HN27C4096G/CC Series. Ordering Information. Features word 16-bit CMOS UV Erasable and Programmable ROM

Similar documents
HN27C1024HG/HCC Series

HN27C4096AHG/AHCC Series

HN58C256 Series word 8-bit Electrically Erasable and Programmable CMOS ROM

HN58C65 Series word 8-bit Electrically Erasable and Programmable CMOS ROM

HN58C66 Series word 8-bit CMOS Electrically Erasable and Programmable CMOS ROM. ADE F (Z) Rev. 6.0 Apr. 12, Description.

HM6264A Series. Features. Ordering Information word 8-bit High Speed CMOS Static RAM

DS K x 8 Static RAM FEATURES PIN ASSIGNMENT PIN DESCRIPTION

32K x 8 EEPROM - 5 Volt, Byte Alterable

High Speed Super Low Power SRAM

DS1225Y. 64K Nonvolatile SRAM FEATURES PIN ASSIGNMENT

LH5P832. CMOS 256K (32K 8) Pseudo-Static RAM

SRAM & FLASH Mixed Module

256K X 16 BIT LOW POWER CMOS SRAM


IS61C K x 16 HIGH-SPEED CMOS STATIC RAM

LH5P8128. CMOS 1M (128K 8) Pseudo-Static RAM PIN CONNECTIONS

HB56A1636B/SB-6B/7B/8B

IS61LV K x 16 LOW VOLTAGE CMOS STATIC RAM

HN58V65A Series HN58V66A Series

DECODER I/O DATA CIRCUIT CONTROL CIRCUIT

5 V 64K X 16 CMOS SRAM

3.3 V 256 K 16 CMOS SRAM

PYA28C16 2K X 8 EEPROM FEATURES PIN CONFIGURATIONS DESCRIPTION FUNCTIONAL BLOCK DIAGRAM. Access Times of 150, 200, 250 and 350ns

P4C164 ULTRA HIGH SPEED 8K X 8 STATIC CMOS RAMS FEATURES DESCRIPTION. Full CMOS, 6T Cell. Common Data I/O

3.3 V 64K X 16 CMOS SRAM

5.0 V 256 K 16 CMOS SRAM

HM514400B/BL Series HM514400C/CL Series

INTEGRATED CIRCUITS. 74LVC138A 3-to-8 line decoder/demultiplexer; inverting. Product specification 1998 Apr 28

SRAM AS5LC512K8. 512K x 8 SRAM 3.3 VOLT HIGH SPEED SRAM with CENTER POWER PINOUT. PIN ASSIGNMENT (Top View)

NTE40160B, NTE40161B NTE40162B, NTE40163B Integrated Circuit CMOS, Synchronous Programmable 4 Bit Counters

74HC General description. 2. Features. 3-to-8 line decoder, demultiplexer with address latches; inverting. Product data sheet

SRM2264L10/12 CMOS 64K-BIT STATIC RAM. Low Supply Current Access Time 100ns/120ns 8,192 Words 8 Bits, Asynchronous DESCRIPTION

2 Megabit (256K x 8) SuperFlash MTP SST27SF020, SST27VF020

Dual D Flip-Flop with Set and Reset High-Speed Silicon-Gate CMOS

NTE74HC109 Integrated Circuit TTL High Speed CMOS, Dual J K Positive Edge Triggered Flip Flop w/set & Reset

16-Mbit (1M x 16) Pseudo Static RAM

74HC General description. 2. Features. 3-to-8 line decoder, demultiplexer with address latches; inverting

NTE4514B & NTE4515B Integrated Circuit CMOS, 4 Bit Latch/4 to 16 Line Decoder

8-Mbit (512K x 16) Pseudo Static RAM

April 2004 AS7C3256A

NTE74HC165 Integrated Circuit TTL High Speed CMOS, 8 Bit Parallel In/Serial Out Shift Register

