Features. RoHS & Halogen Free (HF) compliant. EIA size: 00, 00, 00, 080. Highly reliable structure. Operating temperature range: -0 ~+. Wide resistance range. Cost effective. Agency recognition: UL / cul / TUV/ CQC Recommended Applications. Battery pack. Motherboard, notebook and personal computer device. Liquid crystal display. Cellular phone. Bluetooth headset. Wi-Fi module Part Number Code 8 9 0 TSM Product Type NTC Thermistor TSM Series Size (EIA) A 00 0 00 00 080 Definition of B Value A B /8 B B /0 Zero Power Resistance at (R ) 0 0x0 Ω= KΩ 0 0x0 Ω=0 KΩ x0 Ω= KΩ of R F ±% G ±% H ±% J ±% K ±0% B Value 8 80 D 9 90 9H 9 0 00 of B Value ±% ±% ±% Packaging R B Optional Suffix Z Reel Bulk RoHS & HF Compliant Structure and Dimensions (Unit: mm) Part No. Size (EIA) L W H max. L & L TSMA 00 0.0±0.0 0.0±0.0 0. 0.±0.0 TSM0 00.00±0. 0.0±0.0 0.0 0.0±0.0 TSM 00.0±0. 0.80±0. 0.9 0.0±0. TSM 080.00±0.0.±0.0.00 0.0±0.0 Tel: +9 (0) 0 / 88-0 Fax: -0 - -
Electrical Characteristics Part No. Size (EIA) Zero Power Resistance at C of R B Value of B value Max. Power Dissipation at Dissipation Factor Thermal Time Constant Operating Temperature Range R (KΩ) ( ±%) (K) (±%) P max(mw) δ(mw/ C) τ(sec.) T L~T U( C) UL cul Safety Approvals TUV CQC TSMAB0 8* 0 80,,, Approx. Approx. TSMAB8 * 00 8 /0 0,, 0-0 ~ +, 0.. TSMAB0 * 00 0 TSM0A0 D* 0 TSM0A0 9* 0 90 TSM0A 9* 90 TSM0A 0* /8 00 TSM0A8 0* 8 00 TSM0A0 0* 00 00,,, TSM0A0 * 00 0,, 0 Approx. Approx. 00, 0-0 ~ + TSM0B0 8* 0 80..0 TSM0B 0* 00 TSM0B0 * 00 0 TSM0B0 * 00 /0 0 TSM0B0 80* 00 800 TSM0B 0* 0 00 TSM0B 0* 0, 0 00 00 TSMA0 0* 00 TSMA0 0* 00 TSMA D*. TSMA 0*. 00 TSMA0 D*,,,, 0 TSMA0 8*,, 0 80 TSMA8 D*.8 TSMA8 9*.8 90 TSMA0 D* 0 TSMA0 9H* 0 9 /8 TSMA0 0* 0, 0 00 00 TSMA 9* 90 TSMA 9* 90 TSMA 9H* 9 TSMA8 9H* 8 9 Approx. Approx. 00,, -0~+ TSMA0 0* 00 00,, 0..,, 0 TSMA0 * 00 0 TSMA 0* 0 00 TSMA0 0* 00 00 TSMA * 0 0 TSMB 0* 0. 00 TSMB 9*., 0 90 00 TSMB *. 0 TSMB *. 0 TSMB0 8* 0 80 /0 TSMB0 0* 0 00,,, TSMB * 0,, 0, 0 TSMB0 * 00 0 TSMB0 * 00 0 TSMB 0* 0 00 Note : = of R * = of B value Note : UL&cUL File No. E88 / TUV File No. R 0 / CQC File No.000809 Note : Special specifications are available upon request Tel: +9 (0) 0 / 88-0 Fax: -0 - -
