly plastic analysis for plane strain undrained expansion tests Bolton, M. D. & Whittle, R. W. (999). GeÂotechnique 49, No., 33±4 TECHNICAL NOTE A non-linear elastic/perfectly plastic analysis for plane strain undrained expansion tests M. D. BOLTON and R. W. WHITTLE{

More information

Keysight Technologies Young s Modulus of Dielectric Low-k Materials. Application Note

Keysight Technologies Young s Modulus of Dielectric Low-k Materials. Application Note Keysight Technologies Young s Modulus of Dielectric Low-k Materials Application Note Introduction In digital circuits, insulating dielectrics separate the conducting parts (wire interconnects and transistors)

More information

Platform Isolation Using Out-of-plane Compliant Mechanism

Platform Isolation Using Out-of-plane Compliant Mechanism Platform Isolation Using Out-of-plane Compliant Mechanism by Arpys Arevalo PhD Candidate in Electrical Engineering Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) King Abdullah University

More information

STRAIN GAUGES YEDITEPE UNIVERSITY DEPARTMENT OF MECHANICAL ENGINEERING

STRAIN GAUGES YEDITEPE UNIVERSITY DEPARTMENT OF MECHANICAL ENGINEERING STRAIN GAUGES YEDITEPE UNIVERSITY DEPARTMENT OF MECHANICAL ENGINEERING 1 YEDITEPE UNIVERSITY ENGINEERING FACULTY MECHANICAL ENGINEERING LABORATORY 1. Objective: Strain Gauges Know how the change in resistance

More information

Piezoresistive Sensors

Piezoresistive Sensors Piezoresistive Sensors Outline Piezoresistivity of metal and semiconductor Gauge factor Piezoresistors Metal, silicon and polysilicon Close view of the piezoresistivity of single crystal silicon Considerations

More information

PIEZOELECTRIC TECHNOLOGY PRIMER

PIEZOELECTRIC TECHNOLOGY PRIMER PIEZOELECTRIC TECHNOLOGY PRIMER James R. Phillips Sr. Member of Technical Staff CTS Wireless Components 4800 Alameda Blvd. N.E. Albuquerque, New Mexico 87113 Piezoelectricity The piezoelectric effect is

More information

Basic Laboratory. Materials Science and Engineering. Atomic Force Microscopy (AFM)

Basic Laboratory. Materials Science and Engineering. Atomic Force Microscopy (AFM) Basic Laboratory Materials Science and Engineering Atomic Force Microscopy (AFM) M108 Stand: 20.10.2015 Aim: Presentation of an application of the AFM for studying surface morphology. Inhalt 1.Introduction...

More information

Modeling and analysis of the electromechanical behavior of surface-bonded piezoelectric actuators using finite element method

Modeling and analysis of the electromechanical behavior of surface-bonded piezoelectric actuators using finite element method Modeling and analysis of the electromechanical behavior of surface-bonded piezoelectric actuators using finite element method Huangchao Yu and Xiaodong Wang Abstract Piezoelectric actuators have been widely

More information

C.J. Bennett, W. Sun Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, Nottingham NG7 2RD, UK

C.J. Bennett, W. Sun Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, Nottingham NG7 2RD, UK Optimisation of material properties for the modelling of large deformation manufacturing processes using a finite element model of the Gleeble compression test C.J. Bennett, W. Sun Department of Mechanical,

More information

Mechanics of Microstructures

Mechanics of Microstructures Mechanics of Microstructures Topics Plane Stress in MEMS Thin film Residual Stress Effects of Residual Stress Reference: Stephen D. Senturia, Microsystem Design, Kluwer Academic Publishers, January 200.

More information

EE C245 ME C218 Introduction to MEMS Design Fall 2010

EE C245 ME C218 Introduction to MEMS Design Fall 2010 EE C245 ME C218 Introduction to MEMS Design Fall 2010 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture EE C245:

More information

NORMAL STRESS. The simplest form of stress is normal stress/direct stress, which is the stress perpendicular to the surface on which it acts.

NORMAL STRESS. The simplest form of stress is normal stress/direct stress, which is the stress perpendicular to the surface on which it acts. NORMAL STRESS The simplest form of stress is normal stress/direct stress, which is the stress perpendicular to the surface on which it acts. σ = force/area = P/A where σ = the normal stress P = the centric

More information

Mat. Res. Soc. Symp. Proc. Vol Materials Research Society

Mat. Res. Soc. Symp. Proc. Vol Materials Research Society Mat. Res. Soc. Symp. Proc. Vol. 738 2003 Materials Research Society G7.26.1 Determination of the Plastic Behavior of Low Thermal Expansion Glass at the Nanometer Scale Richard Tejeda, 1 Roxann Engelstad,