1-OF-8 DECODER/DEMULTIPLEXER High-Speed Silicon-Gate CMOS

DQ0 DQ1 DQ2 DQ3 NC WE# RAS# A0 A1 A2 A3 A4 A5. x = speed

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

IBM B IBM P 8M x 8 12/11 EDO DRAM

LH NMOS 256K (256K 1) Dynamic RAM DESCRIPTION

DQ0 DQ1 NC NC NC NC WE# RAS# A0 A1 A2 A3 A4 A5

MM74C912 6-Digit BCD Display Controller/Driver

NTE74HC299 Integrated Circuit TTL High Speed CMOS, 8 Bit Universal Shift Register with 3 State Output

1-OF-8 DECODER/DEMULTIPLEXER High-Speed Silicon-Gate CMOS

8-bit binary counter with output register; 3-state

CD4514BC CD4515BC 4-Bit Latched/4-to-16 Line Decoders

Synchronous 4 Bit Counters; Binary, Direct Reset

M74HCT138TTR 3 TO 8 LINE DECODER (INVERTING)

About the change in the name such as "Oki Electric Industry Co. Ltd." and "OKI" in documents to OKI Semiconductor Co., Ltd.

MR48V256A GENERAL DESCRIPTION FEATURES PRODUCT FAMILY. PEDR48V256A-06 Issue Date: Oct. 17, 2011

Document Title 128K X 32 Bit Synchronous High Speed SRAM with Burst Counter and Pipelined Data Output. Rev. No. History Issue Date Remark

DESCRIPTION DECODER I/O DATA CIRCUIT CONTROL CIRCUIT

NTE74HC173 Integrated Circuit TTL High Speed CMOS, 4 Bit D Type Flip Flop with 3 State Outputs

2M x 32 Bit 5V FPM SIMM. Fast Page Mode (FPM) DRAM SIMM S51T04JD Pin 2Mx32 FPM SIMM Unbuffered, 1k Refresh, 5V. General Description.

TC74LCX244F,TC74LCX244FW,TC74LCX244FT,TC74LCX244FK

. HIGH SPEED .LOW POWER DISSIPATION .OUTPUT DRIVE CAPABILITY M54HCT138 M74HCT138 3 TO 8 LINE DECODER (INVERTING) t PD = 16 ns (TYP.


74VHCT138ATTR 3 TO 8 LINE DECODER (INVERTING)

64K x 18 Synchronous Burst RAM Pipelined Output

Revision No History Draft Date Remark

IBM IBM M IBM B IBM P 4M x 4 12/10 DRAM

74HC573; 74HCT573. Octal D-type transparent latch; 3-state. The 74HC573; 74HCT573 is functionally identical to:

TC4013BP,TC4013BF,TC4013BFN

256K x 16 Static RAM CY7C1041BN. Features. Functional Description

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

1-Mbit (128K x 8) Static RAM

4-Mbit (256K x 16) Static RAM

NTE40194B Integrated Circuit CMOS, 4 Bit Bidirectional Universal Shift Register

16-Mbit (1M x 16) Static RAM

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

White Electronic Designs

74LS75 Quad Latch. DM74LS75 Quad Latch. General Description. Ordering Code: Logic Diagram. Connection Diagram. Function Table (Each Latch)

PALCE22V10 and PALCE22V10Z Families

2-Mbit (128K x 16)Static RAM

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

SRAM AS5C512K8. 512K x 8 SRAM HIGH SPEED SRAM with REVOLUTIONARY PINOUT. PIN ASSIGNMENT (Top View) AVAILABLE AS MILITARY SPECIFICATIONS FEATURES

74LCX16374 Low Voltage 16-Bit D-Type Flip-Flop with 5V Tolerant Inputs and Outputs

74HC573; 74HCT573. Octal D-type transparent latch; 3-state. The 74HC573; 74HCT573 is functionally identical to:

74LCXH Low Voltage 16-Bit D-Type Flip-Flop with Bushold and 26Ω Series Resistors in Outputs

512K x 32 Static RAM CY7C1062AV33. Features. Functional Description. Logic Block Diagram. Selection Guide

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

INTEGRATED CIRCUITS. 74LV259 8-bit addressable latch. Product specification Supersedes data of 1997 Jun 06 IC24 Data Handbook.

