, CRA12S Thick Film Resistor Arry STANDARD ELECTRICAL SPECIFICATIONS CRA12S POER RATING P 70 C LIMITING ELEMENT VOLTAGE MAX. V FEATURES Convex terminl rry vilble with either sclloped corners (E version) or squre corners (S version) ide ohmic rnge: R to 1M0 8 or terminl pckge with isolted resistors Pure tin solder contcts on Ni brrier lyer, provides comptibility with led (Pb)-free nd led contining soldering processes Complint to RoHS Directive /95/EC Hlogen-free ccording to IEC 61249-2-21 definition TEMPERATURE COEFFICIENT ppm/k TOLERANCE % RESISTANCE RANGE Ω SERIES ; ; 0.0 ± 0 ± 1 E24; E96 50 R to 1M0 0.125 ± 0 ± 2; ± 5 E24 Zero-Ohm-Resistor: R mx. = 50 mω, I mx. = 1.5 A TECHNICAL SPECIFICATIONS PARAMETER UNIT AND CRA12S ; ; AND CRA12S Rted dissiption t P (1) 70 per element 0.1 0.125 Limiting element voltge U mx. AC/DC V 50 Insultion voltge U ins (1 min) V 0 Insultion resistnce Ω > 9 Ctegory temperture rnge C - 55 to + 155 (1) Power rting depends on the mx. temperture t the solder point, the component plcement density nd the substrte mteril. PART NUMBER AND PRODUCT DESPRIPTION Prt Number: 347K0JTR (2) C R A 1 2 E 0 8 3 4 7 K 0 J T R TERMINAL STYLE PIN VALUE TOLERANCE PACKAGING SPECIAL CRA12 S TR Up to 2 digits E TL 1 = 2 = 3 = 8 = Product Description: 47K 5 % RB8 e3 R = Deciml K = Thousnd M = Million 0000 = 0 Ω Jumper (2) Preferred wy for ordering products is by use of the PART NUMBER. F = ± 1 % G = ± 2 % J = ± 5 % Z = 0 Ω Jumper 47K 5 % RB8 e3 PIN RESISTANCE VALUE TOLERANCE PACKAGING LEAD (Pb)-FREE CRA12S R = Ω 47K = 47 kω 1M = 1 MΩ 0R0 = Jumper ± 1 % ± 2 % ± 5 % RB8 RD7 e3 = Pure tin termintion finish www.vishy.com For technicl questions, contct: thickfilmchip@vishy.com Document Number: 3 248 Revision: -Dec-
Thick Film Resistor Arry, CRA12S AVAILABLE TYPES AND RANGES TERMINAL COUNT CRA12S TEMPERATURE COEFFICIENT ± 0 ppm/k ± 0 ppm/k TOLERANCE ± 1 %; ± 2 %; ± 5 % PACKAGING TAPE IDTH DIAMETER PITCH PIECES/REEL CRA12S 12 mm 180 mm/7" 330 mm/13" 8 mm 00 5000 BLISTER TAPE ACC. IEC 686-3, TYPE II PART NUMBER PRODUCT DESCRIPTION TR TL RB8 RD7 Circuit Circuit Pin 1 8 pin pin Pin 1 pin Circuit Circuit 8 pin pin Pin 1 Document Number: 3 For technicl questions, contct: thickfilmchip@vishy.com www.vishy.com Revision: -Dec- 249
, CRA12S Thick Film Resistor Arry DERATING Frction of Rted Dissiption in % 1 0 80 60 40 0-55 - 25 0 25 50 75 0 125 155 175 70 Ambient Temperture in C DIMENSIONS S-Version B E-Version B A* P 1 0 3 T A* P 1 0 3 T B* L B* L A A PIN 1 PIN 1 p p e d c c b e b PIN NO # DIMENSIONS in millimeters L A A* B B* P T SOLDER PAD DIMENSIONS in millimeters c w d p b e 8 5. 0.79-0.51 0.38 1.27 0.55 3.05 6.40 0.79-0.51 0.38 1.27 0.55 3.05 AVE 2.2 4.3 0.57 1.27 0.71 1.05 1.09 REFLO 2.2 3.9 0.57 1.27 0.71 0.86 1.09 CRA12S 6.40 0.79 0.89 0.51 0.38 1.27 0.55 3.05 TOL. ± 0.15 ± 0.15 ± 0.15 ± 0.25 ± 0.2 ± 0.1 ± 0.15 ± 0.15 www.vishy.com For technicl questions, contct: thickfilmchip@vishy.com Document Number: 3 250 Revision: -Dec-