Part No. TSMA0 D* Size (EIA) Zero Power Resistance at C of R B Value of B value Max. Power Dissipation at Dissipation Factor Thermal Time Constant Operating Temperature Range R (KΩ) ( ±%) (K) (±%) P max(mw) δ(mw/ C) τ(sec.) T L~T U( C),,,, 0,, 0 UL cul Safety Approvals TUV CQC TSMA 98*.,0 980 00 TSMA 0 D* TSMA8 D*.8 TSMA0 D* 0 TSMA0 * 0 /8 0,,, TSMA0 9* Approx. Approx. 080 0 90,, 0, 0-0~+.. TSMA 9* 90 TSMA 9H* 9 TSMA0 0* 00 00 TSMA0 * 00 0 TSMA8 0* 80, 0 00 00 TSMB 9*,,, 90 /0,, 0 TSMB0 * 00, 0 0 Note : = of R * = of B value Note : UL&cUL File No. E88 / TUV File No. R 0 / CQC File No.000809 Note : Special specifications are available upon request Max. Power Dissipation Derating Curve 00% T U : Maximum operating temperature ( ) T L : Minimum operating temperature ( ) 0 For example: Ambient temperature (Ta) = Maximum operating temperature (T U ) = P Ta =(T U -Ta)/(T U -) Pmax = 0% Pmax T L 0 T U Ambient temperature ( ) 0 Tel: +9 (0) 0 / 88-0 Fax: -0 - -
R-T Characteristic Curves 0000 TSMAB0 8* ~ TSMAB0 * 00000 TSM0A0 D* ~ TSM0B 0* 0000 000 00 0 000 00 0 :TSMAB0 * :TSMAB8 * :TSMAB0 8* :TSM0B 0* :TSM0B0 80* :TSM0A0 0* :TSM0A8 0* :TSM0B 0* :TSM0A 9* :TSM0A0 D* 0. -0-0 -0-0 0 0 0 0 0 0 0 0 80 90 00 0 0 0 0. -0-0 -0-0 0 0 0 0 0 0 0 0 80 90 00 0 0 0 Temperature ( ) Temperature ( ) 00000 TSM0B0 D* ~ TSM0B 0* 0000 TSMA0 0* ~ TSMA0 0* 0000 000 000 00 0 :TSM0B 0* :TSM0A0 * :TSM0B0 * :TSM0B0 * :TSM0A 0* :TSM0A0 9* :TSM0B0 D* 00 0 0. 8 9 0 :TSMA0 0* :TSMA0 * :TSMA8 9H* :TSMB * :TSMA 9* :TSMA0 9H* :TSMA8 9* 8:TSMA0 8* 9:TSMA 0* 0:TSMB * :TSMA0 0* :TSMA0 0* ` 0. 0.0-0 -0-0 -0 0 0 0 0 0 0 0 0 80 90 00 0 0 0-0 -0-0 -0 0 0 0 0 0 0 0 0 80 90 00 0 0 0 Temperature ( ) Temperature ( ) Tel: +9 (0) 0 / 88-0 Fax: -0 - -
00000 TSMA D* ~ TSMA * 00000 TSMB 0* ~ TSMB 0* 0000 0000 000 00 0 0. 00000 0000 000 00 0 0. 8 9-0 -0-0 -0 0 0 0 0 0 0 0 0 80 90 00 0 0 0 8 Temperature ( ) Temperature ( ) TSMA0 0* ~ TSMA8 0* :TSMA * :TSMA 0* :TSMA0 0* :TSMA 9H* :TSMA0 0* :TSMA0 D* :TSMA8 D* 8:TSMA0 D* 9:TSMA D* :TSMA8 0* :TSMA0 0* :TSMA 9H* :TSMA 9* :TSMA0 9* :TSMA0 D* :TSMA0 D* 8:TSMA0 0* 000 00 0 0. 0.0 0000 000 00 0 0. 8 9 :TSMB 0* :TSMB0 * :TSMB0 * :TSMA 9* :TSMB0 0* :TSMB0 8* :TSMB * 8:TSMB 9* 9:TSMB 0* -0-0 -0-0 0 0 0 0 0 0 0 0 80 90 00 0 0 0 TSMA 98* ~ TSMA0 * :TSMA0 * :TSMB0 * :TSMA 9* :TSMA0 * :TSMA8 D* :TSMA 98* 0.0-0 -0-0 -0 0 0 0 0 0 0 0 0 80 90 00 0 0 0 0.0-0 -0-0 -0 0 0 0 0 0 0 0 0 80 90 00 0 0 0 Temperature ( ) Temperature ( ) Tel: +9 (0) 0 / 88-0 Fax: -0 - -
Soldering Recommendation IR-Reflow Soldering Profile Preheating Peak temp Cooling ~0 Temperature 0±0 0~00 0~0 sec Tamb /sec (max.) 0~80 sec /sec (max.) 0~0 sec /sec (max.) t 8 minutes max. Time Recommended Reworking Conditions with Soldering Iron Item Temperature of Soldering Iron-tip Soldering Time Diameter of Soldering Iron-tip Conditions 0 (max.) sec. (max.) Φmm (max.) Caution: Please do not touch the component surface with soldering iron directly to avoid its damage. Tel: +9 (0) 0 / 88-0 Fax: -0 - -