IBM IBM M IBM B IBM P 4M x 4 11/11 EDO DRAM

NJU BIT PARALLEL TO SERIAL CONVERTER PRELIMINARY PACKAGE OUTLINE GENERAL DESCRIPTION PIN CONFIGURATION FEATURES BLOCK DIAGRAM

74HC238; 74HCT to-8 line decoder/demultiplexer

DS Tap Silicon Delay Line FEATURES PIN ASSIGNMENT. PIN DESCRIPTION TAP 1 TAP 5 TAP Output Number +5 Volts

UNISONIC TECHNOLOGIES CO., LTD L16B45 Preliminary CMOS IC

DM Bit Addressable Latch

I/O 8 I/O 15 A13 A 14 BHE WE CE OE BLE

High Speed MOSFET Drivers

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

INTEGRATED CIRCUITS. For a complete data sheet, please also download:

TC74VHCT573AF,TC74VHCT573AFW,TC74VHCT573AFT

Transcription:

262144-word 16-bit CMOS UV Erasable and Programmable ROM The Hitachi HN27C4096G/CC is a 4-Mbit ultraviolet erasable and electrically programmable ROM, featuring high speed and low power dissipation. Fabricated on advanced fine process and high speed circuitry technique, the HN27C4096 makes high speed access time possible. Therefore, it is suitable for 16/32-bit microcomputer systems using high speed microcomputer such as the 80286 and 68020. The HN27C4096 offers high speed programming using page programming mode. This device has the package variation of cerdip-40pin and JLCC-44 pin. Features Ordering Information Type No. Access time Package HN27C4096G-10 100 ns 600-mil 40-pin cerdip HN27C4096G-12 120 ns (DG-40A) HN27C4096G-15 150 ns HN27C4096CC-10 100 ns 44-pin J-bend leaded chip HN27C4096CC-12 120 ns carrier (CC-44) HN27C4096CC-15 150 ns High speed: Access time 100 ns/120 ns/150 ns (max) Low power dissipation: Standby mode; 5 µw (typ), Active mode; 35 mw/mhz (typ) Fast high reliability page programming and fast high-reliability programming: Program voltage; +12.5 V DC Program time; 3.5 sec (min) (Theoretical in Page programming) Inputs and outputs TTL compatible during both read and program modes Pin arrangement: 40-pin JEDEC standard, 44-pin JLCC JEDEC standard Device identifier mode: Manufacturer code and device code 1

Pin Arrangement HN27C4096G Series HN27C4096CC Series V PP CE I/O15 I/O14 I/O13 I/O12 I/O11 I/O10 I/O9 I/O8 V SS I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 OE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 (Top View) 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 V CC A17 A16 A15 A14 A13 A12 A11 A10 A9 V SS A8 A7 A6 A5 A4 A3 A2 A1 A0 I/O12 I/O11 I/O10 I/O9 I/O8 V SS NC I/O7 I/O6 I/O5 I/O4 I/O13 I/O14 I/O15 CE V PP NC V CC A17 A16 A15 A14 6 5 4 3 2 1 44 43 42 41 40 7 39 8 38 9 37 10 36 11 35 12 34 13 33 14 32 15 31 16 30 17 29 18 19 20 21 22 23 24 25 26 27 28 I/O3 I/O2 I/O1 I/O0 OE NC A0 A1 A2 A3 A4 (Top View) A13 A12 A11 A10 A9 VSS NC A8 A7 A6 A5 Pin Description Pin name Function A0 A17 Address I/O0 I/O15 Input/output CE Chip enable OE Output enable V CC Power supply V PP Programming power supply V SS Ground 2

Block Diagram A7 X-Decoder 2048 2048 Memory Matrix A17 I/O0 I/O15 Input Data Control Y-Gating Y-Decoder CE OE H A0 A6 V CC V PP V SS H H : High Threshold Inverter Mode Selection Pin CE OE A9 V PP V CC I/O CC (3) (22) (35) (2) (44) (4 11, 14 21) Mode G (2) (20) (31) (1) (40) (3 10, 12 19) Read V IL V IL V SS V CC V CC Dout Output disable V IL V IH V SS V CC V CC High-Z Standby V IH V SS V CC V CC High-Z 3

