PACKAGE SCHEMATIC ANODE 6 N/C 6 6 CATHODE 2 5 COLLECTOR N/C 3 4 EMITTER 6 DESCRIPTION The MOC8X series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. The base of the transistor is not bonded to an external pin for improved noise immunity FEATURES High isolation voltage 5300 VAC RMS minute High BV CEO minimum 70 Volts Current transfer ratio in selected groups: MOC8: 20% min. MOC82: 50% min. MOC83: 00% min. Maximum switching time in saturation specified Underwriters Laboratory (UL) recognized (File #E90700) VDE recognized (File #94766) APPLICATIONS Power Supply Regulators Digital Logic Inputs Microprocessor Inputs Appliance Sensor Systems Industrial Controls Page of 0
ABSOLUTE MAXIMUM RATINGS (T A =25 C Unless otherwise specified) Parameter Symbol Value Unit INPUT LED Forward Current Continuous I F 90 ma Forward Current Peak (PW = µs, 300pps) I F (pk) 3 A Reverse Voltage V R 6 Volts LED Power Dissipation @ T A = 25 C 35 mw P D Derate above 25 C.8 mw/ C OUTPUT TRANSISTOR Detector Power Dissipation @ T A = 25 C 200 mw P D Derate above 25 C 2.67 mw/ C TOTAL DEVICE Total Device Power Dissipation @ T A = 25 C 260 mw P D Derate above 25 C 3.5 mw/ C Ambient Operating Temperature Range T OPR -55 to +00 C Storage Temperature Range T STG -55 to +50 C Lead Soldering Temperature (/6 from case, 0 sec. duration) T SOL 260 C Page 2 of 0
ELECTRICAL CHARACTERISTICS (T A = 25 C Unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Device Min Typ Max Unit EMITTER I F = 60 ma.35.65 Input Forward Voltage V F All V I F = 0 ma.5.50 Reverse Voltage I R = 0 µa V R All 6.0 5 V V F = 0 V, f =.0 MHz 50 Capacitance C J All pf V F = V, f =.0 MHz 65 Reverse Leakage Current V R = 3.0 V I R All.35 0 µa DETECTOR Breakdow Voltage Collector to Emitter Breakdow Voltage Emitter to Collector Leakage Current Collector to Emitter Capacitance Collector to Emitter I C =.0 ma, I F = 0 BV CEO All 70 V I E = 00 µa, I F = 0 BV ECO All 7 V V CE = 0 V, I F = 0 I CEO All 5 50 V V CE = 0 V, f = MHz C CE All 8 pf ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ Max Units Input-Output Isolation Voltage f = 60 Hz, t = min. V ISO 5300 V RMS Isolation Resistance V I-O = 500 VDC R ISO 0 Ω Isolation Capacitance V I-O = 0, f = MHz C ISO 0.5 pf Page 3 of 0
TRANSFER CHARACTERISTICS (T A = 25 C Unless otherwise specified) DC CHARACTERISTICS Test Conditions Symbol Device Min Typ Max Units Output/Input Current Transfer Ratio Collector-Emitter Saturation Voltage I F = 0 ma, V CE = 5V CTR MOC8 20 MOC82 50 MOC83 00 I F = 0 ma, I C = 2.5 ma V CE(SAT) All 0.27 0.4 V AC CHARACTERISTICSØ Test Conditions Symbol Device Min Typ Max Units Non-Saturated Switching Times Turn-On Time R L = 00 Ω, I C = 2 ma, t on All 6.0 0 µs Turn-Off Time V CC = 0 V See Figure 7 t off All 5.5 0 µs Saturated Switching Times Turn-On Time Rise-Time Turn-Off Time Fall-Time I F = 20 ma, V CE = 0.4 V MOC8 3.0 5.5 t on I F = 0 ma, V CE = 0.4 V MOC82, MOC83 4.2 8.0 I F = 20 ma, V CE = 0.4 V MOC8 2.0 4.0 t r I F = 0 ma, V CE = 0.4 V MOC82, MOC83 3.0 6.0 I F = 20 ma, V CE = 0.4 V MOC8 8 34 t off I F = 0 ma, V CE = 0.4 V MOC82, MOC83 23 39 I F = 20 ma, V CE = 0.4 V MOC8 20 t f I F = 0 ma, V CE = 0.4 V MOC82, MOC83 4 24 % µs µs µs µs Page 4 of 0
