PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS

Similar documents
PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS

Schottky Rectifiers Zheng Yang (ERF 3017,

Chapter 7. The pn Junction

Current mechanisms Exam January 27, 2012

Schottky diodes. JFETs - MESFETs - MODFETs

Avalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping

8. Schottky contacts / JFETs

Schottky Diodes (M-S Contacts)

Lecture 9: Metal-semiconductor junctions

Semiconductor Device Physics

Semiconductor Physics and Devices

Metal Semiconductor Contacts

Semiconductor Physics Problems 2015

Thermionic Emission Theory

EECS130 Integrated Circuit Devices

ECE 340 Lecture 35 : Metal- Semiconductor Junctions Class Outline:

Session 6: Solid State Physics. Diode

Semiconductor Physics fall 2012 problems

EECS130 Integrated Circuit Devices

Introduction to Power Semiconductor Devices

PN Junction

Semiconductor Physics fall 2012 problems

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Chenming Hu.

Figure 3.1 (p. 141) Figure 3.2 (p. 142)

Fundamentals of Semiconductor Physics

Peak Electric Field. Junction breakdown occurs when the peak electric field in the PN junction reaches a critical value. For the N + P junction,

Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination

For the following statements, mark ( ) for true statement and (X) for wrong statement and correct it.

Consider a uniformly doped PN junction, in which one region of the semiconductor is uniformly doped with acceptor atoms and the adjacent region is

Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes

n N D n p = n i p N A

1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00

Module-6: Schottky barrier capacitance-impurity concentration

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

Lecture 15 - The pn Junction Diode (I) I-V Characteristics. November 1, 2005

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

Semiconductor Physics. Lecture 6

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors. Fabrication of semiconductor sensor

Effective masses in semiconductors

Diodes. EE223 Digital & Analogue Electronics Derek Molloy 2012/2013.

6.012 Electronic Devices and Circuits

Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors

EE 130 Intro to MS Junctions Week 6 Notes. What is the work function? Energy to excite electron from Fermi level to the vacuum level

Midterm I - Solutions

Semiconductor Junctions

Thermionic emission vs. drift-diffusion vs. p-n junction

Section 12: Intro to Devices

3. Two-dimensional systems

PN Junctions. Lecture 7

Lecture 04 Review of MOSFET

Junction Diodes. Tim Sumner, Imperial College, Rm: 1009, x /18/2006

Semiconductor Devices

junctions produce nonlinear current voltage characteristics which can be exploited

ECE 340 Lecture 27 : Junction Capacitance Class Outline:

ECE321 Electronics I

Introductory Nanotechnology ~ Basic Condensed Matter Physics ~

Electronic PRINCIPLES

Metal Semiconductor Contacts

Electronic Circuits for Mechatronics ELCT 609 Lecture 2: PN Junctions (1)

SRI VIDYA COLLEGE OF ENGINEERING AND TECHNOLOGY VIRUDHUNAGAR Department of Electronics and Communication Engineering

Sample Exam # 2 ECEN 3320 Fall 2013 Semiconductor Devices October 28, 2013 Due November 4, 2013

Lecture 17 - p-n Junction. October 11, Ideal p-n junction in equilibrium 2. Ideal p-n junction out of equilibrium

Semiconductor Detectors

Electronics The basics of semiconductor physics

MOS CAPACITOR AND MOSFET

Electrical Characteristics of MOS Devices

CHAPTER 4: P-N P N JUNCTION Part 2. M.N.A. Halif & S.N. Sabki

ECE 305 Exam 2: Spring 2017 March 10, 2017 Muhammad Alam Purdue University

Solid State Electronics. Final Examination

PHYS208 P-N Junction. Olav Torheim. May 30, 2007

The Law of the Junction Revisited. Mark Lundstrom Network for Computational Nanotechnology and Purdue University ( ). (1)

Hussein Ayedh. PhD Studet Department of Physics

OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626

Determination of properties in semiconductor materials by applying Matlab

Spring Semester 2012 Final Exam

Lecture (02) PN Junctions and Diodes

MTLE-6120: Advanced Electronic Properties of Materials. Semiconductor p-n junction diodes. Reading: Kasap ,

PN Junction and MOS structure

The pn junction. [Fonstad, Ghione]

V BI. H. Föll: kiel.de/matwis/amat/semi_en/kap_2/backbone/r2_2_4.html. different electrochemical potentials (i.e.

