Data Sheet. ASMT-Jx1x 1 W Mini Power LED Light Source. Description. Features. Applications
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1 ASMT-J1 1 W Mini Power LED Light Source Data Sheet Description This 1 W Mini Power LED Light Source is a high performance energ-efficient device that can handle high thermal and high driving current. Option with electricall isolated metal slug is also available. The White Mini Power LED is available in the range of color temperature from 27 K to 1 K. The low profile package design and ultra small footprint is suitable for a wide variet of applications especiall where space and height is a constraint. The package is compatible with reflow soldering process. To facilitate eas pick and place assembl, the LEDs are packed in EIA-compliant tape and reel. Features Available in Red, Red Orange, Amber, Blue, Roal Blue, Can, Green, Cool White, Neutral White and Warm White color Small footprint Energ efficient Direct heat transfer from metal slug to motherboard Compatible with reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation Non-ESD sensitive (threshold > 16 kv) MSL 1 products Applications Architectural lighting Garden lighting Decorative lighting Sign backlight Safet, eit and emergenc sign lightings Specialt lighting such as task lighting and reading lights Retail displa Commercial lighting Accent or marker lightings, strip or step lightings Portable lightings, biccle head lamp, torch lights. Pathwa lighting Street lighting Tunnel lighting CAUTION: Customer is advised to keep the LEDs in the MBB when not in use as prolonged eposure to environment might cause the silver plated leads to tarnish, which might cause difficulties in soldering.
2 Package Dimensions Ø Anode Lead NC Lens Cathode Mark NC NC Bod NC Cathode Lead Metal Slug.65.6 Ø 1.7 Figure 1. ASMT-J1 package outline drawing Notes: 1. All dimensions in millimeters. 2. Metal slug is connected to anode for electricall non-isolated option. 3. Tolerance is ±.1 mm, unless otherwise specified. 4. Terminal finish: Ag plating. 5. Corresponding NC (No Connection) leads adjacent to anode and cathode leads can be electricall short. 2
3 Part Numbering Sstem ASMT J Packaging Option Color Bin Selection Maimum Flu Bin Selection Minimum Flu Bin Selection Dice Tpe N - InGaN A - AlInGaP Heat Sink - Electricall Non-isolated 1 - Electricall Isolated Color R - Red H - Red Orange A - Amber G - Green C - Can B - Blue L - Roal Blue W - Cool White N - Neutral White Y - Warm White Note: 1. For selection details, see Page 1. 3
4 Device Selection Guide (T J = 25 C) Part Number Color Luminous Flu (lm) / Radiometric Power (mw), Φ V [1,2] Min. Tp. Ma. Test Current (ma) Dice Technolog ASMT-JR1-AST1 Red AllnGaP No ASMT-JA1-ARS1 Amber AllnGaP No ASMT-JH1-ARS1 Red Orange AllnGaP No ASMT-JB11-NNQ1 Blue InGaN Yes ASMT-JL11-NNQ1 Roal Blue 275 mw 355 mw 515 mw 35 InGaN Yes ASMT-JL11-NPR1 355mW 515mW 635mW 35 InGaN Yes ASMT-JC11-NTU1 Can InGaN Yes ASMT-JG11-NUW1 Green InGaN Yes ASMT-JW11-NWX1 Cool White InGaN Yes ASMT-JN11-NWX1 Neutral White InGaN Yes ASMT-JY11-NVW1 Warm White InGaN Yes Notes: 1. Φ V is the total luminous flu / radiometric power output as measured with an integrating sphere at 25 ms mono pulse condition. 