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Transcription:

NPN Silicon RF Transistor* For low noise, highgain amplifiers up to GHz For linear broadband amplifiers f T = 8 GHz, F = db at 900 MHz * Short term description ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type Marking Pin Configuration Package BFP9 RCs = C = E = B = E SOT Maximum Ratings Parameter Symbol Value Unit Collectoremitter voltage V CEO V Collectoremitter voltage V CES 0 Collectorbase voltage V CBO 0 Emitterbase voltage V EBO Collector current I C 80 ma Base current I B Total power dissipation ) P tot 580 mw T S 7 C Junction temperature T j 50 C Ambient temperature T A 65... 50 Storage temperature T stg 65... 50 Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) R thjs 5 K/W TS is measured on the collector lead at the soldering point to the pcb For calculation of RthJA please refer to Application Note Thermal Resistance 005

Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Collectoremitter breakdown voltage V (BR)CEO V I C = ma, I B = 0 Collectoremitter cutoff current I CES 0 µa V CE = 0 V, V BE = 0 Collectorbase cutoff current I CBO 0 na V CB = V, I E = 0 Emitterbase cutoff current I EBO µa V EB = V, I C = 0 DC current gain I C = 0 ma, V CE = 8 V, pulse measured h FE 70 0 0 005

Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. AC Characteristics (verified by random sampling) Transition frequency f T 6 8 GHz I C = 50 ma, V CE = 8 V, f = 500 MHz Collectorbase capacitance V CB = V, f = MHz, V BE = 0, emitter grounded C cb 0.59 0.9 pf Collector emitter capacitance V CE = V, f = MHz, V BE = 0, base grounded Emitterbase capacitance V EB = 0.5 V, f = MHz, V CB = 0, collector grounded Noise figure I C = ma, V CE = 8 V, Z S = Z Sopt, f = 900 MHz I C = ma, V CE = 8 V, Z S = Z Sopt, f =.8 GHz C ce 8 C eb.5 F.6 db Power gain, maximum available ) G ma I C = 0 ma, V CE = 8 V, Z S = Z Sopt, Z L = Z Lopt, f = 900 MHz 8 I C = 0 ma, V CE = 8 V, Z S = Z Sopt, Z L = Z Lopt, f =.8 GHz Transducer gain S e db I C = 0 ma, V CE = 8 V, Z S = Z L = 50Ω, f = 900 MHz.5 I C = 0 ma, V CE = 8 V, Z S = Z L = 50Ω, f =.8 GHz 8.5 G ma = S / S (k(k²) /) 005

SPICE Parameter (GummelPoon Model, BerkleySPICE G.6 Syntax): Transitor Chip Data: IS = 78 fa VAF = V NE =.95 VAR =.87 V NC = 0.97 RBM = Ω CJE =.8 ff TF = 8.88 ps ITF = 0.9689 ma VJC =.88 V TR =.007 ns MJS = 0 XTI = BF = 5 IKF = 699 A BR =.67 IKR = 0.0795 A RB =.868 Ω RE = 0.765 VJE = 0.7076 V XTF = 0.6977 PTF = 0 deg MJC = 0.000 CJS = 0 ff NK = 0 FC = 0.706 NF = 0.95 ISE =.67 fa NR =.89 ISC = 0.0709 fa IRB = 0.976 ma RC = 0.98 Ω MJE = 0.865 VTF = 0.8 V CJC = 95.0 ff XCJC = 0.0556 VJS = 0.75 V EG =. ev TNOM 00 K All parameters are ready to use, no scalling is necessary. Extracted on behalf of Infineon Technologies AG by: Institut für Mobil und Satellitentechnik (IMST) Package Equivalent Circuit: L BI = 0.8 nh L BO = 0.65 nh L EI = 0. nh L EO = 0. nh L CI = 0.07 nh L CO = 0. nh C BE = 5 ff C CB = 9 ff C CE = 8 ff Valid up to 6GHz For examples and ready to use parameters please contact your local Infineon Technologies distributor or sales office to obtain a Infineon Technologies CDROM or see Internet: http//www.infineon.com/silicondiscretes 005

Total power dissipation P tot = ƒ(t S ) Permissible Pulse Load R thjs = ƒ(t p ) 600 mw 500 K/W 50 Ptot 00 50 RthJS 00 50 00 50 0 50 0.5 0. 0.05 0.0 0.0 0.005 D = 0 0 0 0 0 60 80 0 0 C 50 T S 0 7 6 5 s 0 t p Permissible Pulse Load P totmax /P totdc = ƒ(t p ) Ptotmax/PtotDC D = 0 0.005 0.0 0.0 0.05 0. 0.5 0 7 6 5 s 0 t p 005 5

Package SOT BFP9 Package Outline +0. 0.8 0.05.9 ±0..9.7 B +0. 0. 0.05 5 M B. ±0.5 0.5 MIN. MAX. 0...8 M A ±0. 0. MAX. MAX. 0.08...0.5. ±0. A Foot Print 0.8. 0.8. 0.8 0.8 0.9. 0.9 Marking Layout Manufacturer s Date code (Year/Month) RF s 56 005, June Pin Type code BFP8 Example Standard Packing Reel ø80 mm =.000 Pieces/Reel Reel ø0 mm =.000 Pieces/Reel.6 8 Pin.5.5 005 6

Published by Infineon Technologies AG, St.MartinStrasse 5, 8669 München Infineon Technologies AG 005. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of noninfringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 7 005