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006

Lecture 15 The pn Junction Diode (II)

R. Ludwig and G. Bogdanov RF Circuit Design: Theory and Applications 2 nd edition. Figures for Chapter 6

Surfaces, Interfaces, and Layered Devices

Lecture-4 Junction Diode Characteristics

- A free electron in CB "meets" a hole in VB: the excess energy -> a photon energy.

L03: pn Junctions, Diodes

ISSUES TO ADDRESS...

This is the 15th lecture of this course in which we begin a new topic, Excess Carriers. This topic will be covered in two lectures.

Section 12: Intro to Devices

Lecture 12: MOS Capacitors, transistors. Context

Concept of Core IENGINEERS- CONSULTANTS LECTURE NOTES SERIES ELECTRONICS ENGINEERING 1 YEAR UPTU. Page 1

Physics of Semiconductors 8 th

Lecture (02) Introduction to Electronics II, PN Junction and Diodes I

Lecture 5 Junction characterisation

p-n junction biasing, p-n I-V characteristics, p-n currents Norlaili Mohd. Noh EEE /09

ECE 305 Fall Final Exam (Exam 5) Wednesday, December 13, 2017

Diodes. anode. cathode. cut-off. Can be approximated by a piecewise-linear-like characteristic. Lecture 9-1

Chap. 11 Semiconductor Diodes

EE 3329 Electronic Devices Syllabus ( Extended Play )

Transcription:

PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS Tennessee Technological University Wednesday, October 30, 013 1

Introduction Chapter 4: we considered the semiconductor in equilibrium and determined electron and hole concentrations in the conduction and valence bands, respectively. The net flow of the electrons and holes in a semiconductor generates current. The process by which these charged particles move is called transport. Chapter 5: we considered the two basic transport mechanisms in a semiconductor crystal: drift: the movement of charge due to electric fields, and diffusion: the flow of charge due to density gradients. Tennessee Technological University Wednesday, October 30, 013

Introduction Chapter 6: we discussed the behavior of nonequilibrium electron and hole concentrations as functions of time and space. We developed the ambi-polar transport equation which describes the behavior of the excess electrons and holes. Chapter 7: We considered the situation in which a p-type and an n-type semiconductor are brought into contact with one another to form a PN junction. Tennessee Technological University Wednesday, October 30, 013 3

Introduction Chapter 8: We considered the PN junction with a forward-bias applied voltage and determined the current-voltage characteristics. When holes flow from the p region across the space charge region into the n region, they become excess minority carrier holes and are subject to excess minority carrier diffusion, drift, and recombination. When electrons from the n region flow across the space charge region into the p region, they become excess minority carrier electrons and are subject to these same processes. Tennessee Technological University Wednesday, October 30, 013 4

Introduction When a sufficiently large reverse-bias voltage is applied across a PN junction, breakdown can occur, producing a large reverse-bias current in the junction, which can cause heating effects and catastrophic failure of the diode. Zener diodes are designed to operate in the breakdown region. Breakdown puts limits on the amount of voltage that can be applied across a PN junction. Tennessee Technological University Wednesday, October 30, 013 5

Introduction Chapter 9: we will consider the metalsemiconductor junction and the semiconductor hetero-junction, in which the material on each side of thejunctionisnotthesame.thesejunctionscan also produce diodes. An Ohmic contact is a low-resistance junction providing current conduction in both directions. We will examine the conditions that yield metalsemiconductor Ohmic contacts. Tennessee Technological University Wednesday, October 30, 013 6

Metal-Semiconductor Junction There are two kinds of metal-semiconductor contacts: Rectifying Schottky diodes: metal on lightly doped Silicon. Low-resistance Ohmic contacts: metal on heavily doped Silicon. Tennessee Technological University Wednesday, October 30, 013 7

The Schottky Barrier Diode Rectifying contacts are mostly made of n-type semiconductors; for this reason we will concentrate on this type of diode. In the ideal energy-band diagram for a particular metal and n- type semiconductor, the vacuum level is used as a reference. The parameter M is the metal work function (in volts), s is the semiconductor work function, and is known as the electron affinity. Before contact, the Fermi level in the semiconductor was above that in the metal. In order for the Fermi level to become a constant through the system in thermal equilibrium, electrons from the semiconductor flow into the lower energy states in the metal. Tennessee Technological University Wednesday, October 30, 013 8

