Radiation hardness of Low Gain Amplification Detectors (LGAD)

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Radiation hardness of Low Gain Amplification Detectors (LGAD) G. Kramberger, V. Cindro, I. Mandić, M. Mikuž Ϯ, M. Zavrtanik Jožef Stefan Institute, Ljubljana, Slovenia Ϯ also University of Ljubljana, Faculty of Physics and Mathematics G. Pellegrini, M. Baselga Bacardit, S. Hidalgo, P. Fernandez, D. Quirion CNM Barcelona V. Fadeyev, H. Sadrozinski SCIPP, UC Santa Cruz

Motivation/Outline The focus of this presentation will be on: Gain (Pablos s run R6474): its change with irradiation neutrons and 800 MeV protons reasons for degradation of gain TCT measurements used to study properties of p + implant layer after irradiation Leakage current and noise after irradiation NEW Diodes were irradiated with reactor neutrons in steps with 80 min annealing at 60 o C between irradiation fractions : W8 from 1,2,3,5,20,100 10 14 cm -2 W7 from 1,2,3,5,10,20, 30 10 14 cm -2 Diode irradiated at Los Alamos with 800 MeV were not intentionally annealed W8 fluences ~5e12, 5e13, 5e14, 8e15 cm -2 W9 control wafer (without amplification layer) - 5e12, 5e13, 5e14, 8e15 cm -2 For setups and procedures please have a look at last workshops G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 2

Charge collection of diodes from W7 and W8 M~2-4 M~8-20 signal in a standard diode Wafers have different gains: Good uniformity of gain over the wafer. Very good stability of some diodes up to >1000 V. For W8 samples the gain at >900 V is difficult to measure amplifier saturates due to too large signals note steeper increase of gain for U>500V. G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 3

Current of diodes from W7 and W8 The current of the devices differ for almost 3 orders of magnitude for both wafers: It is not correlated with gain. The excess current for high current devices is not bulk related almost no temperature dependence. It is probably homogenously distributed over the surface (IR images). G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 4

CCE of irradiated detectors (reactor neutrons) Selected detectors from wafers with different initial currents: W7-C9 (~1 ma), W7-I6 (~10 ma), W7-G4 (100 ma) and W8-H11 (< 1 ma), W8-E3 (<1 ma) 80 min@60 o C, T=-10 o C W8 around 6000 e collected at 10 16 cm -2, which is roughly the same (or slightly more) as for standard diode There is almost no influence of CCE of devices on the initial current for W7 some difference at lower bias voltages at 5 10 14 cm -2. G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 5

CCE of irradiated detectors (reactor neutrons) M Q = Q W7,W8 Q st.diode ~25000 e (st. nirr. diode) M Q ~1.5 Charge multiplication measured at ~V fd (similar for W7 and W8) decreases with F eq Decrease of charge collection: Trapping (not severe enough at low fluences to explain decrease) Decrease of multiplication? initial acceptor removal trapped holes reduce the field in the multiplication region G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 6

CCE of irradiated detectors (800 MeV p) As irradiated no intentional annealing. Stronger decrease of gain than with neutrons almost no gain at 8 10 13 p cm -2 (F eq ~5 10 15 cm -2 ). Measured current for control and LGAD devices are similar. For higher fluences there is almost no gain. Currents are very high for 8 10 13 p cm -2 (F eq ~5 10 13 cm -2 ) also for F eq ~5 10 12 cm -2 sensor? W8-B7 shows gain at higher voltages! G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 7

TCT signals back injection (I) F eq =0 F eq =4.93 10 12 cm -2 F eq=5.63 10 13 cm -2 F eq =4.86 10 14 cm -2 Significant decrease of amplification with fluence. G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 8

TCT signals back injection (II) F eq =5.63 10 13 cm -2 F eq =2 10 14 cm -2 Similar TCT signals, but the difference in fluence is a factor of 4. G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 9

1/C 2 [1/F 2 ] How to probe the field? C-V offers a way to profile N eff (unfortunately not reliable after irradiation) 1.4E+22 depletion of the p-bulk (V fd ~80 V) 1.2E+22 1.0E+22 8.0E+21 6.0E+21 4.0E+21 2.0E+21 1.0E+16 n=10 khz, T=20 o C W7-C9 0 50 100 150 200 Bias Voltage [V] depletion of p + layer (V mr ~30 V) V mr determines approximately the gain that can be achieved W8 W7 G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 10

Probing multiplication layer with TCT In similar way as C-V one can determine the V mr from the signal. Front illumination with red light is exploited illumination of n ++ -p + contact 1. W8-E3 Integration time 20 ns W7-J10 M Q ~8-20 1. V mr 2. 2. M Q ~2-4 Clear onset of depletion region growth in p bulk coincides well with CV Strong dependence of multiplication on N eff,p+ (~7 V in V mr difference between W7 and W8) V mr N eff,p+ G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 11

