Aluminum Electrolytic Capacitors SMD (Chip), High Temperature, Low Impedance High Vibration Capability

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Aluminum Electrolytic Capacitors SMD (Chip), High Temperature, Low Impedance High Vibration Capability FEATURES Useful life: up to 2000 h at 50 C High reliability Low ESR Polarized aluminum electrolytic capacitors, non-solid electrolyte, self healing 60 CLA 50 C higher temperature high vibration SMD-version with base plate, lead (Pb)-free reflow solderable Charge and discharge proof, no peak current limitation High temperature reflow soldering according to JEDEC J-STD-020 40 CRH 25 C lower Z higher I R 46 CTI 25 C High temperature proof Vibration proof, 6-pin version up to 30 g lower Z AEC-Q200 qualified 50 CRZ 05 C Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 Fig. QUICK REFERENCE DATA DESCRIPTION VALUE Nominal case sizes (L x W x H in mm) 6 x 6 x 6 to 8 x 8 x 2 Rated capacitance range, C R 50 μf to 3300 μf Tolerance on C R ± 20 % Rated voltage range, U R 6 V to 80 V Category temperature range -55 C to +50 C Endurance test at 50 C 000 h to 500 h Useful life at 50 C 500 h to 2000 h Useful life at 40 C.8 x l R applied 300 000 h to 400 000 h Shelf life at 0 V, 50 C 000 h Based on sectional specification IEC 60384-8 / CECC 32300 Climatic category IEC 60068 55 / 50 / 56 APPLICATIONS SMD technology, for high temperature reflow soldering High temperature environment, high peak load Automotive, industrial Smoothing, filtering, buffering MARKING Rated capacitance (in μf) Rated voltage (in V) Date code, in accordance with IEC 60062 Black mark or - sign indicating the cathode (the anode is identified by beveled edges) Code indicating group number (A) PACKAGING Supplied in blister tape on reel Revision: 2-Apr-7 Document Number: 28426

SELECTION CHART FOR C R, U R, AND RELEVANT NOMINAL CASE SIZES (L x W x H in mm) C R (μf) U R (V) 6 25 35 50 63 80 50 6 x 6 x 6 220 6 x 6 x 6 8 x 8 x 6 330 6 x 6 x 6 8 x 8 x 6 8 x 8 x 2 470 6 x 6 x 6 8 x 8 x 6 6 x 6 x 2-680 6 x 6 x 6 8 x 8 x 6 6 x 6 x 2 8 x 8 x 2-000 6 x 6 x 6 8 x 8 x 6 6 x 6 x 2 8 x 8 x 2 - - 500 8 x 8 x 6 6 x 6 x 2 8 x 8 x 2 - - - 2200 6 x 6 x 2 8 x 8 x 2 - - - - 2700 8 x 8 x 2 - - - - - 3300 8 x 8 x 2 - - - - - 6-pin: Ø 6 mm 35V 000u H4E A min. 0.4 / max..0 (2 x) H MAX. max. 0.3 D W MAX. B L MAX. S L MAX. Fig. - Dimensional outline Table DIMENSIONS in millimeters AND MASS NOMINAL CASE SIZE L x W x H CASE CODE L MAX. W MAX. H MAX. Ø D B MAX. S L MAX. MASS (g) 6 x 6 x 6 66 6.6 6.6 7.5 6.0.3 6.5 8.6 5.8 6 x 6 x 2 62 6.6 6.6 22.0 6.0.3 6.5 8.6 7. 8 x 8 x 6 86 9.0 9.0 7.5 8.0.3 6.5 2.0 8.0 8 x 8 x 2 82 9.0 9.0 22.0 8.0.3 6.5 2.0 9.3 Revision: 2-Apr-7 2 Document Number: 28426