Recommended Soldering Pad Dimensions Y X G Z Size (EIA) Z (mm) G (mm) X (mm) Y (mm) 00 0.8 0. 0. 0. 00. 0. 0. 0. 00.0.0.0.0 080..0.. Tel: +9 (0) 0 / 88-0 Fax: -0 - -
Notice of Soldering and Mounting on PC Board (a) Incorrect Nozzle for Chip Mounting (b) Correct Nozzle for Chip Mounting Board Guide PC Board Supporting Pins For mounting SMDs on a PC board, supporting pin is suggested for use (refer to figure b) to avoid cracks caused by external stress (refer to figure a). (c)cracks SMDs are located near an easily warped area Stress at the separate line is possible to damage SMDs. If circuit bending is needed for PC board design, please refer to figure (c) for mounting positions to avoid cracks caused by stress imposed on the product. O means better, is acceptable, and X is worst. (d) Component Orientation Incorrect Orientation Correct Orientation Locate SMDs horizontally to the direction that stress acts During circuit bending, please locate SMDs horizontally to the direction in which stress act to avoid its cracks (refer to figure d). Tel: +9 (0) 0 / 88-0 Fax: -0-8 -
Reliability Item Standard Test conditions / Methods Specifications Bending Strength IEC 008-- Warp : mm for 00,00 and 080 mm for 00 Speed < 0.mm/sec. Duration: 0 sec. on PCB Solderability IEC 008--8 ±, ± 0. sec. Resistance to Soldering Heat High Temperature Storage Damp Heat, Steady State IEC 008--8 IEC 008-- IEC 008--8 0 ±, 0 ± sec. ±, 000 ± hrs 0 ±, 90~9% RH, 000 ± hrs The conditions shown below shall be repeated cycles on PCB. R /R % At least 9% of terminal electrode is covered by new solder R /R % R /R % R /R % Step Temperature ( ) Period (minutes) Rapid Change of Temperature IEC 008-- -0 ± 0 ± Room temperature ± R /R % ± 0 ± Room temperature ± Max. Power Dissipation IEC 09-.. ±, Pmax., 000 ± hrs R /R % Tel: +9 (0) 0 / 88-0 Fax: -0-9 -
Packaging Taping Specification Index A 0 B 0 W E F (Unit: mm) P P P 0 D 0 K 0 Size ±0.0 ±0. ±0. ±0. ±0.0 ±0. ±0.0 ±0. ±0. ±0. 00 0.8 0.8 8... 0.8 00 0.. 8... 0.0 Index A 0 B 0 W E F (Unit: mm) P P P 0 D 0 K 0 Size ±0. ±0. ±0. ±0. ±0.0 ±0. ±0.0 ±0. ±0. ±0. 00..9 8... 0.9 080.. 8....0 Tel: +9 (0) 0 / 88-0 Fax: -0-0 -
Quantity Size (EIA) Quantity (pcs/reel) 00,000 00 0,000 00,000 080,00 Warehouse Storage Conditions of Products Storage Conditions :. Storage Temperature: -0 ~+0. Relative Humidity: %RH. Keep away from corrosive atmosphere and sunlight. Period of Storage : year Tel: +9 (0) 0 / 88-0 Fax: -0 - -