IXTH10N100D2 IXTT10N100D2

Similar documents
IXFT60N50P3 IXFQ60N50P3 IXFH60N50P3

IXFT50N60P3 IXFQ50N60P3 IXFH50N60P3

Advance Technical Information IXFN110N85X V DSS. High Power Density Easy to Mount Space Savings BV DSS. = 3mA 850 V. = 8mA

IXTT76P10THV IXTA76P10T IXTP76P10T IXTH76P10T

IXTN660N04T4. TrenchT4 TM Power MOSFET = 40V = 660A. 0.85m. Advance Technical Information

IXTN660N04T4. TrenchT4 TM Power MOSFET = 40V = 660A. 0.85m. Advance Technical Information

IXTT16N10D2 IXTH16N10D2

IXFT50N60X IXFQ50N60X IXFH50N60X

IXTH30N60L2 IXTQ30N60L2 IXTT30N60L2

IXTH3N150 V DSS. High Voltage Power MOSFET = 1500V I D25 = 3A 7.3. R DS(on) N-Channel Enhancement Mode. Avalanche Rated. Fast Intrinsic Diode TO-247

IXTN200N10L2 V DSS = 100V = 178A. Linear L2 TM Power MOSFET w/ Extended FBSOA. Advance Technical Information

IXTH80N65X2 V DSS. X2-Class Power MOSFET = 650V I D25. = 80A 38m. R DS(on) N-Channel Enhancement Mode Avalanche Rated TO-247 G D S

IXTA24N65X2 IXTP24N65X2 IXTH24N65X2

IXFT100N30X3HV IXFH100N30X3

Trench Gate Power MOSFET

IXTK5N250 IXTX5N250 = 2500V = 5A < 8.8Ω. High Voltage Power MOSFET w/ Extended FBSOA. Advance Technical Information. R DS(on)

IXFH400N075T2 IXFT400N075T2

IXFH42N60P3. Polar3 TM HiperFET TM Power MOSFET. = 600V = 42A 185m. Preliminary Technical Information. R DS(on)

IXFK78N50P3 IXFX78N50P3

IXFK300N20X3 IXFX300N20X3

IXFK120N30T IXFX120N30T

TrenchMV TM Power MOSFET

IXFK240N25X3 IXFX240N25X3

IXTT440N04T4HV V DSS

IXTY18P10T IXTA18P10T IXTP18P10T

IXFT150N30X3HV IXFH150N30X3 IXFK150N30X3

IXFH42N65X2A V DSS = 650V I D25. X2-Class HiPerFET TM Power MOSFET. = 42A 72m. Advance Technical Information. R DS(on) AEC Q101 Qualified

IXTY4N65X2 IXTA4N65X2 IXTP4N65X2

TrenchMV TM Power MOSFET

Advance Technical Information IXFN80N60P3 V DSS. High Power Density Easy to Mount Space Savings Symbol Test Conditions Characteristic Values (T J

IXFN140N30P. Polar TM Power MOSFET HiPerFET TM = 300V = 110A V DSS I D ns. t rr. N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode

TrenchT2 TM Power MOSFET

TrenchMV TM Power MOSFET

TrenchT2 TM Power MOSFET

IXFT170N25X3HV IXFH170N25X3 IXFK170N25X3

IXFA7N100P IXFP7N100P IXFH7N100P

IXTF1N450 = 4500V. High Voltage Power MOSFET = 0.9A 80. R DS(on) (Electrically Isolated Tab) N-Channel Enhancement Mode.

IXTA76N25T IXTP76N25T IXTQ76N25T IXTH76N25T

IXTA50N25T IXTQ50N25T

IXFR230N20T V DSS. GigaMOS TM Power MOSFET = 200V = 156A. 8.0m t rr. 200ns. (Electrically Isolated Tab)

IXFK360N15T2 IXFX360N15T2

IXTA180N10T IXTP180N10T

IXFA270N06T3 IXFP270N06T3 IXFH270N06T3

IXTN600N04T2. TrenchT2 TM GigaMOS TM Power MOSFET = 40V = 600A. N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode

IXFN56N90P. = 900V = 56A 145m 300ns. Polar TM HiPerFET TM Power MOSFET V DSS I D25. R DS(on) t rr