More information

SIMULATION AND OPTIMIZATION OF MEMS PIEZOELECTRIC ENERGY HARVESTER WITH A NON-TRADITIONAL GEOMETRY

SIMULATION AND OPTIMIZATION OF MEMS PIEZOELECTRIC ENERGY HARVESTER WITH A NON-TRADITIONAL GEOMETRY SIMULATION AND OPTIMIZATION OF MEMS PIEZOELECTRIC ENERGY HARVESTER WITH A NON-TRADITIONAL GEOMETRY S. Sunithamani 1, P. Lakshmi 1, E. Eba Flora 1 1 Department of EEE, College of Engineering, Anna University,

More information

6. Strain Gages and Strain Measurement

6. Strain Gages and Strain Measurement 6. Strain Gages and Strain Measurement 6.1 Strain gages: (Silva p.273) Strain gage measures strain and the measurements can be directly related to stress and force. Hence, strain gages can be utilized

More information

INTRODUCTION TO PIEZO TRANSDUCERS

INTRODUCTION TO PIEZO TRANSDUCERS PIEZO SYSTEMS, INC. 65 Tower Office Park Woburn, MA 01801 USA Tel: 781 933 4850 Fax: 781 933 4743 email: sales@piezo.com Find Search for a product or category HOME PRODUCTS CUSTOM OEM CATALOG TECHNICAL

More information

Bending Load & Calibration Module

Bending Load & Calibration Module Bending Load & Calibration Module Objectives After completing this module, students shall be able to: 1) Conduct laboratory work to validate beam bending stress equations. 2) Develop an understanding of

More information

Mechatronics II Laboratory EXPERIMENT #1: FORCE AND TORQUE SENSORS DC Motor Characteristics Dynamometer, Part I

Mechatronics II Laboratory EXPERIMENT #1: FORCE AND TORQUE SENSORS DC Motor Characteristics Dynamometer, Part I Mechatronics II Laboratory EXPEIMENT #1: FOCE AND TOQUE SENSOS DC Motor Characteristics Dynamometer, Part I Force Sensors Force and torque are not measured directly. Typically, the deformation or strain

More information

2044. Dynamics analysis for the clamping mechanisms of a rotary inchworm piezoelectric motor

2044. Dynamics analysis for the clamping mechanisms of a rotary inchworm piezoelectric motor 2044. Dynamics analysis for the clamping mechanisms of a rotary inchworm piezoelectric motor Yongfei Gu 1, Jichun Xing 2 1, 2 School of Mechanical Engineering, Yanshan University, Qinhuangdao, China 1

More information

Mechanics of wafer bonding: Effect of clamping

Mechanics of wafer bonding: Effect of clamping JOURNAL OF APPLIED PHYSICS VOLUME 95, NUMBER 1 1 JANUARY 2004 Mechanics of wafer bonding: Effect of clamping K. T. Turner a) Massachusetts Institute of Technology, Cambridge, Massachusetts 0219 M. D. Thouless

More information

Degradation of Piezoelectric Materials for Energy Harvesting Applications

Degradation of Piezoelectric Materials for Energy Harvesting Applications Degradation of Piezoelectric Materials for Energy Harvesting Applications P Pillatsch 1, N Shashoua 1,ASHolmes 2, E M Yeatman 2,PKWright 1 1 University of California Berkeley, Advanced Manufacturing for

More information

Innovative MEMS Voltage-to-Frequency Converter using Cascaded Transducers

Innovative MEMS Voltage-to-Frequency Converter using Cascaded Transducers International Journal of Engineering and Technology Volume 2 No. 9, September, 2012 Innovative MEMS Voltage-to-Frequency Converter using Cascaded Transducers Amir J. Majid Ajman University of Science &

More information

Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software

Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software V. Mounika Reddy 1, G.V.Sunil Kumar 2 1,2 Department of Electronics and Instrumentation Engineering, Sree

More information

NUMERICAL INVESTIGATION OF CABLE PARAMETRIC VIBRATIONS

NUMERICAL INVESTIGATION OF CABLE PARAMETRIC VIBRATIONS 11 th International Conference on Vibration Problems Z. Dimitrovová et al. (eds.) Lisbon, Portugal, 9-1 September 013 NUMERICAL INVESTIGATION OF CABLE PARAMETRIC VIBRATIONS Marija Nikolić* 1, Verica Raduka

More information

V. 2 (p.1 of 8) / Color: No / Format: Letter / Date: 5/3/ :01:37 AM. SPIE USE: DB Check, Prod Check, Notes: Abstract 1.

V. 2 (p.1 of 8) / Color: No / Format: Letter / Date: 5/3/ :01:37 AM. SPIE USE: DB Check, Prod Check, Notes: Abstract 1. Thermomechancial Characterization in a Radiant Energy Imager Using Null Switching Javaneh Boroumand, Imen Rezadad, Ammar Alhasan, Evan Smith, Robert E. Peale Department of Physics, University of Central

