Detector R&D for ILC and Novel Ideas in Detector Technology

Transcription

1 SLAC DESY CERN KEK Detector R&D for ILC and Novel Ideas in Detector Technology Apologies: incomplete picture in 30 mins and personal biases I will concentrate on sub-detectors options and R&D for ILC Many thanks to all contributors to the many workshops where I took the information from Hwanbae Park (Kyungpook Nat l Univ.) 1

2 2 Introduction Lepton-Photon Korea

3 3 Physics challenges and ILC environment drive detector design and technology SiD LDC GLD 4 th Detectors: General purpose Optimized for precision physics Requirements: Choices: Calorimetry: Particle Flow or E-resolution? Size: large medium small (B-field) Tracking: Silicon or Gaseous? Muons: instrumented iron or double solenoid? Lepton-Photon 2007@Daegu, Korea

4 4 CALORIMETRY Lepton-Photon Korea

5 Jet Reconstruction 5 reconstruct 4-momentum of all particles in the event - charged : measured with tracker - neutral : measured with calorimeter system aspect stressed rather than individual sub-detectors - Particle Flow Particles Fraction of energy Measured with Resolution [σ 2 ] Charged 65 % Tracker Negligible Photons 25 % ECAL (15%) E jet 30% E Neutral 10 % ECAL + HCAL (50%) E jet Confusion Required for 30%/ E E jet 18%/ E e e WW, e e ZZ Large R I of calorimeter Calorimeter inside coil Calorimeter with extremely fine segmentation develop calorimeter technologies verify MC simulations by test beam measurements Lepton-Photon 2007@Daegu, Korea

6 Calorimeter 6 General requirements excellent jet energy resolution : hermeticity Detector designs are being optimized for the application of Particle Flow Algorithms : very granular sampling calorimeter significantly better energy resolution : compensating calorimeter Electromagnetic Calorimeter : Silicon/Tungsten, Scin./Lead (readout: PMT/SiPM/MPPC) dual readout (Scintillator-dE/dX, quartz fiber-cerenkov) Hadron Calorimeter: analog(sci-sipm) vs digital (GEM, RPC) readout Lepton-Photon Daegu, Korea

7 ECAL: Si/W and Scint./W 7 silicon-tungsten ( pad ) silicon-tungsten ( hexagonal ) Scintillator-tungsten, WSF, MPPC - 3 structures with different W thickness - 30 layers, active zone (18x18 cm 2 /3x3 matrices/6x6 arrays/1x1 cm 2 pads) - 12x18 cm 2 instrumented in CERN tests 6480 readout channels - fully functional v1 prototype (1024 pixels) - one KPiX readout chip for the sensor - KPiX also being considered for Si tracker and DHcal with GEMs - 1x45x0.3 cm 3 scintillator strips - 26 layers - readout with MPPCs + scintillator-hcal electronics Digitized signal as input charge injected dynamic range of KPiX - MC in pretty good agreement with data - Naïve weighting not far from optimal 1 MIP (4 fc) Max signal: 500 GeV electron

8 HCAL: Analog and Digital 8 Scintillator-steel; analogue, WSF, SiPM Gas-steel; digital, RPCs/GEMs/Micromegas Tile 5x5x0.5 cm 3 WSF scintillator SiPM Scintillator tile plane for 1m 3 prototype calorimeter - 38 steel plates with a thickness (0.5 cm thick tile) of 1 X 0 each - Scintillator pads of 3x3 cm 2 (core region) 12 x 12 cm 2 (edge region) ~8,000 readout channels with SiPM Thin and large area chambers are interspersed between steel plates - Measure neutral hadron energy via linear hits versus energy relation - gas mixture of 80% Ar/20% CO 2 - [16 mm steel plates + 4 mm copper (cooling)] x 38 - involves 10 RPCs and 2 GEMs Lepton-Photon 2007@Daegu, Korea

9 Dual REAdout Module(DREAM) 9 Fill the absorber with two kinds optical fibers, Cerenkov and scintillating fibers. - scintillating fibers respond to all charged particles in a shower whereas quartz fibers detect Cerenkov light induced mainly by EM particles e/h ratio is very different for quartz and scintillator measurements of energy, - therefore it is possible to determine e/h fraction in the shower and to correct the response hadronic energy linearity in ranges of 20 to 300 GeV is achieved e/π separation using time structure signals, measured the width of scintillation pulse Lepton-Photon 2007@Daegu, Korea

10 CALICE Beam Test 10 - CALICE detectors installed in the H6b experimental hall at the CERN SPS - successful commissioning - Hadron (electron) beam (50) GeV AHCAL TCMT ECAL beam Event display of shower of a 40 GeV pion recorded in CERN test-beam in several projections. Shower starts in ECAL, continues into HCAL and ends in tail-catcher. Lepton-Photon 2007@Daegu, Korea