NORMALIZED CTR NORMALIZED CTR 6-PIN DIP OPTOCOUPLERS FOR TYPICAL PERFORMANCE CURVES Fig. LED Forward Voltage vs. Forward Current Fig. 2 Normalized CTR vs. Forward Current.8.7.4.2 T A = 25 C V CE = 5.0 V Normalized to I F = 0 ma VF - FORWARD VOLTAGE (V).6.5.4.3.2 T A = -55 C T A = 25 C.0 0.8 0.6 0.4. 0.2 T A = 00 C.0 0 00 I F - LED FORWARD CURRENT (ma) 0.0 0 5 0 5 20 I F - FORWARD CURRENT (ma).6.4.2.0 0.8 0.6 Fig. 3 Normalized CTR vs. Ambient Temperature Normalized to I F = 0 ma T A = 25 C I F = 0 ma I F = 20 ma I F = 5 ma 0.4-75 -50-25 0 25 50 75 00 25 T A - AMBIENT TEMPERATURE ( C) VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) 00 0 0. Fig. 4 Collector Emitter Saturation Voltage vs Collector Current I F = 2.5 ma 0.0 I F = 20 ma I F = 5 ma I F = 0 ma T A = 25 C 0.00 0.0 0. 0 I C - COLLECTOR CURRENT (ma) Page 5 of 0
SWITCHING SPEED - (µs) 6-PIN DIP OPTOCOUPLERS FOR TYPICAL PERFORMANCE CURVES (continued) Fig. 5 Switching Speed vs. Load Resistor Fig. 6 Dark current vs. Ambient Temperature. 000 e+ 00 0 I F = 0 ma V CC = 0 V T A = 25 C T off T on Tr T f ICEO - COLLECTOR-EMITTER DARK CURRENT (µa) e+0 e- e-2 e-3 e-4 e-5 V CE = 0V 0. 0. 0 00 R-LOAD RESISTOR (kω) e-6 0 25 50 75 00 25 T A - AMBIENT TEMPERATURE ( C) Page 6 of 0
Package Dimensions (Through Hole) Package Dimensions (Surface Mount) PIN ID. 0.350 (8.89) 0.330 (8.38) 0.270 (6.86) 0.240 (6.0) 3 2 PIN ID. 0.270 (6.86) 0.240 (6.0) SEATING PLANE 0.070 (.78) 0.045 (.4) 0.350 (8.89) 0.330 (8.38) 4 5 6 0.070 (.78) 0.045 (.4) 0.300 (7.62) TYP 0.200 (5.08) 0.35 (3.43) 0.200 (5.08) 0.65 (4.8) 0.06 (0.4) 0.008 (0.20) 0.54 (3.90) 0.00 (2.54) 0.022 (0.56) 0.06 (0.4) 0.00 (2.54) TYP 0.020 (0.5) MIN 0.06 (0.40) 0.008 (0.20) 0 to 5 0.300 (7.62) TYP 0.022 (0.56) 0.06 (0.4) 0.020 (0.5) MIN 0.00 (2.54) TYP Lead Coplanarity : 0.004 (0.0) MAX 0.06 (0.40) MIN 0.35 (8.00) MIN 0.405 (0.30) MAX Package Dimensions (0.4 Lead Spacing) Recommended Pad Layout for Surface Mount Leadform 0.270 (6.86) 0.240 (6.0) 0.070 (.78) 0.060 (.52) 0.350 (8.89) 0.330 (8.38) SEATING PLANE 0.200 (5.08) 0.35 (3.43) 0.070 (.78) 0.045 (.4) 0.45 (0.54) 0.295 (7.49) 0.00 (2.54) 0.030 (0.76) 0.54 (3.90) 0.00 (2.54) 0.004 (0.0) MIN 0.06 (0.40) 0.008 (0.20) 0.022 (0.56) 0.06 (0.4) 0.00 (2.54) TYP 0.400 (0.6) TYP 0 to 5 NOTE All dimensions are in inches (millimeters) Page 7 of 0
ORDERING INFORMATION Option Example Part Number Description No Suffix MOC8 Through Hole S MOC8S Surface Mount Lead Bend SD MOC8SD Surface Mount; Tape and Reel W MOC8W 0.4" Lead Spacing 300 MOC8300 VDE 0884 300W MOC8300W VDE 0884, 0.4" Lead Spacing 3S MOC83S VDE 0884, Surface Mount 3SD MOC83SD VDE 0884, Surface Mount, Tape and Reel MARKING INFORMATION MOC8 V XX YY K 2 6 3 4 5 Definitions Fairchild logo 2 Device number VDE mark (Note: Only appears on parts ordered with VDE 3 option See order entry table) 4 Two digit year code, e.g., 03 5 Two digit work week ranging from 0 to 53 6 Assembly package code Page 8 of 0
Carrier Tape Specifications 4.85 ± 0.20 2.0 ± 0. 4.0 ± 0. Ø.55 ± 0.05 0.30 ± 0.05 4.0 ± 0..75 ± 0.0 7.5 ± 0. 3.2 ± 0.2 9.55 ± 0.20 6.0 ± 0.3 0. MAX 0.30 ± 0.20 Ø.6 ± 0. User Direction of Feed NOTE All dimensions are in inches (millimeters) Reflow Profile (Black Package, No Suffix) Temperature ( C) 300 250 200 50 00 50 25 C, 0 30 s 225 C peak Time above 83 C, 60 50 sec Ramp up = 3C/sec Peak reflow temperature: 225 C (package surface temperature) Time of temperature higher than 83 C for 60 50 seconds One time soldering reflow is recommended 0 0 0.5.5 2 2.5 3 3.5 4 4.5 Time (Minute) Page 9 of 0
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 0 of 0