IXFR18N90P V DSS. Polar TM HiPerFET TM Power MOSFET = 900V I D25 = 10.5A. R DS(on) 300ns. t rr

MMIX1F520N075T2 = 75V = 500A. 1.6m. TrenchT2 TM GigaMOS TM HiperFET TM Power MOSFET. (Electrically Isolated Tab)

IXFL32N120P. Polar TM HiPerFET TM Power MOSFET V DSS I D25 = 1200V = 24A. 300ns. Preliminary Technical Information. R DS(on) t rr

IXBH42N170 IXBT42N170

IXBK55N300 IXBX55N300

IXGK75N250 IXGX75N250

IXYH10N170CV1 V CES = 1700V I C110. High Voltage XPT TM IGBT w/ Diode. = 10A V CE(sat) 3.8V = 70ns. t fi(typ) Advance Technical Information TO-247 AD

MMIX4B22N300 V CES. = 3000V = 22A V CE(sat) 2.7V I C90

IXBK55N300 IXBX55N300

IXBT24N170 IXBH24N170

MMIX4B12N300 V CES = 3000V. = 11A V CE(sat) 3.2V. High Voltage, High Gain BIMOSFET TM Monolithic Bipolar MOS Transistor

IXBX50N360HV. = 3600V = 50A V CE(sat) 2.9V. BiMOSFET TM Monolithic Bipolar MOS Transistor High Voltage, High Frequency. Advance Technical Information

IXYH16N250CV1HV. High Voltage XPT TM IGBT w/ Diode V CES I C110. = 2500V = 16A V CE(sat) 4.0V = 250ns. t fi(typ) Advance Technical Information

IXBT20N360HV IXBH20N360HV

IXGT16N170A IXGH16N170A IXGT16N170AH1 IXGH16N170AH1

IXBT12N300 IXBH12N300

IXYX25N250CV1 IXYX25N250CV1HV

HiPerFAST TM High Speed IGBT C2-Class w/ Diode

PolarHT TM HiPerFET Power MOSFET

IXYH40N120C3D1 V CES

PolarHT TM Power MOSFET

IXYX40N450HV = 4500V = 40A 3.9V. High Voltage XPT TM IGBT. Preliminary Technical Information TO-247PLUS-HV. Symbol Test Conditions Maximum Ratings T C

IXXH75N60C3D1 V CES = 600V I C110. XPT TM 600V IGBT GenX3 TM w/ Diode. = 75A V CE(sat) 2.3V t fi(typ) = 75ns

IXYK100N120B3 IXYX100N120B3

GenX3 TM 1200V IGBT IXGH50N120C3 V CES = 1200V I C110 = 50A. 4.2V t fi(typ) = 64ns. Preliminary Technical Information

IXGH48N60A3D C

IXYH40N120C3 V CES = 1200V I C V XPT TM IGBT GenX3 TM. = 40A V CE(sat) 4.0V t fi(typ) = 38ns. Preliminary Technical Information

IXYL60N450 V CES = 4500V I C110. High Voltage XPT TM IGBT. = 38A V CE(sat) 3.30V. Preliminary Technical Information. (Electrically Isolated Tab)

IXGH60N60C3 = 600V I C110. GenX3 TM 600V IGBT V CES. = 60A V CE(sat) 2.5V t fi (typ) = 50ns. High Speed PT IGBT for kHz Switching TO-247 AD

IXXK200N60B3 IXXX200N60B3

IXXH80N65B4H1 V CES. XPT TM 650V IGBT GenX4 TM w/ Sonic Diode = 650V I C110. = 80A V CE(sat) 2.1V = 52ns. t fi(typ)

IXYL40N250CV1 V CES. High Voltage XPT TM IGBT w/ Diode = 2500V I C110. = 40A V CE(sat) 4.0V = 134ns. t fi(typ) Advance Technical Information

IXYH82N120C3 V CES = 1200V I C V XPT TM IGBT GenX3 TM. = 82A V CE(sat) 3.2V t fi(typ) = 93ns. High-Speed IGBT for khz Switching