The Schottky Barrier Diode The parameter B0 is the ideal barrier height of the semiconductor contact, the potential barrier seen by electrons in the metal trying to move into the semiconductor. The barrier is known as the Schottky barrier and is given as: 0 ( B M ) On the semiconductor side, is the built-in potential barrier. This barrier, similar to the case of the PN Junction, is the barrier seen by electrons in the conduction band trying to move into the metal V bi is given as: Vbi ( 0 n) B Tennessee Technological University Wednesday, October 30, 013 9

The Schottky Barrier Diode Bn Increases with Increasing Metal Work Function Vacuum level, E 0 q M Si = 4.05 ev M : Work Function of metal q Bn E c Si : Electron Affinity of Si E f Theoretically, Bn = M Si E v x = 0 x = x n Fig. 9.1: Ideal energy-band diagram of a metal-semiconductor junction Tennessee Technological University Wednesday, October 30, 013 10

The Schottky Barrier Diode Metal Depletion layer Neutral region q Bn N-Si E c E f Schottky barrier height, B, is a function of the metal material. E v P-Si E c E f B is the most important parameter. The sum of q Bn and q Bp is equal to E g. q Bp E v Fig. 9.: Energy Band Diagram of Schottky Contact Tennessee Technological University Wednesday, October 30, 013 11

The Schottky Barrier Diode Schottky barrier heights for electrons and holes Metal Mg Ti Cr W Mo Pd Au Pt Bn (V) 0.4 0.5 0.61 0.67 0.68 0.77 0.8 0.9 Bp (V) 0.61 0.5 0.4 0.3 Work Function 3.7 4.3 4.5 4.6 4.6 5.1 5.1 5.7 m (V) Bn + Bp E g Bn increases with increasing metal work function Tennessee Technological University Wednesday, October 30, 013 1

The Schottky Barrier Diode q M q Bn Si = 4.05 ev + Vacuum level, E 0 Ec E f A high density of energy states in the band gap at the metal-semiconductor interface pins E f to a narrow range and Bn is typically 0.4 to 0.9 V Question: What is the typical range of Bp? E v Fig. 9.3: Fermi Level Pinning Tennessee Technological University Wednesday, October 30, 013 13

The Schottky Barrier Diode Schottky Contacts of Metal Silicide on Si Silicide: A Silicon and metal compound. It is conductive similar to a metal. Silicide-Si interfaces are more stable than metal-silicon interfaces. After metal is deposited on Si, an annealing step is applied to form a Silicide-Si contact. The term metal-silicon contact includes and almost always means Silicide-Si contacts. Silicide ErSi 1.7 HfSi MoSi ZrSi TiSi CoSi WSi NiSi Pd Si PtSi f Bn (V) 0.8 0.45 0.55 0.55 0.61 0.65 0.67 0.67 0.75 0.87 f Bp (V) 0.55 0.49 0.45 0.45 0.43 0.43 0.35 0.3 Table. 9.1: Schottky Contacts of Metal Silicide on Si Tennessee Technological University Wednesday, October 30, 013 14

The Schottky Barrier Diode q q Bn bi q Bn q( bi + V) qv E c E f E v E c E f E v qv W bi dep q q x n Bn Bn s C W dep ( E A c kt ln E E f N N d d c ) s( Vbi V qn max R ) end x Question: How should we plot the CV data to extract bi? s n Fig. 9.4: Using C-V Data to Determine B Tennessee Technological University Wednesday, October 30, 013 15

Exercise 1. Consider a contact between Tungsten and an n-type Silicon doped to N d = 10 16 cm -3 at T = 300K. Calculate the theoretical barrier height, built-in potential barrier and maximum electric field in the metal-semiconductor diode for a zero applied bias. Use the metal work function for Tungsten as M = 4.55V and electron affinity for Silicon = 4.01V. 0 ( B M ) Vbi ( 0 n) B W dep x n s( Vbi V qn d R ) Emax en x d n s Tennessee Technological University Wednesday, October 30, 013 16

Solution B0 is the ideal Schottky barrier height. B0 ( M ) 4.554.01 0. 54V The space charge width at a zero bias is: 19 kt N c.8x10 n ln 0.059ln 0. 06V 16 e N d 10 V bi ( B0 n) 0.540.06 0. 33 V W dep x n 14 s ( V bi V R ) (11.7 )( 8.85 * 10 )( 0.33 ) - 4 0.07 * 10 cm 19 16 qn (1.6 * 10 )(10 ) d E max end x s n 19 16 (1.6*10 )(10 )(0.07*10 14 (11.7)(8.85*10 ) 4 ) 3.*10 4 V / cm Tennessee Technological University Wednesday, October 30, 013 17

