TECHNICAL SPECIFICATION MODEL: ET013TT1. Version: 1.0 ET013TT1. Customer. Date

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1 Version: 1.0 TECHNICAL SPECIFICATION MODEL: The content of this information is subject to be changed without notice. Please contact E Ink or its agent for further information. Customer s Confirmation Customer Date By E Ink s Confirmation 1

2 Revision History Rev. Issued Date Revised Contents New 2

3 TECHNICAL SPECIFICATION CONTENTS NO. ITEM PAGE - Cover 1 - Revision History 2 - Contents 3 1 General Description 4 2 Features 4 3 Mechanical Specifications 4 4 Mechanical Drawing of EPD module 5 5 Input/Output Terminals 6 6 Command Table 7 7 Electrical Characteristics 15 8 Optical Characteristics 23 9 Handling, Safety and Environment Requirements Reliability test Packing 27 3

4 1. General Description The 1.3 inch EPD is a reflective electrophoretic E Ink technology display module based on active matrix TFT and plastic substrate. It has 1.3 inch active area with 256 x 256 pixels, the display is capable to display images at black and white (1 bit only) depending on the display controller and the associated waveform file it used. 2. Features High contrast reflective /electrophoretic technology. 256 x 256 display High reflectance Ultra wide viewing angle Pure reflective mode Bi-stable Commercial temperature range Plastic substrate. 3. Mechanical Specifications Parameter Specifications Unit Remark Screen Size 1.3 Inch Display Resolution 256 (H) 256 (V) Pixel Active Area (H) (V) mm Pixel Pitch (H) (V) mm Pixel Configuration Square Outline Dimension 27.1(H) 28.4 (V) 0.4 (D) mm Weight g w/o masking film 4

5 4. Mechanical Drawing of EPD module 5

6 5. Input / Output Terminals I: Input O: Output P: Power C: Charge pump Pin # Signal I/O Description 1 VCOM_P I Common Connection Remark 2 VCOM_IC O VCOM output 3 VCC P Analog power (2.3V ~ 3.6V) 4 VDD P Digital power (2.3V ~ 3.6V) 5 GND P Ground 6 VGH P Positive power supply for gate driver 7 VGL P Negative power supply for gate driver 8 VDH P Positive power supply for source driver 9 VDL P Negative power supply for source driver 10 CSB I SPI chip select (low active) 11 BUSY O Internal operation busy flag (1 : Driver is busy) 12 SCL I SPI serial clock 13 SDI I SPI serial data input 14 SDO O SPI serial data output (floating in idle state) 15 RESETB I Global reset pin (low active) 16 TEST2 -- Test pin, keeps open 17 OEI I Gate output enable pin 18 VDHR P Positive source driver voltage (low voltage) 19 VCL P Negative power supply for VCOM low voltage level 20 C8N C Capacitor 9 connection pin for booster 3 circuit (VCL) 21 C8P C Capacitor 9 connection pin for booster 3 circuit (VCL) 22 C7N C Capacitor 8 connection pin for booster 2 circuit (VGL/VDL) 23 C7P C Capacitor 8 connection pin for booster 2 circuit (VGL/VDL) 24 C6N C Capacitor 7 connection pin for booster 2 circuit (VGL/VDL) 25 C6P C Capacitor 7 connection pin for booster 2 circuit (VGL/VDL) 26 C5N C Capacitor 6 connection pin for booster 1 circuit (VGH/VDH) 27 C5P C Capacitor 6 connection pin for booster 1 circuit (VGH/VDH) 28 C4N C Capacitor 5 connection pin for booster 1 circuit (VGH/VDH) 29 C4P C Capacitor 5 connection pin for booster 1 circuit (VGH/VDH) 30 C3N C Capacitor 4 connection pin for booster 1 circuit (VGH/VDH) 31 C3P C Capacitor 4 connection pin for booster 1 circuit (VGH/VDH) 6