11 11 CENTRAL TRACKER Lepton-Photon Korea

12 Central Tracker 12 General requirements momentum resolution: pattern recognition and two track separation tolerant to high machine background Gaseous: TPC (wires MPGD) many space points (~200) good single point resolution (~100 m) reasonable double track resolution (few mm) readout : GEM, Micromegas Silicon (strip) less of technology superb position resolution compact tracker smaller calorimeter rely on VTX for pattern recognition readout : long vs short ladder Lepton-Photon 2007@Daegu, Korea

13 TPC Readout 13 Gas Electron Multiplier two copper foils separated by polyimide uses 2 or more stages for safer operation high electric field inside the holes, in which multiplication takes place MicroMegas micromesh sustained by pillars amplification between mesh and pads/strip plane single stage intrinsic small length scale of these device allow - good 2-D resolution - small systematic effects, in particular in B-fields 140 m S1 copper kapton pillar 60 m S2 S1/S2 ~ E amplif / E drift Lepton-Photon 2007@Daegu, Korea

14 TPC Resolution (GEM/Micromegas) 14 Gas for TPC - low diffusion at high magnetic field - sufficient primary electrons - small electron attachment - keep hydrogen content as small as Ar-CF 4 : - very fast and no hydrogen - small transverse diffusion But - large electron attachment and need some quencher - GEM with narrow (1mm) pads - magnetic field improves resolution - resolution of < 100 m over the full drift length - Micromegas with resistive anode readout - 50 m resolution all over the drift distance Lepton-Photon 2007@Daegu, Korea

15 TPC : Pixel Readout with GEM 15 CMOS pixel readout ionization cluster counting is possible to improve particle identification performance GEM stack of 10x10 cm 2 Medipix2/TimePix chip 14x14 mm 2 Gas tight box contains GEMs, resistor chain, TimePix and MediPix2 chip and readout electronics of pad High spatial resolution + individual cluster counting Potential for large improvements in pattern recognition and de/dx (no Landau tail) Lepton-Photon Daegu, Korea

16 TPC : Pixel Readout with Micromegas 16 2 TimePix chips (B05 & C08) covered with a 3 m thick continuous layer of asi Micromegas glued on a frame TimePix w/micromegas results of cosmic tests Lepton-Photon 2007@Daegu, Korea

17 Silicon Tracker 17 (1.5%/layer) SiD All-Silicon tracking strategy Barrel with fully integrated Forward tracker - Appealing for hermeticity & large angle Physics GLD TPC (TPC) SIT FIT - Inner barrel: 4 d.s Si layers - True tracker vs just a linker Competitive with gaseous tracking over full range of momentum With superb position resolution, compact tracker is possible Challenges : material budget, power dissipation and connectivity LDC - Each Si component LINKS 2 subdetectors - Improves tracking overall performances Lepton-Photon Daegu, Korea

18 Silicon Tracker 18 Baseline for outer layers - 8 high resistivity FZ sensors - Thinned by a factor 2 or 3, thickness - AC or DC coupled strips 50µm pitch - Strip length: 10 ~ 60 cm Baseline for inner layers - double sided 6 high resistivity FZ sensors - AC coupled strips 50µm pitch SiO 2 Via (DC coupling) Al routing & pad area Avoid FE hybrid for electronics Integrate pitch adapter into sensor 2 nd metal layer for signal routing readout chip, bump-bonded power/readout cable, glued/wirebonded SNR vs strip length bias connection Barrel Module Lepton-Photon 2007@Daegu, Korea

19 19 VERTEX DETECTOR Lepton-Photon Korea

20 Vertex Detector 20 General requirements impact parameter: minimal material : fast readout radiation hard 1 train = ~3000 bunches in ~1ms, 5Hz occupancy is too high if integrate over 1 train Readout during train (~20 times = every 50 s) between train Technology Options readout every 50 s - MAPS, CPCCD, DEPFET, SOI in-pixel memory and readout between train - ISIS, FAPS finer pixel and readout between train - FPCCD (No Bunch id) - Chronopixels (Bunch id) Lepton-Photon Daegu, Korea

21 104 mm Column-Parallel CCD 21 CPCCD separates amplifier and readout for each column CPC2-70 Two driver chips CPD1 Bump-bonded CPR2 Busline-free CPC2 2-level metal clock distribution whole image area serves as a distributed busline designed to reach 50 MHz operation (reaches 45 MHz) Flexible cables All ingredients are in place Getting closer to prototype ladder Next generation CPR2A should make this board much smaller Lepton-Photon Daegu, Korea

