High Curren Ferrie Chip Bead(Lead Free) P1. HCB-Series 1.Feaures 1.Monolihic inorganic maerial consrucion. 2.Low DC resisance srucure of elecrode o preven waseful elecric power consumpion. 3.Closed magneic circui avoids crossalk. 4.Suiable for flow and reflow soldering. 5.Shapes and dimensions follow E.I.A. spec. 6.Available in various sizes. 7.Excellen solderabiliy and hea resisance. 8.High reliabiliy. 9.This componen is complian wih ohs legislaion and also suppor lead-free soldering. 2.Dimensions Chip size Size A(mm) B(mm) C(mm) D(mm) 168 1.6±.15.8±.15.8±.15.3±.2 212 2.±.2 1.25±.2.85±.2.5±.3 3.Par Numbering HCB 168 KF - 121 T 2 A B C D E F A: Series B: Dimension L x W C: Maerial Lead Free Maerial D: Impedance 121=12 E: Packaging T=Taping and eel, B=Bulk(Bags) F: aed Curren 2=2mA 4.Specificaion Par Number Impedance () Tes Frequency (MHz) DC esisance () max. aed Curren (ma) HCB168KF-3T3 3±25% 1.4 3 HCB168KF-8T3 8±25% 1.4 3 HCB168KF-121T2 12±25% 1.1 2 HCB168KF-151T2 15±25% 1.1 2 HCB168KF-221T2 22±25% 1.1 2 HCB168KF-31T1 3±25% 1.2 1 HCB168KF-471T1 47±25% 1.2 1 HCB168KF-61T1 6±25% 1.2 1 HCB212KF-3T3 3±25% 1.4 3 HCB212KF-8T3 8±25% 1.4 3 HCB212KF-121T2 12±25% 1.1 2 HCB212KF-151T2 15±25% 1.1 2 HCB212KF-221T2 22±25% 1.1 2 HCB212KF-31T1 3±25% 1.2 1 HCB212KF-471T1 47±25% 1.2 1 HCB212KF-61T1 6±25% 1.2 1
5. eliabiliy and Tes Condiion Iem Performance Tes Condiion P2. Series No. FCB FCM HCB HPB HFB FCA FCI FHI FCH HCI -- Operaing Temperaure -55~+125 (Including self-emperaure rise) -4~+85 (Including self-emperaurerise) -- Sorage Temperaure -55~+125-4~+85 -- Impedance () Inducance (Ls) Q Facor DC esisance efer o sandard elecrical characerisics lis HP4291A, HP4287A+1692A HP4338B aed Curren Temperaure ise Tes Solder hea esisance 3max. (T) Appearance: No significan abnormaliy. Impedance change: Wihin 3%. ** 1. Applied he allowed DC curren. 2. Temperaure measured by digial surface hermomeer. Prehea: 15,6sec. No mechanical damage. Solder: Sn-Ag3.-Cu.5 emaining erminal elecrode:7% min. Solder amperaure: 26 5 Flux for lead free: rosin Dip ime: 1.5sec. Preheaing Dipping Naural cooling 26 C 15 C 6 1±.5 Solderabiliy More han 9% of he erminal elecrode should be covered wih solder. 245 C 15 C Preheaing Dipping Naural cooling 6 4±1 Prehea: 15,6sec. Solder: Sn-Ag3.-Cu.5 Solder amperaure: 245±5 Flux for lead free: rosin Dip ime: 4±1sec. Terminal srengh The erminal elecrode and he dielecric mus no be damaged by he forces applied on he righ condiions. W W For FCB FCM HCB HPB HFB FCI FHI FCH HCI: Size Force (Kfg) Time(sec) 15.2 168.5 212.6 3216 1. >25 3225 1. 4516 1. 4532 1.5 575 2. For FCA: Size Force (Kfg) Time(sec) 3216.5 >25 2(.787) Flexure srengh The erminal elecrode and he dielecric mus no be damaged by he forces applied on he righ condiions. 45(1.772) 45(1.772) Bending 4(1.575) Solder a chip on a es subsrae, bend he subsrae by 2mm (.79in)and reurn. 1(3.937) Bending Srengh The ferrie should no be damaged by Forces applied on he righ condiion..5(.2) Size mm(inches) P-Kgf 168.8(.33).3 212 1.4(.55) 1. FCA3216 2.(.79) 1.5 3216 3225 2.(.79) 2.5 4516 4532 575 2.7(.16) 2.5 andom Vibraion Tes Appearance: Cracking, shipping and any oher defecs harmful o he characerisics should no be allowed. Impedance: wihin 3% Frequency: 1-55-1Hz for 1 min. Ampliude: 1.52mm Direcions and imes:, Y, direcions for 2 hours. A period of 2 hours in each of 3 muually perpendicular direcions (Toal 6 hours).