7 32 C2N C Capacitor 3 connection pin for booster 1 circuit (VGH/VDH) 33 C2P C Capacitor 3 connection pin for booster 1 circuit (VGH/VDH) 34 C1N C Capacitor 2 connection pin for booster 1 circuit (VGH/VDH) 35 C1P C Capacitor 2 connection pin for booster 1 circuit (VGH/VDH) 36 GND P Ground 37 VPP C Capacitor 1 connection pin for booster 1 circuit (VGH/VDH) 38 VCOM_IC O VCOM output 39 VCC P Analog power (2.3V ~ 3.6V) 40 VDD P Digital power (2.3V ~ 3.6V) 41 GND P Ground 42 VGH P Positive power supply for gate driver 43 VGL P Negative power supply for gate driver 44 VDH P Positive power supply for source driver 45 VDL P Negative power supply for source driver 46 VCOM_P I Common Connection 7

8 6. Command Table # Command Index A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 Default 1. Index -- 0 W IDX3 IDX2 IDX1 IDX0 00H 2. Read Device ID -- 0 R BUSY ID2 ID1 ID0 00H 3. Pump Status 00H 1 R LVDS VCPOK H 4. Channel Setting 01H 1 R/W C[7:0] C[15:8] C[23:16] 5. Pump Setting (1) 04H 1 R/W DIS_VH 0 CPDISM[1:0] CPS[1:0] CPM[1:0] 0FH 6. Pump Setting (2) 05H 1 R/W VCON EN_VCL EN_VN EN_VH 00H 7. OSC & Power setting 07H 1 R/W 0 OSCM[1:0] OSCON 0 CPEXT H 8. Thermal Sensor Setting 08H 1 R/W LVDEN BGON TSON 00H 9. PWM Width Select 09H 1 R/W P[7:0] 00H FFH FFH FFH 10. Write Gate/Source Data (49-byte command) 0AH 1 W O0[1:0] O1[1:0] O2[1:0] O3[1:0] 00H 1 W : : : : 00H 1 W O188[1:0] O189[1:0] O190[1:0] O191[1:0] 00H 11. Read Sensor Register 0FH 1 R 0 T[6:0] 00H 8

6-1) Register Definition (1) INDEX Command A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 Index 0 W 0 0 0 0 IDX3 IDX2 IDX1 IDX0 IDX[3:0] : Select the register to be accessed by MPU.

9 6-1) Register Definition (1) INDEX Command A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 Index 0 W IDX3 IDX2 IDX1 IDX0 IDX[3:0] : Select the register to be accessed by MPU. The IDX provides 16 register numbers (00H ~ 0FH) while driver uses only 16 registers. (2) READ DEVICE ID Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 Read Status & Device ID 0 R BUSY ID2 ID1 ID0 BUSY: The Busy Flag is used to determine whether driver is idle or internally operating. 0 : when driver is idle. The Busy Flag will be output to the BUSY pin. 1 : when driver is performing internal operations. ID[2:0]: The instruction is used to read device ID, that is the version of the driver. Default: 000b. (3) PUMP STATUS Charge Pump Status Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D R LVDS VCPOK LVDS: Low Voltage Detection Status 0: Normal voltage 1: Low voltage (VDD < 2.5v) VCPOK: Charge Pump Ready 0: VGH/VDH/VDL/VGL/VCL voltage not ready 1: VGH/VDH/VDL/VGL/VCL voltage ready (4) CHANNEL SETTING Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D Channel Attribute Setting C[7:0] 1 R/W C[15:8] C[23:16] This instruction is used to set channel to be in Gate or Source mode. C[23:0]: Channel Setting 0: Source driver mode 1: Gate driver mode Each C<x> controls 8 channels Gate/Source attribution. 9