Thick Film Resistor Arry, CRA12S TEST PROCEDURES AND REQUIREMENTS EN 615-1 CLAUSE IEC 60068-2 TEST METHOD TEST (1) Figures re given for single element. PROCEDURE All tests re crried out in ccordnce with the following specifictions: EN 615-1, generic specifiction EN 140400, sectionl specifiction EN 1404-8, detil specifiction IEC 60068-2 environmentl test procedures Pckging of components is done in pper or blister tpes ccording to IEC 686-3 REQUIREMENTS PERMISSIBLE CHANGE (ΔR) (1) STABILITY CLASS 1 OR BETTER STABILITY CLASS 2 OR BETTER Stbility for product type: /CRA12S Ω to 1 MΩ 4.5 - Resistnce - ± 1 % ± 2 %, ± 5 % 4.7 - Voltge proof U = 1.4 x U ins ; 60 s No flshover or brekdown 4.13 - Short time overlod U = 2.5 x P 70 x R 2 x U mx. ; Durtion ccording to style 4.17.2 58 (Td) Solderbility Solder bth method; Sn60Pb40; non-ctivted flux; (235 ± 5) C; (2 ± 0.2) s Solder bth method; Sn96.5Ag3Cu0.5; non-ctivted flux; (245 ± 5) C; (3 ± 0.3) s Good tinning ( 95 % covered) no visible dmge Good tinning ( 95 % covered) no visible dmge 4.8.4.2 - Temperture coefficient (/- 55/) C nd (/125/) C ± 0 ppm/k ± 0 ppm/k 4.32 21 (U U3 ) Sher (dhesion) 45 N No visible dmge 4.33 21 (U U1 ) Substrte bending Depth 2 mm; 3 times No visible dmge, no open circuit in bent position ± (0.25 % R + 0.05 Ω) 4.19 14 (N) Rpid chnge of temperture 30 min. t - 55 C; 30 min t 125 C 5 cycles 00 cycles 4.23 - Dry het - 4.23.2 2 (B) Dmp het, cyclic 125 C; 16 h 4.23.3 30 (Db) Cold 55 C; 90 % RH; 24 h; 1 cycle 4.23.4 1 (A) Low ir pressure - 55 C; 2 h 4.23.5 13 (M) - 1 kp; (25 ± ) C; 1 h 4.23.6 30 (Db) Dmp het, cyclic 55 C; 90 % RH; 24 h; 5 cycle 4.23.7 - DC lod U = P 70 x R U = P 70 x R U mx. 1.5 h on; 0.5 h off; 4.25.1 - Endurnce t 70 C 70 C; 00 h 70 C; 8000 h 4.18.2 58 (Td) Resistnce to soldering het Solder bth method; (260 ± 5) C; ( ± 1) s ± (0.25 % R + 0.05 Ω) ± (0.5 % R + 0.05 Ω) ± (2 % R + 0.1 Ω) ± (2 % R + 0.1 Ω) ± (2 % R + 0.1 Ω) ± (4 % R + 0.1 Ω) 4.35 - Flmmbility, needle flme test IEC 60695-11-5; s No burning fter 30 s 4.24 78 (Cb) Dmp het, stedy stte (40 ± 2) C; (93 ± 3) % RH; 56 dys 4.25.3 - Endurnce t upper ctegory temperture 155 C; 00 h ± (2 % R + 0.1 Ω) 4.40 - Electrosttic dischrge (humn body model) IEC 61340-3-1; 3 positive nd 3 negtive dischrges; ESD voltge: 500 V 4.29 45 (XA) Component solvent resistnce Isopropyl lcohol; 50 C; method 2 No visible dmge 4.30 45 (XA) Solvent resistnce of mrking Isopropyl lcohol; 50 C; method 1; toothbrush Mrking legible, no visible dmge 4.22 6 (Fc) Vibrtion, endurnce by sweeping 4.37 - Periodic electric overlod 4.27 - Single pulse high voltge overlod, µs/700 µs f = Hz to 00 Hz; x, y, z 1.5 mm; A 0 m/s 2 ; sweeps per xis U = 15 x P 70 x R 2 x U mx. 0.1 s on; 2.5 s off; 00 cycles Û = x P 70 x R 2 x U mx. pulses Document Number: 3 For technicl questions, contct: thickfilmchip@vishy.com www.vishy.com Revision: -Dec- 251
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