Large Storage Window in a-sinx/nc-si/a-sinx Sandwiched Structure

Similar documents
C-V and G-V Measurements Showing Single Electron Trapping in Nanocrystalline Silicon Dot Embedded in MOS Memory Structure

Nanocrystalline Si Formation by Pulsed Laser Deposition/Annealing Techniques and Its Charge Storage Eect

Gate Carrier Injection and NC-Non- Volatile Memories

ASINGLE-ELECTRON memory is an ultimate device

Influence of silicon-nanocrystal distribution in SiO 2 matrix on charge injection and charge decay

Optimization of the Dielectric Constant of a Blocking Dielectric in the Nonvolatile Memory Based on Silicon Nitride

Threshold voltage shift of heteronanocrystal floating gate flash memory

PACS numbers: La, Dx Keywords: A. Semiconductors; A. Nanostructures; D. Electronic states

Supporting Information. Direct n- to p-type Channel Conversion in Monolayer/Few-Layer WS 2 Field-Effect Transistors by Atomic Nitrogen Treatment

single-electron electron tunneling (SET)

Fabrication of Efficient Blue Light-Emitting Diodes with InGaN/GaN Triangular Multiple Quantum Wells. Abstract

Traps in MOCVD n-gan Studied by Deep Level Transient Spectroscopy and Minority Carrier Transient Spectroscopy

Electronic transport in low dimensional systems

(a) (b) Supplementary Figure 1. (a) (b) (a) Supplementary Figure 2. (a) (b) (c) (d) (e)

CVD-3 LFSIN SiN x Process

Flexible nonvolatile polymer memory array on

An interfacial investigation of high-dielectric constant material hafnium oxide on Si substrate B

Zeeman splitting of single semiconductor impurities in resonant tunneling heterostructures

Supplementary Figure S1. AFM images of GraNRs grown with standard growth process. Each of these pictures show GraNRs prepared independently,

CHAPTER I. Introduction. 1.1 State of the art for non-volatile memory

Electrically tunable electroluminescence from SiN x -based light-emitting devices

Formation of unintentional dots in small Si nanostructures

Temperature Dependent Current-voltage Characteristics of P- type Crystalline Silicon Solar Cells Fabricated Using Screenprinting

JUNCTION LEAKAGE OF A SiC-BASED NON-VOLATILE RANDOM ACCESS MEMORY (NVRAM) K. Y. Cheong ABSTRACT INTRODUCTION

ECE 340 Lecture 39 : MOS Capacitor II

How a single defect can affect silicon nano-devices. Ted Thorbeck

Nanoelectronics. Topics

Effects of Antimony Near SiO 2 /SiC Interfaces

Chapter 3 Properties of Nanostructures

TRANSPORT IN SILICON QUANTUM DOTS EMBEDDED IN A RARE EARTH OXIDE

Classification of Solids

Memory properties and charge effect study in Si nanocrystals by scanning capacitance microscopy and spectroscopy

Normally-Off GaN Field Effect Power Transistors: Device Design and Process Technology Development

Modelling and Simulation of Charging and Discharging Processes in Nanocrystal Flash Memories During Program and Erase Operations

Nanoparticle Devices. S. A. Campbell, ECE C. B. Carter, CEMS H. Jacobs, ECE J. Kakalios, Phys. U. Kortshagen, ME. Institute of Technology

Large Scale Direct Synthesis of Graphene on Sapphire and Transfer-free Device Fabrication

Carbon Nanotube Thin-Films & Nanoparticle Assembly

LaTiON/LaON as band-engineered charge-trapping layer for nonvolatile memory applications

Fabrication / Synthesis Techniques

New experimental evidence for the role of long- range potential fluctuations in the mechanism of 1/f noise in a-si:h

Fundamentals of Nanoelectronics: Basic Concepts

Supporting Information

Formation mechanism and Coulomb blockade effect in self-assembled gold quantum dots