Table 2 TAPE AND REEL DIMENSIONS in millimeters, PACKAGING QUANTITIES NOMINAL CASE SIZE L x W x H CASE CODE PITCH P TAPE WIDTH W TAPE THICKNESS T 2 REEL DIAMETER PACKAGING QUANTITY PER REEL 6 x 6 x 6 66 28 44 8.9 380 50 6 x 6 x 2 62 28 44 23.4 380 00 8 x 8 x 6 86 32 44 8.9 380 25 8 x 8 x 2 82 32 44 23.4 380 00 Note Detailed tape dimensions see section PACKAGING MOUNTING The capacitors are designed for automatic placement on to printed-circuit boards. Optimum dimensions of soldering pads depend amongst others on soldering method, mounting accuracy, print layout and / or adjacent components. For recommended soldering pad dimensions, refer to Fig. 3 and Table 3. SOLDERING Soldering conditions are defined by the curve, temperature versus time, where the temperature is that measured on the component during processing. For maximum conditions refer to Fig. 4. Any temperature versus time curve which does not exceed the specified maximum curves may be applied. As a general principle, temperature and duration shall be the minimum necessary required to ensure good soldering connections. However, the specified maximum curves should never be exceeded. a c a b Case size Ø D 6 mm Fig. 2 - Recommended soldering pad dimensions Table 3 RECOMMENDED SOLDERING PAD DIMENSIONS in millimeters CASE CODE a b c 66 7.8 9.6 4.7 62 7.8 9.6 4.7 86 8.8 9.6 4.7 82 8.8 9.6 4.7 Revision: 2-Apr-7 3 Document Number: 28426

ADVANCED SOLDERING PROFILE FOR LEAD (Pb)-FREE REFLOW PROCESS ACCORDING TO JEDEC J-STD-020 T ( C) T Peak 230 27 200 90 t 4 t 3 50 t 2 t 25 time (s) Fig. 3 - Maximum temperature load during reflow soldering Table 4 REFLOW SOLDERING CONDITIONS for MAL226099xxxE3 PROFILE FEATURES Maximum time from 25 C to T Peak Maximum ramp-up rate to 50 C Maximum time from 50 C to 200 C (t ) Maximum time from 90 C to 200 C (t 2 ) Ramp up rate from 200 C to T Peak Maximum time above T Liquidus (27 C) (t 3 ) Maximum time above 230 C (t 4 ) CASE CODE 66 TO 82 300 s 3 K/s 50 s 0 s 0.5 K/s to 3 K/s 90 s 60 s Peak temperature T Peak 245 C Maximum time above T Peak minus 5 C Ramp-down rate from T Liquidus 30 s 3 K/s to 6 K/s Notes Temperature measuring point on top of the case and on terminals. Maximum 2 runs with pause of minimum 30 min in between. Revision: 2-Apr-7 4 Document Number: 28426

ELECTRICAL DATA SYMBOL DESCRIPTION C R Rated capacitance at 00 Hz, tolerance ± 20 % I R Rated RMS ripple current at 00 khz, 50 C I L2 Maximum leakage current after 2 min at U R tan δ Maximum dissipation factor at 00 Hz Z Maximum impedance at 00 khz Note Unless otherwise specified, all electrical values in Table 5 apply at T amb = 20 C, P = 86 kpa to 06 kpa, RH = 45 % to 75 % ORDERING EXAMPLE Electrolytic capacitor series 330 μf / 50 V; ± 20 % Nominal case size: 6 mm x 6 mm x 6 mm; taped on reel Ordering code: MAL22609904E3 Table 5 ELECTRICAL DATA AND ORDERING INFORMATION U R (V) 6 25 35 50 63 80 C R (μf) NOMINAL CASE SIZE L x W x H (mm) I R 50 C 00 khz (ma) I L2 2 min (μa) tan δ 00 Hz Z 00 khz 20 C (Ω) Note () Determines the applicable row in the table Endurance Test Duration and Useful Life Z 00 khz -40 C (Ω) LIFE CODE () ORDERING CODE MAL2260... 000 6 x 6 x 6 850 60 0.6 0.050 0.45 L 99503E3 500 8 x 8 x 6 900 240 0.6 0.050 0.45 L 99504E3 2200 6 x 6 x 2 00 352 0.8 0.035 0.32 L3 99505E3 2700 8 x 8 x 2 350 432 0.8 0.035 0.32 L3 99506E3 3300 8 x 8 x 2 400 528 0.20 0.035 0.32 L3 99507E3 680 6 x 6 x 6 800 70 0.4 0.050 0.45 L 99603E3 000 8 x 8 x 6 830 250 0.4 0.050 0.45 L 99604E3 500 6 x 6 x 2 050 375 0.4 0.035 0.32 L3 99605E3 2200 8 x 8 x 2 350 550 0.6 0.035 0.32 L3 99606E3 470 6 x 6 x 6 800 65 0.2 0.050 0.45 L 99003E3 680 8 x 8 x 6 830 238 0.2 0.050 0.45 L 99004E3 000 6 x 6 x 2 000 350 0.2 0.035 0.32 L3 99005E3 500 8 x 8 x 2 350 525 0.2 0.035 0.32 L3 99006E3 330 6 x 6 x 6 700 65 0.0 0.072 0.65 L 9904E3 470 8 x 8 x 6 720 235 0.0 0.070 0.63 L 9905E3 680 6 x 6 x 2 800 340 0.0 0.052 0.47 L3 9906E3 000 8 x 8 x 2 00 500 0.0 0.049 0.44 L3 9907E3 220 6 x 6 x 6 500 39 0.0 0.00 0.90 L 99805E3 330 8 x 8 x 6 520 208 0.0 0.095 0.86 L 99806E3 470 6 x 6 x 2 600 296 0.0 0.075 0.68 L3 99807E3 680 8 x 8 x 2 700 428 0.0 0.072 0.65 L3 99808E3 50 6 x 6 x 6 430 20 0.2 0.390 3.2 L 99703E3 220 8 x 8 x 6 430 76 0.2 0.390 3.2 L 99704E3 330 8 x 8 x 2 520 264 0.2 0.300 2.40 L2 99705E3 Revision: 2-Apr-7 5 Document Number: 28426