10 (5) PUMP SETTING (1) Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 Charge Pump Setting (1) R/W DIS_VH 0 CPDISM[1:0] CPS[1:0] CPM[1:0] This command turns ON/OFF the discharge function for the voltage of on-chip voltage converter circuits: VGH, VDH DIS_VH: Discharge Positive Voltage 0 No discharge VGH/VDH voltage 1 Discharge VGH/VDH voltage to be 0V CPDISM[1:0]: Discharge Negative Voltage. Negative voltage discharge speed (00 : min) CPS[1:0]: Charge Pump Strength. Charge pump strength selection (11 : max) CPM[1:0]: Charge Pump Mode. Charge pump soft start mode (11 : max) (6) PUMP SETTING (2) (7) Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 Charge Pump Setting (2) VCON: VCOM Control 0: VCOM disable 1: VCOM enable EN_VCL: VCL Control 0: Charge pump booster 3 (VCL) enable 1: Charge pump booster 3 (VCL) enable EN_VN: Charge Pump Negative Voltage Control 0: Charge pump booster 2 (VGL/VDL) disable 1: Charge pump booster 2 (VGL/VDL) enable EN_VH: Charge Pump Positive Voltage Control 0: Charge pump booster 1 (VGH/VDH) disable 1: Charge pump booster 1 (VGH/VDH) enable R/W VCON EN_VCL EN_VN EN_VH 10

(7) OSC & POWER SETTING Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 System Clock Rate Setting 0 0 0 0 0 0 1 1 1 1 R/W 0 OSCM[1:0] OSCON 0 CPEXT 0 0 OSCM[1:0]: System Clock Rate Selection 00b: 250K Hz 01b:

11 (7) OSC & POWER SETTING Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D0 System Clock Rate Setting R/W 0 OSCM[1:0] OSCON 0 CPEXT 0 0 OSCM[1:0]: System Clock Rate Selection 00b: 250K Hz 01b: 500K Hz 10b: 1M Hz 11b: 2M Hz OSCON: OSC Clock Enable 0: System clock disable 1: System clock enable CPEXT: External Power Voltage 0: Internal charge pump as power (VGH/VDH/VDL/VGL/VCL) source 1: External power voltage as power source (8) THERMAL SENSOR SETTING Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D Thermal Sensor Setting 1 R/W LVDEN BGON TSON LVDEN : This register is used to enable LVDS. 0 : LVDS Disable 1 : LVDS Enable BGON : This register determines the band-gap circuit to be ON or OFF. 0 / 1 : the band-gap circuit is turn OFF / ON. TSON : This register determines the temperature sensor to be ON or OFF. 0 / 1 : the temperature sensor is turn OFF / ON. 11

12 (9) PWM WIDTH SELECT Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D PWM Width Select 1 R/W P[7:0] This command is used to select PWM width. The frame is divided into 256 levels between the voltages of GND and VCL. P[7:0] : ~ to indicate PWM width 0 ~ 255, respectively. Remark: PWM Vcom Voltage Lookup Table P[7:0] Vcom P[7:0] Vcom P[7:0] Vcom P[7:0] Vcom P[7:0] Vcom P[7:0] Vcom P[7:0] Vcom P[7:0] Vcom The voltages in the table above are the DC values generated when GND=0V and VCL= 6V. 12

13 13

14 (10) WRITE GATE/SOURCE DATA (49-BYTE COMMAND) Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D Write Gate/Source Data (49-byte command) 1 W O0[1:0] O1[1:0] O2[1:0] O3[1:0] 1 W : : : : 1 W O188[1:0] O189[1:0] O190[1:0] O191[1:0] The command is used to write the display data to the 384-bit register stage. Each two bits of the register stage decides the input of the Driver Channel. When EPD is displaying, it is needed to write data continuously. Gate/Source Channels 1st written byte 2nd written byte 48th written byte 4-channel 4-channel 4-channel O0 O1 O2 O3 O4 O5 O6 O7 O188 O189 O190 O191 D[7:6] D[5:4] D[3:2] D[1:0] D[7:6] D[5:4] D[3:2] D[1:0] D[7:6] D[5:4] D[3:2] D[1:0] Gate/Source Data Definition D[7:6], D[5:4], D[3:2], D[1:0] Source Mode (C=0) 0 0 VDL VDH Gate Mode (C=1) VGL VGH VGL VGH (11) READ SENSOR REGISTER Action A0 R/W D7 D6 D5 D4 D3 D2 D1 D Read Sensor Register 1 R 0 T[6:0] T[6:0] : Temperature Range selection. -20~+70 o C T[4:0] Temp. Range ( o C) T[4:0] Temp. Range ( o C) T[4:0] Temp. Range ( o C) ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ ~ 0 14

