Small Signal Product mw Surface Mount Schottky Barrier Diode FEATURES - Fast switching speed - Low forward voltage drop - Surface mount device type - Moisture sensitivity level - Matte Tin (Sn) lead finish with Nickel (Ni) underplate - Pb free and RoHS compliant - reen compound (Halogen free) with suffix "" on packing code and prefix "" on date code MECHANICAL DATA - Case: small outline plastic package - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed: 260 C/s - Polarity: Indicated by cathode band - Weight: 0.006 gram (approximately) - Marking Code: KLA, KL6, KL7, KL8, KLB MAXIMUM RATINS AND ELECTRICAL CHARACTERISTICS (T A =25 unless otherwise noted) PARAMETER SYMBOL ALUE Peak Repetitive Peak Reverse oltage Working Peak Reverse oltage DC Reverse oltage Forward Continuous Current Repetitive Peak Forward Current Forward Surge Current @ t <.0 s Power Dissipation Thermal Resistance, Junction to Ambient Air RRM RWM R I F I FRM I FSM P D R θja Operating and Storage temperature T j, T ST -55 to 25 30 300 600 625 UNIT mw C/W o C PARAMETER SYMBOL MIN MAX UNIT Reverse Breakdown oltage I R =µa I F = I F = Forward oltage I F =30 I F = Reverse Current R =25 I R 2.0 µa Total Capacitance R =, f=.0mhz (BR) F Reverse Recovery Time I F =I R =, R L =Ω, I RR = C T t rr 30 0.32 0.40 0.50.00 5.0 pf ns
RATINS AND CHARACTERISTICS CURES (TA=25 unless otherwise noted) Fig. Forward Characteristics Fig. 2 Typical Reverse Characteristics 0 I F, Instantaneous Forward Current (A) 0. T A =25 o C T A = 75 o C T A = 25 o C T A =0 o C T A = -40 o C 0.0 0.2 0.4 0.6 0.8.0 I R, Instantaneous Reverse Current (ua) 0. 0.0 0.00 25 o C T A =25 o C T A =75 o C T A =25 o C T A =0 o C 0 20 30 F, Instantaneous Forward oltage () R, Instantaneous Reverse oltage () Fig. 3 Capacitance Between Fig. 3 Terminals Characteristics Fig. 4 Power Derating Curve C T, Capacitance Between Terminals (pf) 0 5 5 20 25 30 P D, Power Dissipation (mw) 0 0 25 50 75 25 50 R, Reverse oltage () T A, Ambient Temperature ( C)
ORDERIN INFORMATION PART NO. REEN MANUFACTURE PACKIN COMPOUND PACKAE PACKIN MARKIN BAT54AD BAT54CD BAT54SD BAT54BR (Note) KLA KL6 KL7 KL8 KLB Note: Manufacture special control, if empty means no special control requirement. EXAMPLE PREFERRED P/N PART NO. MANUFACTURE REEN COMPOUND PACKIN DESCRIPTION -D0 D0 reen compound reen compound
DIMENSIONS B C A D E H F DIM. Unit (mm) Unit (inch) Min Max Min Max A 2.000 2. 0.079 0.087 B.50.350 0.045 0.053 C 0.50 0.350 0.006 0.04 D..400 0.047 0.055 E 2.50 2.450 0.085 0.096 F 0.850.050 0.033 0.04 0.250 0.460 0.0 0.08 H 0.000 0. 0.000 0.004 SUESTED PAD LAYOUT PIN CONFIURATION DIM Z X Y C C2 Unit (mm) Unit (inch) Typ. 3.20 Typ. 0.26.60 0.063 0.55 0.022 0.80 0.03 2.40 0.094 0.95 0.037
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