P3. Iem Performance Tes Condiion Loading a High Temperaure Humidiy Thermal shock Low emperaure sorage es Drop Appearance: no damage. Impedance: wihin 3%of iniial value. Inducance: wihin 1%of iniial value. Q: wihin 3%of iniial value. (FCI FHI FCH) Q: wihin 2%of iniial value. (HCI ) For Bead Appearance: no damage. Phase Temperaure() Time(min.) 1-55 2 3 3 Impedance: wihin 3%of iniial value. Inducance: wihin 1%of iniial value. 2 +125 5 3 3 Measured: 5 imes Q: wihin 3%of iniial value. (FCI FHI FCH) For Inducor Q: wihin 2%of iniial value. (HCI) Phase Temperaure() Time(min.) 1-4 2 3 3 2 +85 5 3 3 Measured: 1 imes a: No mechanical damage b: Impedance change: 3% Temperaure: 125 5(bead),85 5(inducor) Applied curren: raed curren. Duraion: 18 12hrs. for 2 o 3hrs. Humidiy: 9~95%H. Temperaure: 4 2. Temperaure: 6 2.(HCI) Duraion: 18 12hrs. for 2 o 3hrs. For FCB FCM HCB HPB HFB FCA Condiion for 1 cycle Sep1: -55 2 3 3 min. Sep2: +125 5 3 3 min. Number of cycles: 5 For FCI FHI FCH HCI Condiion for 1 cycle Sep1: -4 2 3 3 min. Sep2: +85 5 3 3 min. Number of cycles: 1 for 2 o 3 hrs. Temperaure: -55 2. Duraion: 18 12hrs. for 2 o 3hrs. Drop 1 imes on a concree floor from a heigh of 75cm Deraing **Deraing Curve For he ferrie chip bead which wihsanding curren over 1.5A, as he operaing emperaure over 85, he deraing curren informaion is necessary o consider wih. For he deail deraing of curren, please refer o he Deraed Curren vs. Operaing Temperaure curve. Deraed Curren(A) 6 5 4 3 2 1 6A 5A 4A 3A 2A 1.5A 1A 6.Soldering and Mouning 6-1. ecommended PC Board Paern 85 Operaing Temperaure( C) 125 Land Paerns For Chip Size eflow Soldering Series Type A(mm) B(mm) C(mm) D(mm) L(mm) G(mm) H(mm) FCB 15 1..1.5.1.5.1.25.1 2.1.5.55 FCA3216 2.8 Land Solder esis FCM 168 1.6.15.8.15.8.15.3.2 2.6.6.8 HCB HPB 212 2..2 1.25.2.85.2.5.3 2..2 1.25.2 1.25.2.5.3 3. 1. 1. HFB 252 2.5.2 2..2 1.6.2.5.3 3.9 1.5 1.5 2.2-2.6.8 FCI 3216 3.2.2 1.6.2 1.1.2.5.3 4.4 2.2 1.4 FHI 3225 3.2.2 2.5.2 1.3.2.5.3 4.4 2.2 3.4 FCH 4516 4.5.2 1.6.2 1.6.2.5.3 5.7 2.7 1.4 HCI 4532 4.5.2 3.2.2 1.5.2.5.3 5.9 2.57 4.22 UHI 575 5.7.2 5..3 1.8.2.5.3 8. 4. 5.8.8 Pich.4 L G H PC board should be designed so ha producs are no sufficien under mechanical sress as warping he board. Producs shall be posiioned in he sideway direcion agains he mechanical sress o preven failure. 6-2. Soldering Mildly acivaed rosin fluxes are preferred. The minimum amoun of solder can lead o damage from he sresses caused by he difference in coefficiens of expansion beween solder, chip and subsrae. The erminaions are suiable for all wave and re-flow soldering sysems. If hand soldering canno be avoided, he preferred echnique is he uilizaion of ho air soldering ools.
6-2.1 Lead Free Solder re-flow: ecommended emperaure profiles for lead free re-flow soldering in Figure 1. 6-2.2 Solder Wave: Wave soldering is perhaps he mos rigorous of surface moun soldering processes due o he seep rise in emperaure seen by he circui when immersed in he molen solder wave, Due o he risk of hermal damage o producs, wave soldering of large size producs is discouraged. ecommended emperaure profile for wave soldering is shown in Figure 2. 