Gold Nanoparticles Floating Gate MISFET for Non-Volatile Memory Applications

CVD-3 MFSIN-HU-2 SiN x Mixed Frequency Process

Transport properties through double-magnetic-barrier structures in graphene

Improved electroluminescence from silicon nitride light emitting devices by localized surface plasmons

Fabrication and Characterization of Al/Al2O3/p-Si MOS Capacitors

Electronic Supplementary Information. Molecular Antenna Tailored Organic Thin-film Transistor for. Sensing Application

Nanocrystalline Si formation inside SiN x nanostructures usingionized N 2 gas bombardment

Fig. 8.1 : Schematic for single electron tunneling arrangement. For large system this charge is usually washed out by the thermal noise

Supplementary Figure 1 Experimental setup for crystal growth. Schematic drawing of the experimental setup for C 8 -BTBT crystal growth.

Stabilizing the forming process in unipolar resistance switching

CVD-3 MFSIN-HU-1 SiN x Mixed Frequency Process

Single Electron Transistor (SET)

Keywords: thin-film transistors, organic polymers, bias temperature stress, electrical instabilities, transient regime.

Vanadium Dioxide (VO 2 ) is also a Ferroelectric: Properties from Memory Structures

Optical properties of nano-silicon

Highly Sensitive and Wide-Band Tunable Terahertz Response of Plasma Wave based on Graphene Field Effect Transistors

Transport through Andreev Bound States in a Superconductor-Quantum Dot-Graphene System

A final review session will be offered on Thursday, May 10 from 10AM to 12noon in 521 Cory (the Hogan Room).

Low Power Phase Change Memory via Block Copolymer Self-assembly Technology

TRANSVERSE SPIN TRANSPORT IN GRAPHENE

Enhancing the Performance of Organic Thin-Film Transistor using a Buffer Layer

Characteristics and parameter extraction for NiGe/n-type Ge Schottky diode with variable annealing temperatures

Frequency dispersion effect and parameters. extraction method for novel HfO 2 as gate dielectric

Supporting Information. by Hexagonal Boron Nitride

Edge termination study and fabrication of a 4H SiC junction barrier Schottky diode

Energy position of the active near-interface traps in metal oxide semiconductor field-effect transistors on 4H SiC

High Performance, Low Operating Voltage n-type Organic Field Effect Transistor Based on Inorganic-Organic Bilayer Dielectric System

This article has been accepted and published on J-STAGE in advance of copyediting. Content is final as presented.

Supplementary documents

Supporting Information for: Sustained sub-60 mv/decade switching via the negative capacitance effect in MoS 2 transistors

SUPPLEMENTARY INFORMATION

Theoretical Study on Graphene Silicon Heterojunction Solar Cell

MOS CAPACITOR AND MOSFET

Semiconductor Nanowires: Motivation

Coulomb Blockade and Kondo Effect in Nanostructures

Trends in Nanotechnology: Self-Assembly and Defect Tolerance

Electroluminescence from Silicon and Germanium Nanostructures

Tunneling characteristics of graphene

SUPPLEMENTARY NOTES Supplementary Note 1: Fabrication of Scanning Thermal Microscopy Probes

Mechanism of Polarization Fatigue in BiFeO 3 : the Role of Schottky Barrier

Nanostructure. Materials Growth Characterization Fabrication. More see Waser, chapter 2

SUPPLEMENTARY INFORMATION

Electrical Properties of Ti/Au/SiO,/InP Structures

CVD: General considerations.