2. Flu tolerance is ±1%. Electricall Isolated Metal Slug Absolute Maimum Ratings Parameter AllnGaP InGaN InGaN Can Units DC Forward Current [1] ma Peak Pulsing Current [2] ma Power Dissipation mw LED Junction Temperature C Operating Metal Slug Temperature Range at 35 ma -4 to to to +135 C Storage Temperature Range -4 to to to +12 C Soldering Temperature See Figure 26 Reverse Voltage [3] Notes: 1. Derate linearl based on Figure 1 for AlInGaP and Figure 22 for InGaN. 2. Pulse condition dut factor = 1%, Frequenc = 1 khz. 3. Not designed for reverse bias operation. Not recommended 4
5 Optical Characteristics at 35 ma (T J = 25 C) Part Number Color Peak Wavelength, l PEAK (nm) Dominant Wavelength, l D [1] (nm) Viewing Angle, 2q ½ [2] ( ) Tp. Tp. Tp. Tp. ASMT-JR1-AST1 Red ASMT-JA1-ARS1 Amber ASMT-JH1-ARS1 Red Orange ASMT-JG11-NUW1 Green ASMT-JC11-NTU1 Can ASMT-JB11-NNQ1 Blue Luminous Efficienc (lm/w) ASMT-JL11-NNQ1 Roal Blue Not Applicable ASMT-JL11-NPR Not applicable Part Number Color Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 2q ½ [2] ( ) Min. Ma. Tp. Tp. ASMT-JW11-NWX1 Cool White ASMT-JN11-NWX1 Neutral White ASMT-JY11-NVW1 Warm White Notes: 1. The dominant wavelength, λ D, is derived from the CIE Chromaticit Diagram and represents the color of the device. 2. q ½ is the off-ais angle where the luminous intensit is ½ the peak intensit. Electrical Characteristic at 35 ma (T J = 25 C) Dice Tpe Forward Voltage, V F (V) Min. Tp Ma. Tp. AllnGaP InGaN (non-can colors) InGaN Can Note: 1. Rθ j-ms is Thermal Resistance from LED junction to metal slug. Thermal Resistance, Rθ j-ms ( C/W) [1] Luminous Efficienc (lm/w) 5
6 AlInGaP RELATIVE INTENSITY AMBER RED ORANGE RED WAVELENGTH - nm Figure 2. Relative Intensit vs. Wavelength for Red, Red-Orange and Amber RELATIVE LUMINOUS FLUX (NORMALIZED AT 35 ma) DC FORWARD CURRENT - ma Figure 3. Relative Luminous Flu vs. Mono Pulse Current FORWARD CURRENT - ma FORWARD VOLTAGE - V Figure 4. Forward Current vs. Forward Voltage NORMALIZED INTENSITY ANGULAR DISPLACEMENT - DEGREES Figure 5. Radiation Pattern for Red, Red Orange and Amber PULSE CURRENT, IP - A D = PULSE CURRENT, IP - A D = PULSE DURATION, tp - sec Figure 6. Maimum pulse current vs. ambient temperature. Derated based on T A = 25 C, Rθ J-A = 5 C/W PULSE DURATION, tp - sec Figure 7. Maimum pulse current vs. ambient temperature. Derated based on T A = 85 C, Rθ J-A = 5 C/W. 6
7 AlInGaP RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25 C) RED RED-ORANGE AMBER JUNCTION TEMPERATURE, T J - C Figure 8. Relative Light Output vs. Junction Temperature FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25 C) RED AMBER RED-ORANGE JUNCTION TEMPERATURE, T J - C Figure 9. Forward Voltage Shift vs. Junction Temperature 6 6 MAX ALLOWABLE DC CURRENT - ma Rθ J-A = 3 C/W Rθ J-A = 4 C/W Rθ J-A = 5 C/W MAX ALLOWABLE DC CURRENT - ma Rθ J-MS = 9 C/W AMBIENT TEMPERATURE, T A - C Figure 1. Maimum Forward Current vs. Ambient Temperature. Derated based on T JMAX = 125 C, Rθ J-A = 3 C/W, 4 C/W and 5 C/W METAL SLUG TEMPERATURE, T MS - C Figure 11. Maimum Forward Current vs. Ambient Slug Temperature. Derated based on T JMAX = 125 C, Rθ J-MS = 9 C/W 7
