218-2-23 Silicon Photodiode with Vλ Characteristic Version 1.2 SFH 244 Features: Spectral sensitivity adapted to Human Eye Sensitivity (V λ ) Low temperature coefficient of spectral sensitivity High linearity DIL plastic package with high packing density Fast switching time Applications Ambient light sensor (Mobile phone, regulation of air conditioning) Bio Monitoring Ordering Information Type: Spectral sensitivity Ordering Code S [na/ix] V R = 5 V, standard light A, T = 2856 K SFH 244 9.4 Q65111A8524 218-2-23 1
Version 1.2 SFH 244 Maximum Ratings (T A = 25 C) Parameter Symbol Values Unit Operating and storage temperature range T op ; T stg -4... 1 C Reverse voltage V R 16 V Total Power dissipation P tot 15 mw ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS-1 - HBM) Characteristics (T A = 25 C) V ESD 15 V Parameter Symbol Values Unit Spectral sensitivity (V R = 5 V, standard light A, T = 2856 K) (typ ) S 9.4 ( 7) na/ix Wavelength of max. sensitivity (typ) λ S max 62 nm Spectral range of sensitivity (typ) λ 1% (typ) 4... 69 Radiant sensitive area (typ) A 7.2 mm 2 Dimensions of radiant sensitive area (typ) L x W 2.65 x 2.65 mm x mm Half angle (typ) ϕ ± 6 Dark current (V R = 5 V) Spectral sensitivity of the chip (λ = 55 nm) Quantum yield of the chip (λ = 55 nm) Short-circuit current (E v = 1 lx, Std. Light A) Rise and fall time (V R = 5 V, R L = 5 Ω, λ = 55 nm) Forward voltage (I F = 1 ma, E = ) Capacitance (V R = V, f = 1 MHz, E = ) Noise equivalent power (V R = 5 V, λ = 55 nm) nm (typ (max)) I R 1 ( 1) na (typ) S λ typ.37 A / W (typ) η.83 Electro ns /Photon (typ) I SC 8.1 µa (typ) t r, t f.9 µs (typ) V F 1 V (typ) C 135 pf (typ) NEP.48 pw / Hz ½ Detection limit (typ) D * 5.5e12 cm x Hz ½ / W 218-2-23 2
Version 1.2 SFH 244 Relative Spectral Sensitivity S rel = f(λ) S rel 1 % 8 7 1) page 11 OHF5712 1) page 11 Photocurrent IP/IP(25 C) = f (TA) Ev = 1 lx, VR = 5 V 11 I % P IP (25 C) 15 OHF5713 6 5 1 4 3 2 95 1 4 Power Consumption P tot = f(t A ) P tot 16 mw 5 6 7 8 9 nm 11 λ OHF5583 Dark Current I R = f(v R ), E = I R 1.6 na 9-4 -2 2 4 6 C 1 1) page 11 T A OHF5714 12 T A T S 1.2 1 8.8 6 4.4 2 T A T S temp. ambient temp. solder point 25 5 75 C 1 2 4 6 8 1 12 V 16 T A V R 218-2-23 3
Version 1.2 SFH 244 1) page 11 Capacitance C = f(v R ), f = 1 MHz, E = 14 C pf 12 1 8 6 4 2 1-3 1-2 1-1 1 1 1 V V R Directional Characteristics S rel = f(ϕ) 1) page 11 4 3 2 1 ϕ 1. OHF142 5.8 6.6 7.4 8.2 9 1 1..8.6.4 2 4 6 8 1 12 218-2-23 4
Version 1.2 SFH 244 Package Outline Dimensions in mm. Package SMT DIL, Epoxy Approximate Weight: 43 mg 218-2-23 5
Version 1.2 SFH 244 Recommended Solder Pad Dimensions in mm. Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-2E 3 C T 25 2 24 C 217 C t P t L T p OHA4525 245 C 15 t S 1 5 25 C 5 1 15 2 25 s 3 t 218-2-23 6
Version 1.2 SFH 244 Profile Feature Profil-Charakteristik Ramp-up rate to preheat* ) 25 C to 15 C Time t S T Smin to T Smax Ramp-up rate to peak* ) T Smax to T P Liquidus temperature Time above liquidus temperature Symbol Symbol t S T L t L Minimum 6 Pb-Free (SnAgCu) Assembly Recommendation 2 3 K/s 1 12 2 3 217 Maximum 8 1 OHA4612 Unit Einheit s K/s C s Peak temperature Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 1 C Time 25 C to T P T P t P 245 26 1 2 3 All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 3 6 48 C s K/s s Taping Dimensions in mm. 218-2-23 7
Version 1.2 SFH 244 Tape and Reel 12 mm tape with 15 pcs. on 18 mm reel W 1 D P P 2 F E W A N 13. ±.25 P 1 Label Direction of unreeling W 2 Direction of unreeling Leader: min. 4 mm * Trailer: min. 16 mm * *) Dimensions acc. to IEC 6286-3; EIA 481-D OHAY324 Tape dimensions [mm] Tape dimensions in mm W P P 1 P 2 D E F 12 +.3 / -.1 4 ±.1 4 ±.1 or 8 ±.1 2 ±.5 1.5 ±.1 1.75 ±.1 5.5 ±.5 Reel dimensions [mm] Reel dimensions in mm A W N min W 1 W 2max 18 12 6 12.4 + 2 18.4 Barcode-Product-Label (BPL) 218-2-23 8
_< C). _< _< C). 11 _< 144 Bin2: Q-1-2 Bin3: ML 2 2a 22 C R WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Version 1.2 SFH 244 Dry Packing Process and Materials OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot 5% 1% 15% If wet, parts still adequately dry. change desiccant If wet, examine units, if necessary bake units If wet, examine units, if necessary bake units 11 (9D) D/C: 144 Bin2: Q-1-2 Bin3: ML Temp ST 2 22 C R 2a CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA539 Note: Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card. Regarding dry pack you will find further information in the internet. Here you will also find the normative references like JEDEC. Transportation Packing and Materials Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS LEVEL If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 4 C and < 9% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 3 C/6% RH. Floor time see below b) Stored at 1% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 1% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-33 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Opto Semiconductors (6P) BATCH NO: 2121998 (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 (9D) D/C: 425 (Q)QTY: 2 LSY T676 Bin1: P-1-2 Multi TOPLED Temp ST 24 C R 3 26 C RT Additional TEXT R77 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Opto Semiconductors (6P) BATCH NO: 2121998 (1T) LOT NO: 123GH1234 Muster (X) PROD NO: 1 425 (Q)QTY: 2 LSY T676 Bin1: P-1-2 Multi TOPLED 24 C R 3 26 C RT Additional TEXT R77 DEMY PACKVAR: R18 (G) GROUP: P-1+Q-1 OSRAM Packing Sealing label OHA244 Dimensions of transportation box in mm Width Length Height 195 ± 5 195 ± 5 3 ± 5 218-2-23 9
Version 1.2 SFH 244 Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. 218-2-23 1
Version 1.2 SFH 244 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 218-2-23 11
Version 1.2 SFH 244 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-9355 Regensburg www.osram-os.com All Rights Reserved. 218-2-23 12