Table 6 EXTENDED VIBRATION SPECIFICATIONS PARAMETER PROCEDURE REQUIREMENTS Vibration improvement Vibration frequency range Vibration profile From 0 g to 30 g 0 Hz to 2 khz Constant sinus sweep 3 directions 8 h per direction No visible damage; no leakage of electrolyte; marking legible ΔC/C: ± 5 % with respect to initial measurements 60 Acceleration (g) 50 40 30 Improved SMD 20 0 Vishay extended AEC-Q200 0 0 0.5.5 2.0 f (khz) Fig. 4 - Vibration profile Table 7 ADDITIONAL ELECTRICAL DATA PARAMETER CONDITIONS VALUE Voltage Surge voltage for short periods IEC 60384-8, subclause 4.4 U s.5 x U R Reverse voltage for short periods IEC 60384-8, subclause 4.6; T A 50 C U rev V Current Leakage current After 2 min at U R I L2 0.0 x C R x U R Inductance Equivalent series inductance (ESL) Ø D 6 mm Typ. nh Resistance Equivalent series resistance (ESR) at 00 Hz Calculated from tan δ max. and C R (see Table 5) ESR = tan δ/2πfc R Revision: 2-Apr-7 6 Document Number: 28426

CAPACITANCE (C).20.0 C/C 0 C/C 0.00.0 0.90.00 0.80 0.90 0.70 2700 μf 0.60 000 μf 0.80-60 -40-20 0 20 40 60 80 00 20 40 60 0.50 0 0 2 0 3 0 4 0 5 C 0 = Capacitance at 20 C, 00 Hz T amb ( C) C 0 = Typical capacitance C at 20 C, 00 Hz f (Hz) Fig. 5 - Typical multiplier of capacitance as a function of ambient temperature Fig. 6 - Typical multiplier of capacitance as a function of frequency DISSIPATION FACTOR (tan δ) 8 0 3 tan/tan 0 tan/tan 0 6 0 2 4 0 2 0-60 -40-20 0 20 40 60 80 00 20 40 60 0. 0 0 2 0 3 0 4 0 5 tan δ = Typical tan δ at 20 C, 00 Hz T amb ( C) tan δ = Typical tan δ at 20 C, 00 Hz f (Hz) Fig. 7 - Typical multiplier of dissipation factor (tan δ) as a function of ambient temperature Fig. 8 - Typical multiplier of dissipation factor (tan δ) as a function of frequency EQUIVALENT SERIES RESISTANCE (ESR) 0 ESR/ESR 0 0. 0 0 2 0 3 0 4 f (Hz) 0 5 ESR 0 = Typical ESR at 20 C, 00 Hz T amb = 20 C Fig. 9 - Typical multiplier of ESR as a function of frequency Revision: 2-Apr-7 7 Document Number: 28426