Mode Selection (cont) Pin CE OE A9 V PP V CC I/O CC (3) (22) (35) (2) (44) (4 11, 14 21) Mode G (2) (20) (31) (1) (40) (3 10, 12 19) Page Page program set V IH V H * 2 V PP V CC High-Z prog. Page data latch V IL V H * 2 V PP V CC Din Page program V IL V IH V PP V CC High-Z Page program verify V IH V IL V PP V CC Dout Page program reset V IH V IH V CC V CC High-Z Word Program V IL V IH V PP V CC Din prog. Program verify V IH V IL V PP V CC Dout Optional verify V IL V IL V PP V CC Dout Program inhibit V IH V IH V PP V CC High-Z Identifier V IL V IL V H * 2 V SS V CC V CC Code Notes: 1. : Don t care. 2. V H : 12.0 V ± 0.5 V Absolute Maximum Ratings Parameter Symbol Value Unit All input and output voltages* 1 Vin, Vout 0.6* 2 to +7.0 V Voltage on pin A9 and OE V ID 0.6* 2 to +13.0 V V PP voltage * 1 V PP 0.6 to +13.5 V V CC voltage * 1 V CC 0.6 to +7.0 V Operating temperature range Topr 0 to +70 C Storage temperature range * 3 Tstg 65 to +125 C Storage temperature under bias Tbias 20 to +80 C Notes: 1. Relative to V SS. 2. Vin, Vout, V ID min = 2.0 V for pulse width 20 ns 3. Storage temperature range of device before programming. 4

Capacitance (Ta = 25 C, f = 1 MHz) Parameter Symbol Min Typ Max Unit Test conditions Input capacitance Cin 12 pf Vin = 0 V Output capacitance Cout 20 pf Vout = 0 V Read Operation DC Characteristics (V CC = 5 V ± 10%, V PP = V SS to V CC, Ta = 0 to +70 C) Parameter Symbol Min Typ Max Unit Test conditions Input leakage current I LI 2 µa Vin = 5.5 V Output leakage current I LO 2 µa Vout = 5.5 V/0.45 V V PP current I PP1 1 20 µa V PP = 5.5 V Standby V CC current I SB1 1 ma CE = V IH I SB2 1 20 µa CE = V CC ± 0.3 V Operating V CC current I CC1 30 ma Iout = 0 ma, f = 1 MHz I CC2 100 ma Iout = 0 ma, f = 10 MHz Input voltage V IL 0.3* 1 0.8 V V IH 2.2 V CC + 1* 2 V Output voltage V OL 0.45 V I OL = 2.1 ma V OH 2.4 V I OH = 400 µa Notes: 1. V IL min = 1.0 V for pulse width 50 ns V IL min = 2.0 V for pulse width 20 ns 2. V IH max = V CC +1.5 V for pulse width 20 ns If V IH is over the specified maximum value, read operation cannot be guaranteed. 5

AC Characteristics (V CC = 5 V ± 10%, V PP = V SS to V CC, Ta = 0 to +70 C) Test Conditions Input pulse levels: 0.45 to 2.4 V Input rise and fall times: 10 ns Output load: 1 TTL gate +100 pf Reference levels for measuring timing: 0.8 V, 2.0 V HN27C4096 HN27C4096 HN27C4096-10 -12-15 Parameter Symbol Min Max Min Max Min Max Unit Test conditions Address to output delay t ACC 100 120 150 ns CE = OE = V IL CE to output delay t CE 100 120 150 ns OE = V IL OE to output delay t OE 60 60 70 ns CE = V IL OE high to output float * 1 t DF 0 35 0 40 0 50 ns CE = V IL Address to output hold t OH 5 5 5 ns CE = OE = V IL Note: 1. t DF is defined as the time at which the output achieves the open circuit condition and data is no longer driven. Read Timing Waveform Address CE Standby Mode Active Mode Standby Mode t CE OE/V PP t ACC t OE t DF t OH Data Out Data Out Valid Fast High-Reliability Page Programming This device can be applied the high performance page programming algorithm shown in the following flowchart. This algorithm allows to obtain faster programming time without any voltage stress to the device nor deterioration in reliability of programmed data. 6

