EUV lithography and Source Technology

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EUV lithography and Source Technology History and Present Akira Endo Hilase Project 22. September 2017 EXTATIC, Prague

Optical wavelength and EUV (Extreme Ultraviolet) VIS 13.5nm 92eV Characteristics of EUV light From Prof. Atwood wavelength a few nm - a few 10 nm propagation only in vacuum reflective optics only

Nature Photonics, January 2010

Lithography wavelength evolution K1 λ NA

Configuration of EUV source CO2 laser >20kw 100kHz Sn droplet EUV power at plasma > kw EUV C1 mirror lifetime : > 12months (800Bpls) (R10%loss=Sn deposition <thickness 1nm ) EUV power at IF > 250W 13.5nm 2%BW (fwhm:0.27nm)

Optimization of pre-plasma conditioning pre-pulse expansion CO 2 laser irradiation Full ionization Small droplet (d=10μm) D ~100μm Magnetic ion guide Optimize density, temperature and spatial distribution for main pulse heating to achieve high EUV conversion efficiency and full exhaust of Sn atoms 10

Laser-produced plasma X-Rays ionization of target material heating by inverse Bremsstrahlung hot, dense plasma (T e > 50eV;10 20 < n e < 10 24 e/cm 3 ) emission of Bremsstrahlung and charact. x-rays Scalable! Brilliance s mm 2 N mrad Photonen 2 0,1% BW 12

Electron density CO 2 laser is efficient, clean driver for Sn EUV plasma n c Hot dense plasma X-ray emission Laser EUV radiation is emitted from hot dense plasma near the electron critical density nc. n c 2 0m 2 e Laser plasma interaction region n c 1.11 10 2 21 (cm 3 ) : wavelength in mm 0 Distance Cut off density :Nc 1 1/100 Generated EUV is reabsorbed by plasma. CO 2 laser produced plasma reduces EUV propagation loss. CO 2 Yag ω CO 2 laser light is absorbed by low density plasma. Thermal boiling of liquid Sn is avoided. 13

intensity [a.u.] C E [%] Sn plasma generated by Nd:YAG and CO 2 laser Conversion efficiency dependence on the laser intensity 6 5 Target material : Sn plate C O 2 15ns C O 2 100ns Nd:YAG 10.6um 1.064um 4 CE: 2.5% - 4.5% with CO2 laser Laser intensity: 3x10 10 W/cm 2 *energy:30mj *Pulse width:11ns *Spot size: d=100um 40000 35000 30000 25000 20000 15000 10000 5000 0 Target material : Sn wire 10 11 12 13 14 15 16 17 18 19 20 wavelength [nm] CO2 3 2 1 Nd:YAG 0 1.0E+09 1.0E+10 1.0E+11 1.0E+12 Laser intensity [W /cm 2] EUV spectra from Sn plasma Narrow in-band spectrum with CO2 laser

Selection of Reflective optics

LPP source and mirror damage:ets with Xe spray jet 150M shot :2 nd EUV Symposium, October 1. 2003, Condenser Erosion Observations in the ETS Lennie Klebanoff, SNL

Analysis of ion exposed samples Reflectivity (%) Xe atomic (%) AFM 0.2 0.18 0.16 0.14 0.12 Reflectivity measurement Reference 2keV, 3.7E16/cm2 3keV, 3.7E16/cm2 5keV, 2.8E16/cm2 reference fitting 2kV fitting 3kV fitting 5kV fitting 0.1 TEM Rms: 0.20 nm Rms: 0.41 nm 0.08 0.06 0.04 0.02 Mixing 0 Implanted 5 10 Xe in 15 Mo/Si 20multilayer 25 30 Incidence angle (deg) 0.8 0.6 XPS Absorption by implanted Xe is negligible 0.4 0.2 Reference (10 Mo/Si bilayer) Ion energy 5 kev Ion dose 2.8 X 10 16 atoms/cm 2 0 0 5 10 15 Depth (nm)

Plasma in magnetic mirrors g: unstable B radial x g: stable axial z y Curvature drift 2 mvii R v 2 2 qb R B

Silver line in tin vapor

x (meter) Simulation results of particle positions ( zx-plane) 50ns 100ns 150ns z (meter) 200ns 250ns 300ns

x (meter) Simulation results of particle positions ( yx-plane) B y (meter)

Z-axis Sn vapor measurement by laser induced fluorescence (LIF) Band-pass filter Neutral characteristics ICCD Camera Focusing lens Nd:YAG laser Heater Target tin sphere YAG laser Dye laser Microdispenser 20 mm LIF image of tin vapor (10 9 W/cm 2, after 3ms) 22

Laser induced fluorescence (LIF) imaging for tin atom Principle of LIF Neutral characteristics 5p6s 3 P 0 1 absorption 286.3 nm fluorescence 317.5 nm 5p 2 3 P 1 5p 2 3 P 0 Grotrian diagram for tin atom 0 cm -1 Advantages Spectrally selective pumping and observation High sensitivity Cross sectional imaging with a sheet laser beam 23

Definition of Source Power 13.5nm, 2% band width, 2ϖ Sr Power is described at plasma, and IF (Intermediate focus) Average power, burst avrage power

Intemediate Summary EUV source effort started in 1997 in US for the next generation optical lithograpy. Commercial prototypes in 2003 were not matured for factory use. New architecture established based on Tin droplet and CO2 laser with magnetic plasma guide. Laser produced plasma (LPP) selected, >10 years engineering study to fulfill the requirements on average power and C1 mirror life time.

Historical interests

Prototype machine: Engineering Test Stand (ETS) by EUV LLC From Semiconductor International, June 2001 LPP(Lasre produced plasma) EUV source; 1.6kW, 2kHz, CE 0.13% Target: Xe gas jet Laser: Nd.YAG 280mJ x 3, 2kHz, 1.1 x DL

LPP ( laser produced Xenon plasma) EUV System Nozzle System Spectrograph Chamber TMP Flying CircusⅡ Laser LPP

Xenon Jet experimental test-stand Nozzle System Testing Chamber 50 mm Xe Jet Xenon Liquefaction System Liquid Xenon Jet System Xe Temperature: Xe Pressure: 160K - 190K <5MPa

Nd:YAG driver laser based on LD pumped rod module AMP module -Average Power: 500 Watt -Rep. Rate: 10 khz -Pulse duration: 30 ns Main-AMP1 Main-AMP2 Main-AMP3 Main-AMP4 Pre-AMP4 Pre-AMP3 Pre-AMP2 Pre AMP1 Master Oscillator Isolator

Driver Laser System - Beam Profile - Before Main Amplifier 60W After 3-Main Amplifier 350W -We achieved 500 Watt @ 10kHz. -Further driver laser system improvements: Deformable mirror (beam quality) Shorter pulse duration oscillator (several ns) LPP