IMPEDANCE (Z) 0 2 Z/Z 0 0 0. -60-40 -20 0 20 40 60 80 00 20 40 60 Z 0 = Typical impedance Z at 20 C, 00 khz Fig. 0 - Typical multiplier of impedance as a function of temperature T ( C) 0 2 Z (Ω) 0 2 3 4 Curve : 680-25-66 Curve 2: 000-25-86 Curve 3: 500-25-62 Curve 4: 2200-25-82 0 3 Z (Ω) 0 2 0 2 3 4 Curve : 330-50-66 Curve 2: 470-50-86 Curve 3: 680-50-62 Curve 4: 000-50-82 0. 0. 0.0 0 0 2 0 3 0 4 0 5 T amb = 20 C f (Hz) Fig. - Typical impedance as a function of frequency 0.0 0 0 2 0 3 0 4 0 5 T amb = 20 C f (Hz) Fig. 2 - Typical impedance as a function of frequency RIPPLE CURRENT AND USEFUL LIFE Table 8 ENDURANCE TEST DURATION AND USEFUL LIFE LIFE CODE Note Multiplier of useful life code: MBC245 ENDURANCE AT 50 C (h) USEFUL LIFE AT 50 C (h) USEFUL LIFE AT 40 C.8 x I R APPLIED (h) L 000 500 350 000 L2 500 500 350 000 L3 500 2000 400 000 Revision: 2-Apr-7 8 Document Number: 28426

I A I R 4.8 MBC245 4.5 4.3 4.2 4. 4.0 3.9 3.8 3.7 3.6 3.5 3.4 3.3 3.2 3. 3.0 2.8.0.5 2.0 2.5 Lifetime multiplier 2.6 2.4 2 6.0 8.0 4.0 2.2 20 I A = Actual ripple current at 00 khz I R = Rated ripple current at 00 khz, 50 C () Useful life at 50 C and I R applied; see Table 7 2.0.8.6.4.2 ().0 0.8 0.5 0.0 40 50 60 70 80 90 00 0 20 30 40 50 60 T amb ( C) 600 400 200 00 50 30 Fig. 3 - Multiplier of useful life as a function of ambient temperature and ripple current load Table 9 MULTIPLIER OF RIPPLE CURRENT (I R ) AS A FUNCTION OF FREQUENCY FREQUENCY (Hz) 50 00 300 000 3000 0 000 30 000 00 000 I R MULTIPLIER 0.40 0.60 0.75 0.80 0.90 0.95 0.97.00 Revision: 2-Apr-7 9 Document Number: 28426

Table 0 TEST PROCEDURES AND REQUIREMENTS TEST NAME OF TEST REFERENCE PROCEDURE (quick reference) REQUIREMENTS Mounting IEC 60384-8, subclause 4.3 Shall be performed prior to tests mentioned below; reflow soldering; for maximum temperature load refer to chapter Mounting ΔC/C: ± 5 % tan δ spec. limit I L2 spec. limit Endurance IEC 60384-8 / CECC 32300, subclause 4.5 T amb = 50 C; U R applied; for test duration see Table 7 ΔC/C: ± 20 % tan δ 2 x spec. limit I L2 spec. limit Useful life CECC 3030, subclause.8. T amb = 50 C; U R and I R applied; for test duration see Table 7 ΔC/C: ± 30 % tan δ 3 x spec. limit I L2 spec. limit no short or open circuit total failure percentage: % Shelf life (storage at high temperature) IEC 60384-8 / CECC 32300, subclause 4.7 T amb = 50 C; no voltage applied; 000 h After test: U R to be applied for 30 min, 24 h to 48 h before measurement For requirements see Endurance test above Reverse voltage IEC 60384-8 / CECC 32300, subclause 4.6 T amb = 50 C: 25 h at U = -0.5 V, followed by 25 h at U R ΔC/C: ± 5 % tan δ.5 x spec. limit I L2 spec. limit Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability. Revision: 2-Apr-7 0 Document Number: 28426

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