15 7. Electrical Characteristics 7-1) Absolute maximum rating Signal Parameter Condition Rating Unit V DD Supply voltage range -0.3 to 6 V V IN Input voltage range -0.3 to VDD V T OPR Operating temperature range 0 to 50 T STR Storage temperature range -25 to 70 Note: Absolute Maximum Ratings are stress ratings. Stresses higher than those listed above may cause permanent damage to the device. Functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. o C o C 7-2) DC characteristics (VDD = 2.3 to 3.6V, Ta = 25 o C) Operating Voltage Input voltage Output voltage Item Symbol Condition Min. Typ. Max. Unit VDD V VCC V High VIH 0.8xVDD Low VIL 0.2xVDD High VOH IOH = 0.5mA 0.8xVDD Low VOL IOL = -0.5mA 0.2xVDD I/O pad Input leakage current IIL VIN = VDD or Vss 1 ua EPD driver ON Resistance RON Ta = 25 o C 50K R Oscillator frequency Fosc fosc Ta = 25 o C -10% 2M +10% Hz Voltage converter Output voltage Voltage converter Output voltage Voltage converter Output voltage Voltage converter Output voltage Voltage converter Output voltage VDH 2.3 VCC <2.5V 2.5 VCC 3.6V 13~14 14 V V 14 V VGH VCC=2.3~3.6V V VDL 2.3 VCC <2.5V 2.5 VCC 3.6V ~ VGL VCC=2.3~3.6V V Vcom -2xVCC 0 V Panel Power P mw - The Maximum power consumption is measured with following pattern transition: from pattern of repeated 1 consecutive black scan lines followed by 1 consecutive white scan line to that of repeated white scan lines followed by 1 consecutive black scan lines. (Note 7-1) - The Typical power consumption is measured with following pattern transition: from horizontal black and white pattern to vertical black and white pattern. (Note 7-2) - The listed electrical/optical characteristics are only guaranteed under the controller & waveform provided by E Ink - Vcom is recommended to be set in the range of assigned value ± 0.1V. V 15

16 Note7-1: The maximum power consumption Note7-2: The Typical power consumption 16

17 7-3) AC characteristics Serial Bus Timing Characteristics (for Serial MCU) Symbol Parameter Conditions Min Typ Max Unit tcys Serial 50 ns twhs SCLK 25 ns twls SCLK 25 ns tdss Data 12 ns tdhs Data 12 ns tcss CSB 12 ns tchs CSB 20 ns 17

18 (1)For typical Read/Write data command Example: Command: Read Device ID 18

19 Command: Thermal Sensor Setting (2) For Channel setting and Write data command 19

20 RESETB RST trw Reset Characteristics Symbol Signal Description Condition Min. Max. Unit t RW RESETB Reset low pulse width 20 us Note: For each mode, the signal s rising time and falling time (tf, tr) are stipulated to be equal to or less than 15nS each. tr tf 80% 20% 20

21 7-5) Power ON / Power OFF Sequence Power ON Sequence Power OFF Sequence 21

22 7-6) Reference Circuit 22

8. Optical characteristics 8-1) Specification Measurements are made with that the illumination is under an angle of 45 degrees, the detection is perpendicular unless otherwise specified.