PolarHT TM Power MOSFET

IXYN80N90C3H1 V CES = 900V I C V XPT TM IGBT GenX3 TM w/ Diode. = 70A V CE(sat) 2.7V t fi(typ) = 86ns. Advance Technical Information

IXYA20N120C3HV IXYP20N120C3 IXYH20N120C3

XPT TM 600V IGBT GenX3 TM w/diode MMIX1X200N60B3H1 = 600V I C110 V CES. = 72A V CE(sat) 1.7V t fi(typ) = 110ns. Preliminary Technical Information

IXXH60N65B4H1 V CES. XPT TM 650V IGBT GenX4 TM w/ Sonic Diode = 650V I C110. = 60A V CE(sat) 2.2V = 43ns. t fi(typ)

IXGK120N60B3 IXGX120N60B3

IXYN82N120C3H1 V CES

IXGL75N250 = 2500V I C90. High Voltage IGBT V CES. = 65A V CE(sat) 2.9V. Preliminary Technical Information. For Capacitor Discharge.

N-Channel 30-V (D-S) MOSFET With Sense Terminal

IXYB82N120C3H1 V CES

HiPerFAST TM IGBT with Diode

IXGR72N60B3H1. GenX3 TM 600V IGBT w/ Diode = 600V = 40A. 1.80V t fi(typ) = 92ns. (Electrically Isolated Tab)

IXGN60N60C2 IXGN60N60C2D1

Shenzhen Tuofeng Semiconductor Technology Co., Ltd 4402A. N-Channel Enhancement Mode Field Effect Transistor. Features

PolarHT TM HiPerFET Power MOSFET

HiPerFAST TM IGBT with Diode C2-Class High Speed IGBTs

GP1M003A080H/ GP1M003A080F GP1M003A080HH/ GP1M003A080FH

IXXR110N65B4H1. XPT TM 650V GenX4 TM w/ Sonic Diode V CES I C110. = 650V = 70A V CE(sat) 2.10V = 43ns. t fi(typ) (Electrically Isolated Tab)

N-Channel 30-V (D-S) MOSFET with Schottky Diode

Product Summary: BVDSS 30V RDSON (MAX.) 50mΩ 4.5A I D. Pb Free Lead Plating & Halogen Free EMB50P03J

FDS4435BZ P-Channel PowerTrench MOSFET -30V, -8.8A, 20m

IXGH 40N60B2D1 IXGT 40N60B2D1. Mounting torque (M3) 1.13/10 Nm/lb.in.

Transcription:

Depletion Mode MOFET Preliminary Technical Information IXTHND IXTTND X = V I D(on) > A R D(on). N-Channel D TO-7 (IXTH) D D (Tab) ymbol Test Conditions Maximum Ratings X = C to C V V DX = C to C, R = M V X Continuous V M Transient V P D T C = C 9 W -... + C M C T stg -... + C T L Maximum Lead Temperature for oldering C T OLD. mm (.in.) from Case for s C M d Mounting Torque (TO-7). / Nm/lb.in. Weight TO-7 g TO- g ymbol Test Conditions Characteristic Values ( = C, Unless Otherwise pecified) Min. Typ. Max. BX = - V, I D = A V (off) = V, I D = ma -. -. V I X = V, = V na I DX(off) = X, = - V A = C A R D(on) = V, I D = A, Note. I D(on) = V, = V, Note A TO- (IXTT) = ate D = Drain = ource Tab = Drain Features Normally ON Mode International tandard Packages Molding Epoxies Meet UL 9 V- Flammability Classification Advantages Easy to Mount pace avings High Power Density Applications Audio Amplifiers tart-up Circuits Protection Circuits Ramp enerators Current Regulators Active Loads D (Tab) 7 IXY CORPORATION, All Rights Reserved DA(/7)