Supporting Information: Poly(dimethylsiloxane) Stamp Coated with a. Low-Surface-Energy, Diffusion-Blocking,

META-STABILITY EFFECTS IN ORGANIC BASED TRANSISTORS

Carbon Nanotube Synaptic Transistor Network for. Pattern Recognition. Supporting Information for

ESH Benign Processes for he Integration of Quantum Dots (QDs)

Black phosphorus: A new bandgap tuning knob

From nanophysics research labs to cell phones. Dr. András Halbritter Department of Physics associate professor

Multiple Gate CMOS and Beyond

Lecture 7: Extrinsic semiconductors - Fermi level

Efficient Inorganic Perovskite Light-Emitting Diodes with Polyethylene Glycol Passivated Ultrathin CsPbBr 3 Films

Enhancement-mode quantum transistors for single electron spin

Improved Interfacial and Electrical Properties of GaSb Metal Oxide

SUPPLEMENTARY INFORMATION

Barrier inhomogeneities of Pt contacts to 4H SiC *

Transcription:

2017 Asia-Pacific Engineering and Technology Conference (APETC 2017) ISBN: 978-1-60595-443-1 Large Storage Window in a-sinx/nc-si/a-sinx Sandwiched Structure Xiang Wang and Chao Song ABSTRACT The a-sin x /nc-si/a-sin x sandwiched structures have been fabricated by plasma enhanced chemical vapor deposition (PECVD) technique at low temperature (250 ). Si nanocrystal (nc-si) layer is fabricated from a hydrogen-diluted silane gas mixture with a layer-by-layer technique in a PECVD reactor. Atom force microscopy measurement shows that the density of nc-si is about 2 10 11 cm -2. The charging and discharging of nc-si quantum dots is studied by capacitance-voltage (C-V) measurement at room temperature. An ultralarge hysteresis which is attributed to injecting the electrons and holes into the nc-si dots is observed in the C-V characteristic. The largest shift of the flatband voltage (ΔV FB ) of the sample is above 8 V. The number of electron stored in each nc-si quantum dot estimated from the ΔV FB is close to 8. A model is put forward to interpret the ultralarge hysteresis phenomena and mechanism of the charge storage in detail. INTRODUCTION Currently, the MIS structure containing silicon quantum dots has attracted great interest both for new physical phenomena and for potential application in future single electron transistors, switching devices and memory devices [1-6]. Several research groups have investigated charge storage effects in silicon nanostructures and reported on their potential applications to memory devices [7,8]. The flash-memory devices based on silicon quantum dots have characteristics that include long-term charge storage, fast response, and low power requirement. However, these devices are sensitive to the surface states because only a small number of electrons are used in the memory operations. Recently, several MIS structures have been carefully fabricated to ensure a negligible concentration of interface traps so that the measured Capacitance-voltage (C-V) characteristic is due predominantly to effect of the nanocrystal [9]. In this paper, we report the fabrication of a-sin x /nc-si/a-sin x sandwiched structure on the silicon substrate by plasma enhanced chemical vapor deposition (PECVD) technique at low temperature (250 ). From the C-V and Xiang Wang 1,a and Chao Song 1,b 1 Department of Physics and Electrical Engineering Hanshan Normal University Chaozhou, People s Republic of China a xwang@hstc.edu.cn 1, b csong@hstc.edu.cn 405