More information

REPORT TO D-FLEX LTD APRIL 2009 REPORT. (to D-Flex Ltd, NWDA Innovation Vouchers Award, 28 April 2009)

REPORT TO D-FLEX LTD APRIL 2009 REPORT. (to D-Flex Ltd, NWDA Innovation Vouchers Award, 28 April 2009) REPORT (to D-Flex Ltd, NWDA Innovation Vouchers Award, 28 April 2009) Finite Element Modelling of Rigidity of Fishing Rods with Various Cross-sections Report to D-Flex Ltd by Z Guan Department of Engineering,

More information

Design and Simulation of Micro-cantilever

Design and Simulation of Micro-cantilever Design and Simulation of Micro-cantilever Suresh Rijal 1, C.K.Thadani 2, C.K.Kurve 3,Shrikant Chamlate 4 1 Electronics Engg.Dept.,KITS,Ramtek, 2 Electronics and Comn.Engg.Dept.,KITS,Ramtek, 3 Electronics

More information

Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation

Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation Determining the Elastic Modulus and Hardness of an Ultrathin Film on a Substrate Using Nanoindentation The Harvard community has made this article openly available. Please share how this access benefits

More information

Influence of residual stresses in the structural behavior of. tubular columns and arches. Nuno Rocha Cima Gomes

Influence of residual stresses in the structural behavior of. tubular columns and arches. Nuno Rocha Cima Gomes October 2014 Influence of residual stresses in the structural behavior of Abstract tubular columns and arches Nuno Rocha Cima Gomes Instituto Superior Técnico, Universidade de Lisboa, Portugal Contact:

More information

DEPARTMENT OF MECHANICAL ENIGINEERING, UNIVERSITY OF ENGINEERING & TECHNOLOGY LAHORE (KSK CAMPUS).

DEPARTMENT OF MECHANICAL ENIGINEERING, UNIVERSITY OF ENGINEERING & TECHNOLOGY LAHORE (KSK CAMPUS). DEPARTMENT OF MECHANICAL ENIGINEERING, UNIVERSITY OF ENGINEERING & TECHNOLOGY LAHORE (KSK CAMPUS). Lab Director: Coordinating Staff: Mr. Muhammad Farooq (Lecturer) Mr. Liaquat Qureshi (Lab Supervisor)

More information

Midterm 2 PROBLEM POINTS MAX

Midterm 2 PROBLEM POINTS MAX Midterm 2 PROBLEM POINTS MAX 1 30 2 24 3 15 4 45 5 36 1 Personally, I liked the University; they gave us money and facilities, we didn't have to produce anything. You've never been out of college. You

More information

Foundations of Ultraprecision Mechanism Design

Foundations of Ultraprecision Mechanism Design Foundations of Ultraprecision Mechanism Design S.T. Smith University of North Carolina at Charlotte, USA and D.G. Chetwynd University of Warwick, UK GORDON AND BREACH SCIENCE PUBLISHERS Switzerland Australia

More information

TESTING AND ANALYSIS OF COMPOSITE SANDWICH BEAMS

TESTING AND ANALYSIS OF COMPOSITE SANDWICH BEAMS TESTING AND ANALYSIS OF COMPOSITE SANDWICH BEAMS I. M. Daniel, J. L. Abot, and K. A. Wang Walter P. Murphy Professor, Departments of Civil and Mechanical Engineering, Robert R. McCormick School of Engineering

More information

Numerical and experimental analysis of a cantilever beam: A laboratory project to introduce geometric nonlinearity in Mechanics of Materials

Numerical and experimental analysis of a cantilever beam: A laboratory project to introduce geometric nonlinearity in Mechanics of Materials Numerical and experimental analysis of a cantilever beam: A laboratory project to introduce geometric nonlinearity in Mechanics of Materials Tarsicio Beléndez (1) and Augusto Beléndez (2) (1) Departamento

More information

CHAPTER 5 FIXED GUIDED BEAM ANALYSIS

CHAPTER 5 FIXED GUIDED BEAM ANALYSIS 77 CHAPTER 5 FIXED GUIDED BEAM ANALYSIS 5.1 INTRODUCTION Fixed guided clamped and cantilever beams have been designed and analyzed using ANSYS and their performance were calculated. Maximum deflection

More information

MEMS Tuning-Fork Gyroscope Mid-Term Report Amanda Bristow Travis Barton Stephen Nary

MEMS Tuning-Fork Gyroscope Mid-Term Report Amanda Bristow Travis Barton Stephen Nary MEMS Tuning-Fork Gyroscope Mid-Term Report Amanda Bristow Travis Barton Stephen Nary Abstract MEMS based gyroscopes have gained in popularity for use as rotation rate sensors in commercial products like

More information

EE C245 ME C218 Introduction to MEMS Design

EE C245 ME C218 Introduction to MEMS Design EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 12: Mechanical

More information