Resistivity: 4-probe measurement. ELEC-L3211: Postgraduate Course in Micro and Nanoscience Libin Wang:

Similar documents
RESISTIVITY 1.1 INTRODUCTION

Electrical Resistance

Lecture 11 Midterm Review Lecture

Contact resistance and TLM measurements

The Devices. Jan M. Rabaey

Lecture 0: Introduction

Fig. 1. Two common types of van der Pauw samples: clover leaf and square. Each sample has four symmetrical electrical contacts.

Lecture 3 Semiconductor Physics (II) Carrier Transport

The Devices: MOS Transistors

Module-2: Two probe and four probe methods- van der Pauw method

CMOS Scaling. Two motivations to scale down. Faster transistors, both digital and analog. To pack more functionality per area. Lower the cost!

ECE 142: Electronic Circuits Lecture 3: Semiconductors

Week 3, Lectures 6-8, Jan 29 Feb 2, 2001

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan

MOSFET Physics: The Long Channel Approximation

Lecture 17 Field-Effect Transistors 2

Ch/ChE 140a Problem Set #3 2007/2008 SHOW ALL OF YOUR WORK! (190 Points Total) Due Thursday, February 28 th, 2008

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination

EXPERIMENT 14. HALL EFFECT AND RESISTIVITY MEASUREMENTS IN DOPED GAAS 1. Hall Effect and Resistivity Measurements in Doped GaAs

Section 12: Intro to Devices

Quiz #1 Practice Problem Set

MOSFET: Introduction

Self-study problems and questions Processing and Device Technology, FFF110/FYSD13

SRI VIDYA COLLEGE OF ENGINEERING AND TECHNOLOGY VIRUDHUNAGAR Department of Electronics and Communication Engineering

Device Models (PN Diode, MOSFET )

Digital Electronics Part II - Circuits

Semiconductor Devices and Circuits Fall Midterm Exam. Instructor: Dr. Dietmar Knipp, Professor of Electrical Engineering. Name: Mat. -Nr.

Physics 217 Practice Final Exam

Lecture 14 Current Density Ohm s Law in Differential Form

6.012 Electronic Devices and Circuits

Carrier Transport by Diffusion

Lecture 4: CMOS Transistor Theory

Operation and Modeling of. The MOS Transistor. Second Edition. Yannis Tsividis Columbia University. New York Oxford OXFORD UNIVERSITY PRESS

Section 12: Intro to Devices

EECS130 Integrated Circuit Devices

Potential. The electrostatic field Is conservative (just like gravity) The (minimum) work done to move q from a to b:

in series Devices connected in series will have the same amount of charge deposited on each capacitor. But different potential difference. That means

Magnetostatics: Part 1

Electronic Devices & Circuits

Electronics Fets and Mosfets Prof D C Dube Department of Physics Indian Institute of Technology, Delhi

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor

Lecture 10 Charge Carrier Mobility

Electrostatics. Now we have finished our discussion on transmission line theory.

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

Device Models (PN Diode, MOSFET )

Lecture 6 PN Junction and MOS Electrostatics(III) Metal-Oxide-Semiconductor Structure

Introduction to Power Semiconductor Devices

MENA9510 characterization course: Capacitance-voltage (CV) measurements

Field-Effect (FET) transistors

Topics to be Covered. capacitance inductance transmission lines

Metal-oxide-semiconductor field effect transistors (2 lectures)

Let s go to something more concrete

Louisiana State University Physics 2102, Exam 2, March 5th, 2009.

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems

EE301 RESISTANCE AND OHM S LAW

6.012 Electronic Devices and Circuits

Introduction to Semiconductor Devices

FIELD EFFECT TRANSISTORS:

Physics 1214 Chapter 19: Current, Resistance, and Direct-Current Circuits

Experiment CM3: Electrical transport and the Hall effect in metals and semiconductors

EE 434 Lecture 13. Basic Semiconductor Processes Devices in Semiconductor Processes

Carrier transport: Drift and Diffusion

Carriers Concentration, Current & Hall Effect in Semiconductors. Prof.P. Ravindran, Department of Physics, Central University of Tamil Nadu, India

The Devices. Devices

Electric Field--Definition. Brownian motion and drift velocity

Introduction and Background

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor

Lecture 20: Semiconductor Structures Kittel Ch 17, p , extra material in the class notes

