Features Transient prtectin fr high-speed data lines IEC 61000-4-2 (ESD) ±25kV (Air) ±20kV (Cntact) IEC 61000-4-2 (EFT)40A(5/50 ns) Cable Discharge Event (CDE) Package ptimized fr high-speed lines Ultra-small package (1.0mmx0.6mmx0.55mm) Prtects ne data, cntrl r pwer line Lw capacitance: 0.35pF (Typical) Lw leakage current: 10nA@V RWM(Typical) Lw clamping vltage Each I/O pin can withstand ver 1000 ESD strikes fr ±8kV cntact discharge ROHS cmpliant Applicatins Serial ATA PCI Express Desktps, Servers and Ntebks Cellular Phnes MDDI Prts USB2.0/3.0 Pwer and Data Line Prtectin Display Prts Digital Visual Interfaces (DVI) HDMI 1.4/2.0 Mechanical Characteristics DFN1006 package Flammability Rating: UL 94V-0 Packaging: Tape and Reel Descriptin Circuit Diagram I/O_1 is a lw-capacitance Transient Vltage Suppressr (TVS) designed t prvide electrstatic discharge (ESD) prtectin fr high-speed data interfaces. With typical capacitance f 0.35pF nly is designed t prtect parasitic-sensitive systems against ver-vltage and ver-current transient events. It cmplies with IEC61000-4-2(ESD),Level 4 ( ±15 kv air, ±8kV cntact discharge), IEC 61000-4-4 (electrical fast transient - EFT)(40A,5/50 ns), very fast charged device mdel (CDM) ESD and cable discharge event (CDE), etc. Pin Cnfiguratin I/O_2 uses ultra-small DFN1006 package.. Each device can prtect ne high-speed data line. It ffers system designers flexibility t prtect single data line where space is a premium cncern. The cmbined features f lw capacitance, ultra-small size and high ESD rbustness make ideal fr high-speed data prt and high-frequency line (e.g., USB 2.0 & antenna line) applicatins, such as cellular phnes and HD visual devices. DFN1006 (Tp View) 1
Abslute Maximum Rating Symbl Parameter Value Units V ESD ESD per IEC 61000-4-2 (Air) ESD per IEC 61000-4-2 (Cntact) ±25 ±20 T OPT Operating Temperature -55/+125 T STG Strage Temperature -55/+150 C kv C Electrical Characteristics (T=25 C) Symbl V RWM Parameter Nminal Reverse Wrking Vltage I PP I Reverse Leakage Current @ V RWM V BR Reverse Breakdwn Vltage @ I T I T V C Test Current fr Reverse Breakdwn Clamping Vltage @ I PP V BR V RWM V C I T IT V RWM V BR V C V I PP Peak Pulse Current C ESD Parasitic Capacitance V R Reverse Vltage I PP f Small Signal Frequency Bi-Directinal TVS Symbl Test Cnditin Minimum Typical Maximum Units V RWM 5.0 V V BR V C C ESD V RWM = 5V, T = 25 C I T = 1mA I PP = 1A, t p = 8/20μs V R = 0V, f = 1MHz 1 1.0 μa 7.0 8.8 11 V 12 V 0.35 0.50 pf 2
Vltage Sweeping f I/O t I/O Insertin Lss S21 f I/O t I/O 10 08 06 5.0 Current (A) 04 02 00-02 -04-06 -08-10 -10-8 -6-4 -2 0 2 4 6 8 10 Vltage (V) Insertin Lss (db) -5.0-1 -15.0-2 -25.0-3 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) Capacitance vs. Vltage f I/O t I/O (f=1mhz) Capacitance vs. Reverse Vltage Nrmalized Capacitance vs. Reverse Vltage Capacitance (pf) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 1 2 3 4 5 Reverse Vltage (V) Nrmalized Capacitance 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 1 2 3 4 5 Reverse Vltage (V) ESD Clamping f I/O t I/O (+8kV Cntact per IEC 61000-4-2) ESD Clamping f I/O t I/O (-8kV Cntact per IEC 61000-4-2) 6 2 5 1 Clamping Vltage (V). 4 3 2 1 Clamping Vltage (V). -1-2 -3-4 -1-5 -2-50 0 50 100 150 200 Time (ns) -6-50 0 50 100 150 200 Time (ns) 3
Package Outline DFN1006 package 2 leads, very small package MSL-1 Package Dimensins (Cntrlling dimensins are in millimeters) Symbl Dimensins In Millimeters Dimensins In Inches Minimum Maximum Minimum Maximum A 0.450 0.550 18 22 A1 0.15 REF A2 00 50 00 02 E 0.950 1.050 37 41 D 0.550 0.650 22 26 b 0.250 0.350 10 14 b1 0.150 0.250 06 10 L1 0.300 0.400 12 16 L2 0.250 0.350 10 14 4
Tape and Reel Specificatin T P0 P2 Φ2: 1.55±5 Device Orientatin in Tape Tp Cver Tape 3 REF W A0 E F B0 K0 P Φ: 0.40±5 Pin1 Lcatin Symbl W A0 B0 K0 E F P P0 P2 T Dimensins (mm) 8.00±0.1 0.7±5 1.15±5 0.55±5 1.75±0.1 3.5±5 2.0±0.1 4.0±0.1 2.0±5 0.2±5 Marking Cdes Ordering Infrmatin S Part Number Wrking Vltage Quantity Per Reel Reel Size 5V 10,000 7 Inch Nte: (1) "S" is part number, fixed. (2) n cathde line and date cde. 5
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