Conductance-voltage (G-V) characteristic, an ultralarge hysteresis is observed which means a large number of charges are stored in the sample. The dependence of frequency of C-V measurements show that there are no capacitance shoulders and distortions around the flatband voltage in the C-V curves, which means the interface defect states is negligible. A model is forward to interpret the ultralarge hysteresis phenomena. EXPERIMENT DETAILS The sandwiched structures (a-sin x /nc-si/a-sin x ) were deposited on a substrate of n-type (100) crystalline silicon (6 8 Ω/cm) in a PECVD system at 250 C with an rf power of 50 W. First, a thin tunneling SiN x layer of 2 nm was deposited by a gas mixture of silane and ammonia. Then, an nc-si array layer was fabricated from a hydrogen-diluted silane gas mixture with a layer-by-layer technique. Finally, a thick gate SiN x layer was deposited following the same conditions as those of the tunneling SiN x layer. After that the sample was annealed in N 2 ambient at 900 for 30 minutes to improve the quality of the nc-si and reduce the interface state and defects in the structure. Al electrodes with an area of 1 10-3 cm 2 on the topside and backside were made with the vacuum evaporation method. The C-V characteristics were measured at room temperature using an Agilent 4284A precision LCR meter. All measurements were performed at air ambient and at room temperature inside a shield box. Atom force microscopy (AFM) was used to characterize the size and distribution of the nc-si array in the sample. In order to the AFM measurement, a designed sample was made following the same programming except for without the thick gate SiN x layer. The plane-view AFM image of the designed sample shows that the shape of nc-si dots is roughly spherical and the mean size is 5 nm with a deviate of less than 10 %. The density of nc-si is estimated to be 2 10 11 cm -2. RESULTS AND DISCUSSION The typical C-V and G-V characteristics shown in Fig. 1 are obtained by sweeping the voltage between inversion and accumulation regions at room temperature. The sample is first held at a gate voltage of -1V for 60 s in order to allow saturation positive charge storage, followed by a gate voltage sweep from -1 V to 1 V. At the end of this forward sweep, the sample is held at a gate voltage of 1 V for 60 s to allow saturation negative charge storage and then followed by a reverse sweep from 1 V to -1 V. The voltage sweep range is then increased from -1 V<V g <1 V to -9 V<V g <9 V in steps of 0.5 V. 406

Figure 1. High frequency (1MHz) C-V and G-V characteristics of sample. Figure 2. Flatband voltage V FB versus the gate voltage sweep range. A big clockwise hysteresis is observed in both C-V and G-V characteristics, which is caused by the successive charge trapping and de-trapping processes in nc-si. From the C-V plot, the flatband voltage VFB is determined for each C-V curve from the flatband capacitance value of 4.0 10-11 F. Fig. 2 demonstrates the gate voltage dependence of flatband voltage. As can be seen here, a higher gate voltage results in a wider corresponding hysteresis, which means more and more charges are stored in the nc-si and at a gate voltage of above 7 V, the hysteresis width changes hardly, which means the saturation charge storage. Here the total hysteresis width is the sum of the flatband voltage shifts due to electron and hole charging. The due to the electron and hole charging is 4.6 V and 3.5 V, respectively. We also measured the frequency dependence of C-V characteristic. We find the magnitude of the capacitance hysteresis almost remain unchanged at different frequency. As the interface state related strongly to the frequency, the hysteresis maybe results mainly from the charge that is trapped in the discrete energy levels of the nc-si, and not from the interface state between nc-si and the environmental. The total of charge is estimated from the shift of VFB, Q C V =2.3 10-10 C. From the AFM FB 407

results, the density of nc-si is 2 10 11 cm-2, hence the numbers of electron trapped in every nc-si can be estimated to 7, which means there are at least seven discrete levels are taken up by electron. In order to interpret the phenomena, the energy level inside the nc-si must be calculated. Two effects are playing a role in energy state, one is the quantum confinement effect and the other is the coulomb blockade effect. The quantum confinement effect provides discrete levels, and the coulomb blockade effect implies energy spacing between carriers in those confinement levels. The coulomb blockade energy is estimated according to a semiclassical constant-interaction (CI) theory. For nc-sis (average diameter of 5 nm) floating above the silicon substrate, the capacitance of individual dot is estimate to be 18 CQD 4 0 SiN R 2.2 10 F (1) with R=2.5 nm as radius of the nc-si. The corresponding coulomb blockade energy is 2 q ECB 72meV (2) C with q as the elementary charge. For quantum confinement, an infinite spherical square well model is employed to approximately estimate the energy levels of nc-si as follow 2 2 En 2 n,0 (3) 2mSiR with m Si =0.26 m0, where m 0 is the rest electron mass, and is the nth zero point of the spherical Bessel function j l (r). From this formula, the first three energy levels are calculated to be 0.232 ev, 0.927 ev, and 2.085 ev, respectively. QD Figure 3. The schematic band diagrams of the sample. Taking an energy barrier between Si and SiN x of 1.5 ev, the second excited state is already delocalized. Only the ground state and first excited state are confined in the well. Because of the spin degeneracy, there are two ground state levels and six first excited state levels in the well, which is consistent with the result from our experiments. Being based on above discuss, a schematic band diagram of the sample is shown in the Fig. 3. As is shown in the diagram, when a positive voltage is applied to the gate, the Fermi level of the n-type silicon moves upward. When the Fermi level 408