TCT probing of V mr W7 wafer irradiated with neutrons Difference: neutrons/800 MeV p W8 F eq =5 10 14 cm -2 (neutrons) W8 F eq =4.86 10 14 cm -2 (800 MeV p) V mr decreases with fluence V mr decreases more for 800 MeV protons than reactor neutrons G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 12

Dependence of V mr on fluence W7 wafer (neutrons) W8 wafer (neutrons) W8 wafer (800 MeV p) V mr = V mr,0 exp ( c Φ eq ) c W8 = 9.4 10 16 cm 2 c W7 = 8.1 10 16 cm 2 c W8 = 1.6 10 15 cm 2 Assuming linear relation between V mr and N eff,p+ one can compare c to old data on high res Si low current devices only (R. Wunstorf, NIMA 377 (1996) 228.)) c = 2 10 13 cm 2 After removal of 50 % of effective acceptors the gain in signal due to amplification is of the order of M Q ~1.2 (for W7) For the W8 samples at 1e14 cm -2 the removal is only marginal ~10% (32 V 30 V) which is in accordance with reduction of M Q =8 to M Q =5. Removal constant is much smaller than one would expect from high resistivity measurements. Removal constant for 800 MeV p is much larger (note: a single point) G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 13

What is the reason for reduction of V mr? Decrease of shallow acceptors concentration ( B )-> no temperature dependence (in the investigated range) weak dependence of N eff,p+ on enhanced free carrier concentration (achieved by higher frequency of pulses) Moderation of field by trapped holes -> G-R processes can lead to dependence of V mr on temperature and free carrier concentration 5 10 14 cm -2 5 10 14 cm -2 T=15 o C T=0 o C T=-15 o C W7-C9, f=500 Hz W7-C9, T=-15 o C It seems that removal of shallow acceptors is responsible for gain degradation. G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 14

Amplification after 10 16 cm -2 No visible V mr indicates that highly doped p + layer has vanished. This is in accordance with observation of almost no difference between standard and LGAD diode T=-15 o C V bias =4 V T=-15 o C W8-H11 G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 15

Leakage current after irradiation Leakage current increase is not linear with fluence. Increase with fluence in smaller due to degradation of multiplication I leak = M I I gen = M I α Φ decreases with irradiation increases with irradiation G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 16

Multiplication factors M I W8-H11 W8-H11-10 o C 230 V 0 o C 1000 V -10 o C -20 o C -20 o C M I ~6.4-26 o C M I ~1.9-25 o C M I = I leak I gen = I leak α Φ a(-20 o C)=5.1e-19 A cm -1 Temperature dependence: generation current strong multiplication - weak G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 17

Multiplication factors M I and M Q T=-20 o C M Q = Q W8 H11 Q st.diode Q st.diode from: G.Kramberger et al.,21 st RD50 workshop, CERN 2012 G.Kramberger et al., NIMA 612(2010) 288. whole bulk active (1000V at high F) M I = I = I I gen α Φ a(-20 o C)=5.1e-19 A cm -1 G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 18

Leakage current of irradiated W7 detectors The leakage current increases as expected (reduction of M I and increase of I gen ) for W7-C9 device For the high current devices the leakage current decreases at moderate fluences: reduction of M I deactivation/decrease of injection centers??? high current device low current device G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 19

Calculation of the noise M Q ~5 at 230 V ENC 2 = ENC MI 2 +ENC S 2 ENC S =2300 e series noise ENC MI = M I ENC I = e/2 F ENC I I gen e 0 τ M Q ~1.6 at 1000 V Red open markers calculated Black solid markers - measured ENC I noise due to generation current without amplification short noise (CR-RC shaping) F = 2 for M 1, F=1 for M~1 τ = 25 ns I gen = α Φ eq M I ~ M Q Good agreement between measured and calculated noise. S N = M Q Q S/N improves with multiplication if: ENC S 2 + M I 2 I gen e 2 Fe 0 τ 4 ENC S 2 M 2 I gen e 2 Fe 0 τ 4 G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 20

Conclusions Diodes with gain perform formidably before the irradiation with gain of up to ~20 for 90 Sr electrons Gain decreases significantly with neutron irradiation and even more with 800 MeV p irradiations Effective acceptor removal in the p + layer is responsible for gain degradation TCT was used to determine the rate of effective acceptor removal It seems that removal of initial acceptor dominates over changing the occupancy of deep traps Leakage current: behaves accordance with expectations for low current devices decreases with irradiation for high current devices Noise agrees well with calculation taking into account multiplication factors G. Kramberger, Radiation hardness of Low Gain Amplification Detectors (LGAD), 24th RD50 Workshop, Bucharest, June 2014 21