8 InGaN 1..9 WARM WHITE.8 NEUTRAL WHITE.7 COOL WHITE WAVELENGTH - nm Figure 12. Relative Intensit vs. Wavelength for Cool, Neutral and Warm White RELATIVE INTENSITY RELATIVE INTENSITY GREEN CYAN BLUE ROYAL BLUE WAVELENGTH - nm Figure 13. Relative Intensit vs. Wavelength for Blue, Roal Blue, Can and Green RELATIVE LUMINOUS FLUX (NORMALIZED AT 35 ma) DC FORWARD CURRENT - ma Figure 14. Relative Luminous Flu vs. Mono Pulse Current FORWARD CURRENT - ma GREEN WHITE BLUE CYAN FORWARD VOLTAGE - V Figure 15. Forward Current vs. Forward Voltage NORMALIZED INTENSITY BLUE ROYAL BLUE GREEN CYAN ANGULAR DISPLACEMENT - DEGREES Figure 16. Radiation Pattern for Blue, Roal Blue, Can and Green NORMALIZED INTENSITY ANGULAR DISPLACEMENT - DEGREES Figure 17. Radiation Pattern for Cool White, Neutral White and Warm White 8
9 PULSE CURRENT, IP-A D = D = t p T t p T I F PULSE CURRENT, IP-A D = D = t p T t p T I F PULSE DURATION, tp - sec Figure 18. Maimum pulse current vs. ambient temperature. Derated based on T A = 25 C, Rθ J-A = 5 C/W PULSE DURATION, tp - sec Figure 19. Maimum pulse current vs. ambient temperature. Derated based on T A = 85 C, Rθ J-A = 5 C/W. InGaN RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25 C) BLUE CYAN ROYAL BLUE GREEN WHITE JUNCTION TEMPERATURE,T J - C Figure 2. Relative Light Output vs. Junction Temperature FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25 C) CYAN BLUE WHITE GREEN ROYAL BLUE JUNCTION TEMPERATURE,T J - C Figure 21. Forward Voltage Shift vs. Junction Temperature 6 6 MAX ALLOWABLE DC CURRENT - ma Rθ J-A = 3 C/W Rθ J-A = 4 C/W Rθ J-A = 5 C/W MAX ALLOWABLE DC CURRENT - ma RθJ-MS = 9 C/W AMBIENT TEMPERATURE, T A - C METAL SLUG TEMPERATURE, T MS - C Figure 22. Maimum Forward Current vs. Ambient Temperature. Derated based on T JMAX = 15 C, Rθ J-A = 3 C/W, 4 C/W and 5 C/W Figure 23. Maimum Forward Current vs. Metal Slug Temperature. Derated based on T JMAX = 15 C, Rθ J-MS = 9 C/W. 9
10 Solder Pad.85.8 ø1.9 Slug Indepdent Æ3.2 Solder Pad 1.3 Figure 24. Recommended soldering land pattern Figure 25. Recommended pick and place nozzle tip. Inner diameter = 3.2 mm. 1-3 SEC. TEMPERATURE 217 C 2 C 15 C C 3 C/SEC. MAX. 3 C/SEC. MAX. 6 C/SEC. MAX SEC. 1 SEC. MAX. TIME (Acc. to J-STD-2C) Figure 26. Recommended Reflow Soldering Profile Note: For detailed information on reflow soldering of Avago surface mount LEDs, efer to Avago Application Note AN 16 Surface Mounting SMT LED Indicator Components. 1
11 Option Selection Details Flu / Power Bin Limit [ 4, 5 ] ASMT-J Minimum Flu Bin Selection 5 - Maimum Flu Bin Selection 6 - Color Bin Selection 7 - Packaging Option Color Bin Selection [ 4 ] Individual reel will contain parts from one color bin selection onl. Cool White Selection 11 Bin ID Full Distribution E F G H J K L M N P Q Neutral White Selection VM, UM, VN and UN WM, VM, WN and VN XM, WM, XN and WN UN, VN, U and V WN, VN, W and V XN, WN, X and W V, U, VP and UP W, V, WP, VP and WQ X, W, XP, WP