Page Program Set Apply 12 V to OE pin after applying 12.5 V to V PP to set a page program mode. The device operates in a page program mode until reset. Page Program Reset Set V PP to V CC level or less to reset a page program mode. START SET PAGE PROG LATCH MODE V PP = 12.5 ± 0.3 V, V CC = 6.25 ± 0.25 V OE = 12.0 ± 0.5 V Address = 0 n = 0 Latch Latch Latch Latch n + 1 n SET PAGE PROG./VERIFY MODE V PP = 12.5 ± 0.3 V, V CC = 6.25 ± 0.25 V Program t PW = 50 µ s ± 5% NO VERIFY GO LAST address? NOGO YES SET READ MODE V CC = 5.0 ± 0.5 V, V PP = V CC n = 10? YES NO READ all address END GO NOGO FAIL Fast High-Reliability Page Programming Flowchart 7

DC Characteristics (V CC = 6.25 V ± 0.25 V, V PP = 12.5 V ± 0.3 V, Ta = 25 C ± 5 C) Parameter Symbol Min Typ Max Unit Test conditions Input leakage current I LI 2 µa Vin = 6.5 V/0.45 V Output voltage during verify V OL 0.45 V I OL = 2.1 ma V OH 2.4 V I OH = 400 µa Operating V CC current I CC 50 ma Input voltage V IL 0.1* 5 0.8 V V IH 2.2 V CC + 0.5* 6 V V H 11.5 12.0 12.5 V V PP supply current I PP 70 ma CE=V IL Notes: 1. V CC must be applied simultaneously or before V PP and removed simultaneously or after V PP. 2. V PP must not exceed 13.5 V including overshoot. 3. An influence may be had upon device reliability if the device is installed or removed while V PP = 12.5 V. 4. Do not alter V PP either V IL to 12.5 V or 12.5 V to V IL when CE = low. 5. V IL min = 0.6 V for pulse width 20 ns. 6. If V IH is over the specified maximum value, programming operation cannot be guaranteed. 8

AC Characteristics (V CC = 6.25 V ± 0.25 V, V PP = 12.5 V ± 0.3 V, Ta=25 C ± 5 C) Test Conditions Input pulse levels: 0.45 to 2.4 V Input rise and fall times: 20 ns Reference levels for measuring timing: Inputs; 0.8 V, 2.0 V, Outputs; 0.8 V, 2.0 V Parameter Symbol Min Typ Max Unit Test conditions Address setup time t AS 2 µs OE setup time t OES 2 µs Data setup time t DS 2 µs Address hold time t AH 0 µs Data hold time t DH 2 µs OE high to output float delay t DF * 1 0 130 ns V PP setup time t VPS 2 µs V CC setup time t VCS 2 µs CE initial programming pulse width t PW 47.5 50.0 52.5 µs CE setup time t CES 2 µs Data valid from OE t OE 0 150 ns CE pulse width during data latch t LW 1 µs OE=V H setup time t OHS 2 µs OE=V H hold time t OHH 2 µs OE hold time t OEH 2 µs V PP hold time* 2 t VRS 1 µs Notes: 1. t DF is defined as the time at which the output achieves the open circuit condition and data is no longer driven. 2. Page program mode will be reset when V PP is set to V CC or less. 9

Fast High-Reliability Page Programming Timing Waveform Page program mode Program data latch Page program Program verify A2 A17 t AS t AH t AH t AS A0, A1 t DS t DF t DH t OE Data t VPS Data in strobe Data out valid V PP V PP VCC t VCS V + 1.25 CC VCC VCC t OHS t OHH t CES tpw t OES CE t LW OE V H V IH t VRS V IL 10