THE HALL EFFECT. Theory

Physics 202, Lecture 8. Exam 1

Impurity Content of a Semiconductor Crystal

EE 3329 Electronic Devices Syllabus ( Extended Play )

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

an introduction to Semiconductor Devices

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA

nmos IC Design Report Module: EEE 112

Supporting Online Material for

MICRO-SCALE SHEET RESISTANCE MEASUREMENTS ON ULTRA SHALLOW JUNCTIONS

A Computational Model of NBTI and Hot Carrier Injection Time-Exponents for MOSFET Reliability

SEMICONDUCTOR MATERIAL AND PROCESS CHARACTERIZATION USING THREE PROBES

EE 434 Lecture 12. Process Flow (wrap up) Device Modeling in Semiconductor Processes

Solid State Device Fundamentals

Lecture 12: MOSFET Devices

The objective of a grounding system are: 1. To provide safety to personnel during normal and fault conditions by limiting step and touch potential.

ELEC 3908, Physical Electronics, Lecture 19. BJT Base Resistance and Small Signal Modelling

Compare and Contrast electrical resistivity measurements in linear 4 probe and Montgomery

Extensive reading materials on reserve, including

Modelling for Formation of Source/Drain Region by Ion Implantation and Diffusion Process for MOSFET Device

Lecture-4 Junction Diode Characteristics

Lecture 18 Field-Effect Transistors 3

Micro Chemical Vapor Deposition System: Design and Verification

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Chenming Hu.

Lecture 2. Semiconductor Physics. Sunday 4/10/2015 Semiconductor Physics 1-1

Minority Carrier Diffusion Equation (MCDE)

Department of Electrical and Computer Engineering, Cornell University. ECE 3150: Microelectronics. Spring Exam 1 ` March 22, 2018

Ion Implantation. alternative to diffusion for the introduction of dopants essentially a physical process, rather than chemical advantages:

Lecture Number - 01 Metals, Semiconductors and Insulators

Reliability of 3D IC with Via-Middle TSV: Characterization and Modeling

Introduction to Semiconductor Devices

Nanoelectronic Thermoelectric Energy Generation

Transcription:

Resistivity: 4-probe measurement ELEC-L3211: Postgraduate Course in Micro and Nanoscience Libin Wang: libin.wang@aalto.fi 27/10/2016

My research experience (Master thesis) Mo2C superconducting crystal InAs semiconductor nanowire 2.0 80 K 1.8 G (e2/h) 40 K 30 K 25 K 20 K 15 K 10 K 8K 5K 1.9 K 1.6 1.4 Grown by MBE with Ag as catalyst 2 4 B (T) 6 8 Weak localization Weak anti-localization UCFs grown Chemical Vapor Deposition(CVD) Postgraduate Course in Micro and Nanoscience: Resistivity 1/22

Motivation Easy for me as I already did resistance measurement before Postgraduate Course in Micro and Nanoscience: Resistivity 2/22

Motivation Important for staring materials as it contributes to the many properties: series resistance capacitance threshold voltage hot carrier degradation of MOS device latch up of CMOS circuits This is really 4-point probe! Postgraduate Course in Micro and Nanoscience: Resistivity 3/22

introduction R = ρ L A = ρ L Wt Ohm s Law: R = V I J = σe(differential form) σ = q(nμ n + pμ p ) ρ: resistivity A=W*t: cross-section area L: Length Postgraduate Course in Micro and Nanoscience: Resistivity 4/22

Two point vs Four-point Probe R measure = 2R W + 2R C + R

Is this 4-points probe measurement? V V R I R I I No a I Yes b Postgraduate Course in Micro and Nanoscience: Resistivity 6/22

What we are measuring? Postgraduate Course in Micro and Nanoscience: Resistivity 7/22

4-point probe measurement E = Jρ = dv dr Bulk sample(3d): infinity in dimension(compared to S) Current density J = I 2πr 2 Voltage at point P: 0 VdV = Iρ r dr 2π 0 r 2 V = Iρ 2πr Voltage at P: V = Iρ 2πr = Iρ Iρ = Iρ 2πr 1 2πr 2 2π ( 1 1 ) r 1 r 2 Minus sign comes from current direction Postgraduate Course in Micro and Nanoscience: Resistivity 8/22