22 Fine Pixel CCD 22 Fine pixel of ~5m (x20 more pixels than standard pixels) to keep low pixel occupancy Tracking capability with single layer using hit cluster shape can help background rejection Fully depleted epitaxial layer (15m) to minimize the number of hit pixels due to charge spread by diffusion -7V +6V Compare signal distributions during LASER light (532nm) illumination Lepton-Photon Daegu, Korea

23 Monolithic Active Pixel Sensor 23 Standard VLSI chip, with thin (10~15 m) low doped epi. sensitive layer Intensive R&D to develop working chip since 1999: MIMOSA-5 (1 Mpix, 3.5 cm 2 ) MIMOSA-20 (=M*3) (200 kpix, 1x2 cm 2 ) MIMOSA-17 (65 kpix, 0.8 x 0.8 cm 2 ) General performances well established new generation of full scale sensors underway : EUDET, STAR demonstrator S/N (Seed) MPV ~26 radiation hardness test performed for NIEL and X-ray Fast readout progressing steadily Parallel R&D: FAPS - 10~20 storage capacitors/pixel EUDET STAR EUDET Lepton-Photon Daegu, Korea

24 Chronopixel (CMOS) 24 Double CMOS Pixel Macro (50 μm pitch) for timing Micro (5 μm pitch) for precise position Buffer data during ~3000 bunches in a train and readout between bunch trains bunch number stored for up to 4 samples single bunch cross tagging 563 transistors [2 ( 4) buffers per pixel with calibration] into 50 x 50 m 2 pixel (180 nm process) demonstrated performance - ready for 80 x 80 array submission - < 20 x 20 m 2 and 45 nm process Lepton-Photon Daegu, Korea

25 In-situ Storage Image Sensor 25 Combines CCDs, active pixel transistors and edge electronics in one device Development and design of ISIS is more ambitious goal than CPCCD Proof of principle device (ISIS1) designed and manufactured by e2v Technologies Operating principles of the ISIS : Charge collected under a photogate Charge is transferred to 20-pixel storage CCD in situ, 20 times during the 1 ms-long train Conversion to voltage and readout in the 200 ms-long quiet period after the train 1 MHz column-parallel readout is sufficient Lepton-Photon Daegu, Korea

26 DEPFET 26 fully depleted sensitive volume internal amplification Powered only during readout, not during charge collection Preparations for the new DEPFET generation are in full swing: new sensors, larger matrices, with improved gain expected end of June 2007 steering chip switcher operational and rad. Hard new r/o chip submitted Radiation tolerance of basic pixel cell proven for fluences far beyond the ones expected at the ILC irradiation TID / NIEL fluence V th g m I Leak in int. gate at RT (*) gamma 60 Co 913 krad / ~ 0 ~-4V unchanged 156 fa neutron ~ 0 / 2.4x10 11 n/cm 2 ~ 0 unchanged 1.4 pa proton 283krad / 3x10 12 n/cm 2 ~-5V ~ -15% 26 pa New generation is almost done - very small pixels (20µm x 20µm) - increase internal amplification standard arrays compatible to existing hybrids wide arrays (512 x 512, full ILC) long arrays (256 x 1024, ½ ILC) various new standard arrays (64 x 256 pixels, down to 20x20µm 2 ) Rainer Richter, MPI HLL

27 SoI & 3D 27 readout electronics and silicon sensor on the same wafer wafer bonding techniques chosen for SOI technology isolation from the bulk silicon : lower parasitic capacitance and therefore faster switching and lower power consumption. enabling operation at higher temps (250 C) 3D integration (VIP1 chip, fabricated in MIT LL 0.18 µm ) Via using oxide etch process (Lincoln Labs) OKI 0.15 m SOI process (Mambo SOI X-Ray Chip) counting pixel detector plus readout circuit - max counting rate ~1 MHz - 64x64 26 m pitch on 350 m thickness, 12 bit counter tests are underway at Laser test stand it is being driven by industry 3D chip is comprised of 2 or more layers of semiconductor devices which have been thinned, bonded together, and interconnected to form a monolithic circuit Key technologies - precision alignment (better than 1 m) - bonding of thinned wafers - through wafer via formation and metallization Lepton-Photon Daegu, Korea

28 Summary 28 ILC experiment focus on precision : Advances of detector technology and new ideas in detector developing will provide physics and experimental opportunities beyond SM and LHC A coordinated R&D effort (Global Detector R&D Reviews) is underway world-wide to develop the advanced detectors tracking review (Feb, 2007 at IHEP) calorimetry review (June, 2007 at DESY) vertex detection review (Oct., 2007 at FNAL) other subsystem and DAQ review (March, 2008 at Tohoku) Four detector R&D group LOI select two EDR complete proposals The detector community has been preparing for technology choice to make focused R&D program Lepton-Photon Daegu, Korea