MAX UNIT Note R Reflectance White 30 35 - % Note 8-1 CR Contrast Ratio - 9 11 - - WS:White state, DS:Dark state Note 8-1:Luminance meter:eye One Pro Spectrophotometer 8-2) Definition of contrast

23 8. Optical characteristics 8-1) Specification Measurements are made with that the illumination is under an angle of 45 degrees, the detection is perpendicular unless otherwise specified. T = 25 o C SYMBOL PARAMETER CONDITIONS MIN TYP. MAX UNIT Note R Reflectance White % Note 8-1 CR Contrast Ratio WS:White state, DS:Dark state Note 8-1:Luminance meter:eye One Pro Spectrophotometer 8-2) Definition of contrast ratio The contrast ratio (CR) is the ratio between the reflectance in a full white area (Rl) and the reflectance in a dark area (Rd): CR = Rl/Rd 8-3) Reflection Ratio The reflection ratio is expressed as: R = Reflectance Factor white board x ( L center / L white board ) L center is the luminance measured at center in a white area (R=G=B=1). L white board is the luminance of a standard white board. Both are measured with equivalent illumination source. The viewing angle shall be no more than 2 degrees. 23

24 9. Handling, Safety and Environment Requirements WARNING The display module should be kept flat or fixed to a rigid, curved support with limited bending along the long axis. It should not be used for continual flexing and bending. Handle with care. Should the display break do not touch any material that leaks out. In case of contact with the leaked material then wash with water and soap. Contact E Ink for advice on mounting the display in a curved shape. REMARK All the specifications listed in this document are guaranteed for module only. Post-assembled operation or component(s) may impact module performance or cause unexpected effect or damage and therefore listed specifications is not warranted after any post-assembly operation. CAUTION The display module should not be exposed to harmful gases, such as acid and alkali gases, which corrode electronic components. Disassembling the display module can cause permanent damage and invalidate the warranty agreements. IPA solvent can only be applied on active area and the back of a glass. For the rest part, it is not allowed. Mounting Precautions (1) It`s recommended that you consider the mounting structure so that uneven force (ex. Twisted stress) is not applied to the module. (2) It`s recommended that you attach a transparent protective plate to the surface in order to protect the EPD. Transparent protective plate should have sufficient strength in order to resist external force. (3) You should adopt radiation structure to satisfy the temperature specification. (4) Acetic acid type and chlorine type materials for the cover case are not desirable because the former generates corrosive gas of attacking the PS at high temperature and the latter causes circuit break by electro-chemical reaction. (5) Do not touch, push or rub the exposed PS with glass, tweezers or anything harder than HB pencil lead. And please do not rub with dust clothes with chemical treatment. Do not touch the surface of PS for bare hand or greasy cloth. (Some cosmetics deteriorate the PS) (6) When the surface becomes dusty, please wipe gently with absorbent cotton or other soft materials like chamois soaks with petroleum benzene. Normal-hexane is recommended for cleaning the adhesives used to attach the PS. Do not use acetone, toluene and alcohol because they cause chemical damage to the PS. (7) Wipe off saliva or water drops as soon as possible. Their long time contact with PS causes deformations and color fading. 24

25 Data sheet status Product specification Limiting values This data sheet contains final product specifications. Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. 25

26 10. Reliability test TEST CONDITION REMARK 1 High Temperature Storage 70 40%, 120hrs (Test in White Pattern) 2 Low Temperature Storage -25, 120hrs (Test in White Pattern) 3 4 High Temperature Operation Low Temperature Operation 5 Heat shock. 6 High Temp and High Humidity storage 7 Electrostatic Discharge Actual EMC level to be measured on customer application. 50 /30%, 120hrs 0, 120hrs -25 /30min 70 /30 min. 50cycle, 1hr/cycle (Test in White Pattern) 60 80%, 120hrs (Test in White Pattern) (Machine model) +/- 200V 0Ω, 200pF Note:The protective film must be removed before temperature test. Non-operation < Criteria > In the standard conditions, there is not display function NG issue occurred. All the cosmetic specification is judged before the reliability stress. 26

27 11. Packing: 27

SUNLIKE DISPLAY. Model No: SC2004C GENERAL SPECIFICATION

SUNLIKE DISPLAY. Model No: SC2004C GENERAL SPECIFICATION GENERAL SPECIFICATION ITEM Product No SC2004CSLB-XA-LB-G DESCRIPTION STN Gray Positive STN Yellow Green Positive STN Blue Negative LCD Type TN Negative TN Positive FSTN Negative White & Black FSTN Positive