Fast High-Reliability Programming This device can be applied the fast high-reliability programming algorithm shown in the following flowchart. This algorithm allows to obtain faster programming time without any voltage stress to the device nor deterioration in reliability of programmed data. START SET PROG./VERIFY MODE V PP = 12.5 ± 0.3 V, V CC = 6.25 ± 0.25 V Address = 0 n = 0 n + 1 n Program t PW = 50 µ s ± 5% NO VERIFY GO LAST address? NOGO YES SET READ MODE V CC = 5.0 ± 0.5 V, V PP = V CC n = 10? YES NO READ all address NOGO END GO FAIL Fast High-Reliability Programming Flowchart 11

DC Characteristics (V CC = 6.25 V ± 0.25 V, V PP =12.5 V ± 0.3 V, Ta=25 C ± 5 C) Parameter Symbol Min Typ Max Unit Test conditions Input leakage current I LI 2 µa Vin = 6.5 V/0.45 V V PP supply current I PP 40 ma CE = V IL Operating V CC current I CC 50 ma Input voltage V IL 0.1* 5 0.8 V V IH 2.2 V CC + 0.5* 6 V Output voltage V OL 0.45 V I OL = 2.1 ma V OH 2.4 V I OH = 400 µa Notes: 1. V CC must be applied simultaneously or before V PP and removed simultaneously or after V PP. 2. V PP must not exceed 13.5 V including overshoot. 3. An influence may be had upon device reliability if the device is installed or removed while V PP = 12.5 V. 4. Do not alter V PP either V IL to 12.5 V or 12.5 V to V IL when CE = low. 5. V IL min = 0.6 V for pulse width 20 ns. 6. If V IH is over the specified maximum value, programming operation cannot be guaranteed. AC Characteristics (V CC = 6.25 V ± 0.25 V, V PP = 12.5 V ± 0.3 V, Ta = 25 C ± 5 C) Test Conditions Input pulse levels: 0.45 to 2.4 V Input rise and fall times: 20 ns Reference levels for measuring timings: 0.8 V, 2.0 V Parameter Symbol Min Typ Max Unit Test conditions Address setup time t AS 2 µs OE setup time t OES 2 µs Data setup time t DS 2 µs Address hold time t AH 0 µs Data hold time t DH 2 µs OE to output float delay t DF * 1 0 130 ns V PP setup time t VPS 2 µs V CC setup time t VCS 2 µs CE initial programming pulse width t PW 47.5 50.0 52.5 µs Data valid from OE t OE 0 150 ns Note: 1. t DF is defined as the time at which the output achieves the open circuit condition and data is no longer driven. 12

Fast High-Reliability Programming Timing Waveform Program Program Verify Address t AS t AH Data Data In Stable Data Out Valid t DS t DH t DF V V PP PP VCC t VPS V V CC+1.25 CC VCC t VCS CE t PW t OES t OE OE Optional Page Programming This device can be applied the optional page programming algorithm shown in the following flowchart. This algorithm allows to obtain faster programming time without any voltage stress to the device nor deterioration in reliability of programmed data. This programming algorithm is the combination of page programming and word verify. It can avoid the increase of programming verify time when a programmer with slow machine cycle is used, and shorten the total programming time. Regarding the timing specifications for page programming and word verify, please refer to the specifications for fast high-reliability page programming and fast high-reliability programming. 13

START SET PAGE PROG LATCH MODE V PP = 12.5 ± 0.3 V, V CC = 6.25 ± 0.25 V OE = 12.0 ± 0.5 V Address = 0 Latch Latch Latch Latch SET PAGE PROG. MODE V PP = 12.5 ± 0.3 V, V CC = 6.25 ± 0.25 V Program t PW = 50 µ s ± 5% NO LAST address? YES PAGE PROG. RESET V PP = V CC = 6.25 ± 0.25 V SET WORD PROG./VERIFY MODE V PP = 12.5 ± 0.3 V, V CC = 6.25 ± 0.25 V Address = 0 n = 0 GO VERIFY NOGO n + 1 n Program t PW = 50 µ s ± 5% VERIFY GO LAST all address? NOGO YES SET READ MODE V CC = 5.0 ± 0.5 V, V PP = V CC n = 10? YES NO READ all address GO END NOGO FAIL Optional Page Programming Flowchart 14