The Schottky Barrier Diode Using CV Data to Determine B 1/C 1 C ( bi V ) qn A d s q Bn q bi E c E f V E bi v Fig. 9.5: Using C-V Data to Determine C Tennessee Technological University Wednesday, October 30, 013 18

The Schottky Barrier Diode v thx - q( B V) E c V Metal N-type Silicon E fm q B qv E fn E v n v J th N SM c e q( V )/ kt 3kT J 1 st B / m e n qnv thx qv / kt mn kt h v thx 4qmnk 3 h, where J st 3/ kt T e e 100e q( V )/ kt / m n q / kt B B q / kt B e qv / kt A/cm Tennessee Technological University Wednesday, October 30, 013 19 x Richardson's Constant A * 4qmnk 3 h

The Schottky Barrier Diode Schottky Diodes V = 0 Forward biased I Reverse biased Reverse bias V Forward bias Tennessee Technological University Wednesday, October 30, 013 0

The Schottky Barrier Diode Schottky Diodes I 0 A I * I * A KT 4qmnk 3 h I SM e q / kt B M S 100 A/(cm I st e qv / kt K I st ) I st 1) Tennessee Technological University Wednesday, October 30, 013 1 ( e qv / kt Richardson's Constant A * 4qmn k 3 h

The Schottky Barrier Diode Applications of Schottky Diodes I I Schottky diode I I st ( e qv / kt 1) I st AKT e q / kt B B PN junction diode I st of a Schottky diode is 10 3 to 10 8 times larger than a PN junction diode, depending on B. Alarger I 0 means a smaller forward drop V. A Schottky diode is the preferred rectifier in low voltage, high current applications. V Tennessee Technological University Wednesday, October 30, 013

Exercise. Consider a Tungsten-Silicon diode with a barrier height of BN = 0.67V and J st =6*10-5 A/cm. Calculate the effective Richardson constant. J st * A T e q Bn / kt Richardson's Constant A * 4qmnk 3 h Tennessee Technological University Wednesday, October 30, 013 3

Solution 1. Using the relation for the reverse saturation current density: J st * A T e q Bn / kt A * J T st qbn / kt e 114 K A cm Tennessee Technological University Wednesday, October 30, 013 4

The Schottky Barrier Diode 110V/0V AC utility power PN Junction rectifier Hi-voltage 100kHz Hi-voltage Transformer Lo-voltage Schottky rectifier 50A DC AC AC 1V MOSFET DC inverter feedback to modulate the pulse width to keep V out = 1V Fig. 9.6: Switching Power Supply Tennessee Technological University Wednesday, October 30, 013 5

Applications of Schottky Barrier Diode Synchronous Rectifier: For an even lower forward drop, replace the diode with a wide-w MOSFET which is not bound by the tradeoff between diode V and leakage current. There is no minority carrier injection at the Schottky junction. Therefore, Schottky diodes can operate at higher frequencies than PN junction diodes. Tennessee Technological University Wednesday, October 30, 013 6

Comparison of Schottky Barrier Diode and the PN Junction Diode The ideal current-voltage relationship of the Schottky barrier diode are of the same form as the PN Junction Diode, there is only a magnitude difference in the reverse-saturation current densities and the switching characteristics. The current in a PN Junction is determined by the diffusion of minority carriers while the current in a Schottky barrier diode is determined by thermionic emission of majority carriers over a potential barrier. The effective turn-on voltage of the Schottky diode is less than the PN Junction diode. The Schottky diode is a high-frequency device than the PN Junction diode, therefore can be used in fast-switching application in pico-second time. Tennessee Technological University Wednesday, October 30, 013 7

Picture Credits Semiconductor Physics and Devices, Donald Neaman, 4th Edition, McGraw Hill Publications. Modern Semiconductor Devices for Integrated Circuits, Prof. Chenming Calvin Hu, UC Berkeley (Free e-book Download) http://www.eecs.berkeley.edu/~hu/book-chapters-and-lecture-slides-download.html Tennessee Technological University Wednesday, October 30, 013 8