is aligned to the discrete level of the nc-si, the electron can tunnel into nc-si and be trapped. With increasing the gate voltage to 7 V, the Fermi level of n-type silicon is higher than all the discrete level in the well, hence all the levels are taken up by electron and no more electrons can tunnel into nc-si dots. SUMMARY We have successfully fabricated a-sin x /nc-si/a-sin x sandwiched structure on n-type silicon substrate by layer-by-layer deposition technique at low temperature in a PECVD reactor. AFM photography indicates that the nc-si dots have a good size uniform and the dot density is 2 10 11 cm -2. By capacitance measurement, we study the charging effect of the structure and an ultralarge hysteresis, whose width is above 8 V, is observed in the C-V characteristic. We find that there are no shoulders and distortions near the flatband voltage and the magnitude of the hysteresis is almost independent of frequency. Hence, the discrete quantum energy levels, rather than the interface state, are the primary cause of charge trapping and storage. The number of electron stored in each nc-si quantum dot estimated from the ΔV FB is close to 7. We also calculate the confinement energy level inside the nc-si and there are 8 discrete levels inside the nc-si dots. The values are close and saturation model could interpret the ultralarge hysteresis phenomena in our a-sin x /nc-si/a-sin x sandwiched structures. ACKNOWLEDGEMENTS This work is supported by NSF of China (No. 61306003 and 61274140), the NSF of Guangdong Province (S2011010001853), and the Project of DEGP (No.2012KJCX0075). REFERENCES [1] T. W. Kim, C. H. Cho, B. H. Kim, and S. J. Park, Quantum confinement effect in crystalline silicon quantunm dots in silicon nitride grown using SiH 4 and NH 3, Appl. Phys. Lett. 88 (2006) 123102. [2] R. Lockwood, A. Hryciw, and A. Meldrum, Nonresonant carrier tunneling in arrays of silicon nanocrystals, Appl. Phys. Lett. 89 (2006) 263112. [3] C. H. Cho, B. H. Kim, and S. J. Park, Room-temperature coulomb blockade effect in silicon quantun dots in silicon nitride films, Appl. Phys. Lett. 89 (2006) 013116. [4] M. C. Lin, K. Aravind, C. S. Wu, Y. P. Wu, C. H. Kuan, W. Kuo, and C. D. Chen, Cyclotron localization in a sub-10-nm silicon quantum dot single electron transistor, Appl. Phys. Lett. 90 (2000) 032106. [5] S. Choi, H. Yang, M. Chang, S. Baek, and H. Hwang, Memory characteristics of slicon nitride with silicon nanocrystals as a charge trapping layer of nonvolatile memory devices, Appl. Phys. Lett. 86 (2005) 251901. [6] S. Tiwari, F. Rama, H. Hanafi, A. Hartstein, E. F. Crabbe, and K. Chan, A silicon nanocrystals based memory, Appl. Phys. Lett. 68 (1996) 1377. [7] S. R. Oda S. Y. Huang. Charge storage in nitrided nanocrystalline silicon dots, Applied Physics Letters 87 (2005) 173107. [8] M. Saitoh, E. Nagata, and T. Hiramoto, Large memory window and long charge-retention time in ultranarrow-channel silicon floating-dot memory, Appl. Phys. Lett. 82 (2003) 1787-1789. [9] X. Wang, J. Huang, X. G. Zhang, H. L. Ding, L. W. Yu, X. F. Huang, W. Li, J. Xu and K. J. Chen, Resonant tunneling and storage of electrons in Si Nanocrystals within a-sin x /nc-si/a-sin x structures, Chin. Phys. Lett. 25 (2008) 1094-1097. 409