6-2.3 Soldering Iron(Figure 3): Producs aachmen wih a soldering iron is discouraged due o he inheren process conrol limiaions. In he even ha a soldering iron mus be employed he following precauions are recommended. Noe Prehea circui and producs o 15 Never conac he ceramic wih he iron ip Use a 2 wa soldering iron wih ip diameer of 1.mm 35ip emperaure for Ferrie chip bead (max) 1.mm ip diameer (max) Limi soldering ime o 3 sec. eflow Soldering TEMPEATUE( C) PE-HEATING TP(26 C / 1s max.) 217 2 15 6~18s SOLDEING 2~4s 6~15s NATUAL COOLING TEMPEATUE C TEMPEATUE C 25 48s max. TIME( sec.) Figure 1. e-flow Soldering(Lead Free) Figure 2. Wave Soldering Figure 3. Hand Soldering 6-2.4 Solder Volume: Accordingly increasing he solder volume, he mechanical sress o produc is also increased. Exceeding solder volume may cause he failure of mechanical or elecrical performance. Solder shall be used no o be exceed as shown in righ side: Upper limi ecommendable 7.Packaging Informaion 7-1. eel Dimension A D B P4. 26 245 15 PE-HEATING SOLDEING NATUAL COOLING 35 33 15 PE-HEATING SOLDEING 3s(max.) 1s(max.) NATUAL COOLING Over 2 min. Wihin 1 sec. Gradual Cooling Over 1 min. Gradual Cooling 2±.5 13.5±.5 1.5 Type A(mm) B(mm) C(mm) D(mm) C 1.9.5 7 x8mm 9..5 6 2 13.5.5 178 2 12 7 x12mm 13.5.5 6 2 13.5.5 178 2 7"x8mm 7"x12mm 7-2.1 Tape Dimension / 8mm Maerial of aping is paper E:1.75±.1 P2:2±.1 P:4±.1 D:1.56+.1-.5 B W:8.±.1 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) (mm) D1(mm) FCB.FCM.HCB HPB.HFB.FCI 155 1.12.3.62.3.6.3 2..1.6.3 none 1688 1.85.5 1.5.5.95.5 4..1.95.5 none F:3.5±.1 P A Ko FHI.FCH.HCI 2129 2.3.5 1.5.5.95.5 4..1.95.5 none Maerial of aping is plasic E:1.75±.1 P2:2±.5 Po:4±.1 D:1.5+.1 A W:8.±.1 Bo Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) (mm) D1(mm) FCB,FCM 1688 1.95.1 1.5.1 1.5.1 4..1.23.5 none HCB,HPB 2129 2.25.1 1.42.1 1.4.1 4..1.22.5 1..1 HFB.FCI 21212 2.35.1 1.5.1 1.45.1 4..1.22.5 1..1 F:3.5±.5 P D1:1±.1 A Ao Ko FHI.FCH 321611 3.5.1 1.88.1 1.27.1 4..1.22.5 1..1 HCI 322513 3.42.1 2.77.1 1.55.1 4..1.22.5 1..1 SECTION A-A FCA 32169 3.4.1 1.77.1 1.4.1 4..1.22.5 1..1 www.bulllwill.com.w
7-2.2 Tape Dimension / 12mm P5. 1.75±.1 Po:4±.1 P2:2.±.5 D:1.5+.1 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) (mm) D1(mm) FCB, 451616 4.95.1 1.93.1 1.93.1 4..1.24.5 1.5.1 5.5±.5 W:12.±.1 Bo HCB.FCM 453215 4.95.1 3.66.1 1.85.1 8..1.24.5 1.5.1 FCI 57518 6.1.1 5.4.1 2..1 8..1.3.5 1.5.1 D1:1.5±.1 P Ko Ao 7-3. Packaging Quaniy Chip Size 57518 453215 451616 322513 321611 21212 2129 1688 155 Chip / eel 1 1 2 25 3 2 4 4 1 Inner box 4 4 8 125 15 1 2 2 5 Middle box 2 2 4 625 75 5 1 1 25 Caron 4 4 8 125 15 1 2 2 5 Bulk (Bags) 7 12 2 3 5 1 15 2 3 7-4. Tearing Off Force Top cover ape F 165 o18 The force for earing off cover ape is 15 o 6 grams in he arrow direcion under he following condiions. oom Temp. () oom Humidiy (%) oom am (hpa) Tearing Speed mm/min Base ape 5~35 45~85 86~16 3 Applicaion Noice Sorage Condiions To mainain he solderabiliy of erminal elecrodes: 1. Temperaure and humidiy condiions: -1~ 4and 3~7% H. 2. ecommended producs should be used wihin 6 monhs from he ime of delivery. 3. The packaging maerial should be kep where no chlorine or sulfur exiss in he air. Transporaion 1.Producs should be handled wih care o avoid damage or conaminaion from perspiraion and skin oils. 2. The use of weezers or vacuum pick up is srongly recommended for individual componens. 3. Bulk handling should ensure ha abrasion and mechanical shock are minimized.
Impedance Frequency Characerisics(Typical) P6. 12 HCB168KF-3T3 16 HCB168KF-8T3 3 HCB168KF-121T2 25 9 6 3 1 1 1 1 12 8 4 1 1 1 1 2 15 1 5 1 1 1 1 3 HCB168KF-151T2 4 HCB168KF-221T2 4 HCB168KF-31T1 25 2 15 1 5 3 2 1 3 2 1 1 1 1 1 1 1 1 1 1 1 1 1 8 HCB168KF-471T1 8 HCB168KF-61T1 6 HCB212KF-3T3 6 4 2 6 4 2 5 4 3 2 1 1 1 1 1 1 1 1 1 1 1 1 1 2 HCB212KF-8T3 3 HCB212KF-121T2 4 HCB212KF-151T2 16 12 8 4 2 1 3 2 1 1 1 1 1 1 1 1 1 1 1 1 1 6 HCB212KF-221T2 6 HCB212KF-31T1 8 HCB212KF-471T1 4 2 4 2 6 4 2 1 1 1 1 1 1 1 1 1 1 1 1 8 HCB212KF-61T1 6 4 2 1 1 1 1