High Power Infrared Emitter (940 nm) Version 1.3 SFH Features: High Power Infrared LED Emission angle ± 11 High radiant intensity
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1 High Power Infrared Emitter (94 nm) Version.3 SFH 434 Features: High Power Infrared LED Emission angle ± High radiant intensity Applications Infrared Illumination for cameras Data transmission Sensor technology Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 682- and IEC Ordering Information ype: Radiant Intensity Ordering Code I e [mw/sr] = 7 ma, t p = 2 ms SFH ( 2) Q6A892 Note: Measured at a solid angle of Ω =. sr
2 Maximum Ratings ( A = 2 C) Parameter Symbol Values Unit Operation and storage temperature range op ; stg C Reverse voltage V R V Forward current 7 ma Surge current (t p 2 µs, D = ) Characteristics ( A = 2 C) SM.7 A Power consumption P tot 4 mw hermal resistance junction - ambient R thja K / W ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS- - HBM) V ESD 2 kv Parameter Symbol Values Unit Peak wavelength ( = 7 ma, t p = 2 ms) Centroid wavelength ( = 7 ma, t p = 2 ms) Spectral bandwidth at % of I max ( = 7 ma, t p = 2 ms) (typ) λ peak 9 nm (typ) λ centroid 94 nm (typ) λ 42 nm Half angle (typ) ϕ ± Dimensions of active chip area (typ) L x W.2 x.2 mm x mm Rise and fall time of I e ( % and 9% of I e max ) ( = 7 ma, R L = Ω) Forward voltage ( = 7 ma, t p = 2 ms) Forward voltage ( = ma, t p = µs) Reverse current (V R = V) otal radiant flux ( =7 ma, t p =2 ms) emperature coefficient of I e or Φ e ( = 7 ma, t p = 2 ms) emperature coefficient of V F ( = 7 ma, t p = 2 ms) emperature coefficient of wavelength ( = 7 ma, t p = 2 ms) (typ) t r, t f 2 ns (typ (max)) V F.6 ( 2) V (typ (max)) V F 2.4 ( 3) V I R not designed for reverse operation µa (typ) Φ e 4 mw (typ) C I -. % / K (typ) C V -.3 mv / K (typ) C λ.3 nm / K
3 Grouping ( A = 2 C) Group Min Radiant Intensity Max Radiant Intensity yp Radiant Intensity = 7 ma, t p = 2 ms = 7 ma, t p = 2 ms = ma, t p = 2 µs I e, min [mw / sr] I e, max [mw / sr] I e, typ [mw / sr] SFH SFH 434 -U SFH 434 -V SFH 434 -AW 2 7 Note: measured at a solid angle of Ω =. sr Relative Spectral Emission I rel = f(λ), A = 2 C I rel % 8 ) page 8 OHF434 ) page 8 Radiant Intensity I e / I e (7 ma) = f( ), single pulse, t p = 2 µs, A = 2 C I e I e (7 ma) OHF nm 2 λ ma
4 Max. Permissible Forward Current = f ( A ), R thja = K/W 8 ma OHF3732 ) page 8 Forward Current = f(v F ), single pulse, t p = µs, A = 2 C A OHF C 2 A V 3 V F Permissible Pulse Handling Capability = f(t p ), A = 2 C, duty cycle D = parameter IF.7 A.6 t P D= t P OHF3733 Permissible Pulse Handling Capability = f (t p ), A = 8 C, duty cycle D = parameter.7 A.6 t D = P t P OHF D= D = s t p t p 2 s
5 Radiation Characteristics I rel = f(ϕ), A = 2 C 4 3 ) page 8 2 OHF443 ϕ Package Outline (.) spacing.6 (.24).4 (.6).7 (.28).4 (.6).8 (.7).2 (.47) Surface not flat.8 (.3).4 (.6) 2.2 (.2) 4. (.77) 4. (.6) 3.9 (.4) Chip position 3.3 (.3) 6.3 (.248).9 (.232) 3. (.22) 2.9 (.4).6 (.24).4 (.6) 4. (.7) 3.6 (.42) GEMY6689 Dimensions in mm (inch)
6 Pinning Pin Description anode 2 cathode Package 3mm Radial ( ), Epoxy Approximate Weight:.2 g Note: Package: 3 mm, /", black package Note Packing information is available on the internet (online product catalog). Recommended Solder Pad Dimensions in mm. Note: pad : cathode
7 W Soldering IEC-676- W 3 C C - 26 C First wave Preheating 3 C 2 C C s max., max. contact time s per wave < K Second wave ypical OHA464 Continuous line: typical process Dotted line: process limits Cooling ca. 3. K/s typical ca. 2 K/s ca. K/s Disclaimer s 24 Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! he information describes the type of component and shall not be considered as assured characteristics. erms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. t
8 Glossary ) ypical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. hese do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice
9 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93 Regensburg All Rights Reserved
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