ymbol Test Conditions Characteristic Values ( = C, Unless Otherwise pecified) Min. Typ. Max. g fs = V, I D = A, Note 7 C iss pf C oss = -V, = V, f = MHz pf C rss 7 pf t d(on) ns Resistive witching Times t r ns V t = + V, = V, I D = A d(off) ns t R =. (External) f ns Q g(on) nc Q gs = + V, = V, I D = A 9 nc Q gd 9 nc R thjc. C/W R thc TO-7. C/W afe-operating-area pecification Characteristic Values ymbol Test Conditions Min. Typ. Max. OA = V, I D =.A, T C = 7 C, tp = s 7 W ource-drain Diode ymbol Test Conditions Characteristic Values ( = C, Unless Otherwise pecified) Min. Typ. Max. V D I F = A, = -V, Note.. V TO-7 Outline IXTHND IXTTND Terminals: - ate - ource e P - Drain Dim. Millimeter Inches Min. Max. Min. Max. A.7...9 A...7. A...9.9 b.... b.... b.7... C.... D...9. E.7... e..7.. L 9...7. L..77 P.... Q.9... R..9.7.. BC BC TO- Outline t rr I. μs F = A, -di/dt = A/ s I RM V A Q R = V, = -V RM. μc Note. Pulse test, t s, duty cycle, d %. Terminals: - ate - ource, - Drain PRELIMINARY TECHNICAL INFORMATION The product presented herein is under development. The Technical pecifications offered are derived from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a "considered reflection" of the anticipated result. IXY reserves the right to change limits, test conditions, and dimensions without notice. IXY Reserves the Right to Change Limits, Test Conditions, and Dimensions. IXY MOFETs and IBTs are covered,,9,9,,9,9,7,,,,, B,,,77, 7,,7 B 7,7,B by one or more of the following U.. patents:,,7,7,,,7,,,9, B,,,7, B,79,9 7,,97 B,,,,79,7,7,,7,,7 B,,,7,,77,7 B 7,7,7

IXTHND IXTTND 9 Fig.. Output Characteristics @ = o C = V V V Fig.. Extended Output Characteristics @ = o C = V V V 7 -V V -V - V 7 9 - V 9 7 Fig.. Output Characteristics @ = o C = V V -V - V.E-.E-.E-.E-.E-.E-.E-7 Fig.. Drain Current @ = o C.E- 7 9 = -.V -.V -.7V -.V -.V -.V -.7V -.V.E- Fig.. Drain Current @ = o C.E+ Fig.. Dynamic Resistance vs. ate Voltage = -.V.E+ = 7V - V.E- -.7V.E+9 ID - Ampere.E-.E- -.V -.V -.V RO - Ohms.E+.E+7.E+ = o C = o C.E- -.7V -.V.E+.E- 7 9.E+ -. -. -. -. -. -. -. -. -. -. - Volts 7 IXY CORPORATION, All Rights Reserved

IXTHND IXTTND. Fig. 7. Normalized R D(on) vs. Junction Temperature. Fig.. R D(on) Normalized to I D = A Value vs. Drain Current. = V I D > A. = V V RD(on) - Normalized... RD(on) - Normalized.. = o C.. = o C. - - 7 - Degrees Centigrade. I D - Amperes Fig. 9. Input Admittance Fig.. Transconductance = V = V = - o C = o C o C - o C g f s - iemens o C o C - -. - -. - -. - -. - Volts I D - Amperes. Fig.. Normalized Breakdown and Threshold Voltages vs. Junction Temperature Fig.. Forward Voltage Drop of Intrinsic Diode = -V. (off) @ = V BV / V(off).. BX @ = - V I - Amperes = o C = o C.9. - - 7 - Degrees Centigrade....7..9 V D - Volts IXY Reserves the Right to Change Limits, Test Conditions, and Dimensions.

IXTHND IXTTND, Fig.. Capacitance Fig.. ate Charge Capacitance - PicoFarads,, f = MHz Ciss Coss V - Volts - - - = V I D = A I = ma Crss - - Q - NanoCoulombs Fig.. Forward-Bias afe Operating Area @ T C = o C Fig.. Forward-Bias afe Operating Area @ T C = 7 o C = o C T C = o C ingle Pulse R D(on) Limit, DC μs μs ms ms ms Fig. 7. Maximum Transient Thermal Impedance = o C T C = 7 o C ingle Pulse R D(on) Limit DC, μs μs ms ms ms. Fig. 7. Maximum Transient Thermal Impedance hvjv. Z (th)jc - K / W....... Pulse Width - econds 7 IXY CORPORATION, All Rights Reserved IXY REF: T_ND(C)--