DC Characteristics (V CC = 6.25 V ± 0.25 V, V PP =12.5 V ± 0.3 V, Ta=25 C ± 5 C) Parameter Symbol Min Typ Max Unit Test conditions Input leakage current I LI 2 µa Vin = 6.5 V/0.45 V Output voltage during V OL 0.45 V I OL = 2.1 ma verify V OH 2.4 V I OH = 400 µa Operating V CC current I CC 50 ma Input voltage V IL 0.1* 5 0.8 V V IH 2.2 V CC + 0.5* 6 V V H 11.5 12.0 12.5 V V PP supply current I PP 70 ma CE = V IL Notes: 1. V CC must be applied simultaneously or before V PP and removed simultaneously or after V PP. 2. V PP must not exceed 13.5 V including overshoot. 3. An influence may be had upon device reliability if the device is installed or removed while V PP = 12.5 V. 4. Do not alter V PP either V IL to 12.5 V or 12.5 V to V IL when CE = low. 5. V IL min = 0.6 V for pulse width 20 ns. 6. If V IH is over the specified maximum value, programming operation cannot be guaranteed. 15

AC Characteristics (V CC = 6.25 V ± 0.25 V, V PP = 12.5 V ± 0.3 V, Ta = 25 C ± 5 C) Test Conditions Input pulse levels: 0.45 to 2.4 V Input rise and fall times: 20 ns Reference levels for measuring timings: Inputs; 0.8 V, 2.0 V Outputs; 0.8 V, 2.0 V Parameter Symbol Min Typ Max Unit Test conditions Address setup time t AS 2 µs OE setup time t OES 2 µs Data setup time t DS 2 µs Address hold time t AH 0 µs Data hold time t DH 2 µs OE high to output float delay t DF * 1 0 130 ns V PP setup time t VPS 2 µs V CC setup time t VCS 2 µs CE initial programming pulse width t PW 47.5 50.0 52.5 µs CE setup time t CES 2 µs Data valid from OE t OE 0 150 ns CE pulse width during data latch t LW 1 µs OE = V H setup time t OHS 2 µs OE = V H hold time t OHH 2 µs Page programming reset time *2 t VLW 1 µs V PP hold time *2 t VRS 1 µs Notes: 1. t DF is defined as the time at which the output achieves the open circuit condition and data is no longer driven. 2. Page program mode will be reset when V PP is set to V CC or less. 16

Option Page Programming Timing Waveform Page program mode Program data latch Page program Word program mode Program verify Program A2 A17 t AH t AS t t AH AS t AH A0, A1 t DS t DH t DS t DF Data Data in stable Data out valid Data in stable t VPS t VPS t OE t DF V PP V PP VCC t VCS t VRS V CC + 1.25 VCC VCC t OHS t OHH t CES t VLW t CES CE t LW tpw t OES t PW OE V H V IH V IL 17

Erase Erasure of HN27C4096G/CC is performed by exposure to ultraviolet light of 2537 Å and all the output data are changed to 1 after this erasure procedure. The minimum integrated dose (i.e. UV intensity exposure time) for erasure is 15 W sec/cm 2. Mode Description Device Identifier Mode The device identifier mode allows the reading out of binary codes that identify manufacturer and type of device, from outputs of EPROM. By this mode, the device will be automatically matched its own corresponding programming algorithm, using programming equipment. HN27C4096 Identifier Code A0 I/O8 I/O15 I/O7 I/O6 I/O5 I/O4 I/O3 I/O2 I/O1 I/O0 CC (24) (11) (4) (14) (15) (16) (17) (18) (19) (20) (21) Hex Identifier G (21) (10) (3) (12) (13) (14) (15) (16) (17) (18) (19) Data Manufacturer code V IL 0 0 0 0 0 1 1 1 07 Device code V IH 1 0 1 0 0 0 1 0 A2 Notes: 1. V CC = 5.0 V ± 10% 2. A9 = 12.0 V ± 0.5 V 3. A1 A8, A10 A17, CE, OE=V IL 4. : Don t care. 18