4-point probe measurement V 2 = Iρ 2π ( 1 s 1 1 s 2 + s 3 ) V 3 = Iρ 2π ( 1 s 1 + s 2 1 s 3 ) V = V 2 V 3 = Iρ 2π ( 1 s 1 1 s 2 + s 3 1 s 1 + s 2 + 1 s 3 ) ρ = 2π 1 s 1 1 (s 2 +s 3 1 (s 1 +s 2 ) + V 1 s 3 I (Correct equation 1.9, wrong printing on book 3 rd edition) Typical probe radii: 30-500μm Probe spacing: 0.5 1.5mm For most 4-point probe, s 1 =s 2 =s 3 =s ρ = 2πs V I Postgraduate Course in Micro and Nanoscience: Resistivity 9/22

4-point probe measurement dr = ρ dr A dx :differential length A = 2πr 2 : surface area penetrated by current R = r2 ρ dr 2πr 2 = 1 ρ 2s 2π r1 Postgraduate Course in Micro and Nanoscience: Resistivity 10/22

Correction factor Semiconductor wafer are not semi-infinite in lateral and vertical dimension ρ = 2πsF V I F = F 1 F 2 F 3 F 1 : corrects for sample thickness F 2 : corrects for lateral sample dimensions F 3 : correct for placement of the probes relative to sample edge All the correction factor we talk about next is only for collinear probes with equal probe spacing s Postgraduate Course in Micro and Nanoscience: Resistivity 11/22

Correction factor F 1 ρ = 2πsF V I For non-conducting bottom wafer surface boundary J = I 2πr 2 J = I (t s) 2πrt t: thickness of sample For conducting bottom wafer surface boundary Postgraduate Course in Micro and Nanoscience: Resistivity 12/22

Correction factor F 1 ρ = 2πsF V I For non-conducting bottom wafer surface boundary For conducting bottom wafer surface boundary Postgraduate Course in Micro and Nanoscience: Resistivity 13/22

Correction factor F 1 ρ = 2πsF V I For non-conducting bottom wafer surface boundary For t s Postgraduate Course in Micro and Nanoscience: Resistivity 14/22

Correction factor F 1 Sheet resistance R s is in units of Ohm/square. Resistance of a conductor line can now be easily calculated by breaking down the conductor into n squares: R = nr s Postgraduate Course in Micro and Nanoscience: Resistivity 15/22

Correction factor F 2 Sample size correction factor Sample must have a diameter D 40s for F 2 to be unity Postgraduate Course in Micro and Nanoscience: Resistivity 16/22

Correction factor F 2 Sample size correction factor Postgraduate Course in Micro and Nanoscience: Resistivity 17/22

Correction factor F 3 correct for placement of the probes relative to sample edge Probe distance from the wafer boundary at least 3-4 times of probe spacing Postgraduate Course in Micro and Nanoscience: Resistivity 18/22

Correction factor F 3 correct for placement of the probes relative to sample edge V 2 = Iρ 2π ( 1 s 1 1 s 2 + s 3 )(d s) Postgraduate Course in Micro and Nanoscience: Resistivity 19/22

Sample with arbitrarily shape Van der Pauw s theory: 1) The contacts are at the circumference of the sample 2) The contacts are sufficiently small 3) The sample is uniformly thick 4) Surface of sample is singly connected (i.e., samples does not contain isolated holes) F is not correction factor, F is a function depend on ratio Postgraduate Course in Micro and Nanoscience: Resistivity 20/22

Measurement errors, strengths and weaknesses errors 1. Sample Size 2. Minority/Majority Carrier Injection 3. Probe Spacing 4. Current 5. Temperature 6. Surface Preparation Weaknesses: surface damage and metal deposits on the sample Strength: popular used for long time and without calibrated Postgraduate Course in Micro and Nanoscience: Resistivity 21/22

Homework: modified with Problem 1.4 Derive an expression for resistivity of a 2D semiconductor sample with infinite in extent laterally measured with square four-point probe with the probes spaced a distance s shown below. The thickness of the sample is t, and t s. Current I enter probe 1 and leaves probe 4, voltage V is measured between probes 2 and 3. Postgraduate Course in Micro and Nanoscience: Resistivity 22/22