and WQ Y YA Bin ID Full Distribution E F G H J K SM, RM, S1 and R1 TM, SM, TN and S1 S1, R1, S and R TN, S1, T and S S, R, SA and RA T, S, TP and SA Color Warm White Selection Bin ID Full Distribution E F G H J K L M N Others Colors Selection NM, MM, N1 and M1 PM, NM, P1 and N1 QM, PM, Q1 and P1 M1, N1, M and N P1, N1, P and N Q1, P1, Q and P N, M, NA and MA P, N, PA and NA Q, P, QA and PA Bin ID Full Distribution Z Y W V Q P N M Bin ID Luminous Flu (lm) / Radiometric Power (mw) at 35 ma Min. A and B B and C C and D D and E A, B and C B, C and D C, D and E D, E and F Ma. Blue M N P Q Other Colors R S T U V W X Roal Blue M Tolerance for each bin limits is ±1% N P Q R
12 Y-COORDINATE K 45K 5K UM 565K 63K VM UN U WM VN 7K XM WN V UP XN W VP X WP Y XP WQ BLACK BODY CURVE YA X-COORDINATE Figure 27. Color bin Structure for Cool White Y-COORDINATE QA 27K 35K 285K MM 35K 325K PM NM QM N1 M1 P1 Q1 P M Q N MA NA PA BLACK BODY CURVE X-COORDINATE Figure 28. Color bin structure for Warm White Y-COORDINATE K 45K SM TM S1 TN S T SA RA TP 35K 38K RM R1 R BLACK BODY CURVE X-COORDINATE Figure 29. Color bin structure for Neutral White 12
13 Color Bin Limits Cool White Color Limits (Chromaticit Coordinates) Warm White Color Limits (Chromaticit Coordinates) Bin UM Bin MM Bin UN Bin M Bin U Bin M Bin UP Bin MA Bin VM Bin NM Bin VN Bin N Bin V Bin N Bin VP Bin NA Bin WM Bin PM Bin WN Bin P Bin W Bin P Bin WP Bin PA Bin WQ Bin QM Bin XM Bin XN Bin X Bin XP Bin Q1 Bin Q Bin QA Tolerance: ± Bin YO Bin YA Tolerance: ±.1 13
14 Neutral White Bin RM Bin R1 Bin R Bin RA Bin SM Bin S1 Bin S Bin SA Bin TM Bin TN Bin T Color Limits (Chromaticit Coordinates) Color Bin ID Dominant Wavelength (nm) at 35 ma Min. Ma. Red Red Orange Amber B C D E Blue A B C D Can C D E F G H Green A B Bin TP Tolerance: ± Tolerance: ± 1 nm C D Packaging Option [ 7 ] Selection Option 1 Tape and Reel Peak Wavelength (nm) at 35 ma Color Bin ID Min. Ma. Roal Blue C D E F Tolerance: ±2 nm Eample ASMT-JY11-NST1 ASMT-JY11-N Warm White, InGaN, Electricall isolated Heat Sink X 1 = S Minimum Flu Bin S X 2 = T Maimum Flu Bin T X 3 = Full Distribution X 4 = 1 Tape and Reel Option 14
15 Tape and Reel Option 1 4. ±.1 2. ±.5 ø1.5 ± ±.1.25 ± ± ±.1 8. ±.1 8 ø1.5 ± ±.1.25 ± ± ±.1 Figure 3. Carrier Tape Dimensions 13.2 ± ±.5 3 ±.5 ø21. ±.5 ø1 ø13.1 ± ±1 ø6 ±.5 4 ±.5 5 ±.5 Notes: 1. Empt component pockets sealed with top cover tape or 5 pieces per reel. 3. Drawing not to scale. 4. All dimensions are in millimeters. Figure 31. Reel dimensions 15
16 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 32. Reeling Orientation DISCLAIMER: Avago s products and software are not specificall designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facilit or for use in medical devices or applications. Customer is solel responsible, and waives all rights to make claims against Avago or its suppliers, for all loss, damage, epense or liabilit in connection with such use. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copright Avago Technologies. All rights reserved. AV2-177EN - October 6, 215
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