25-2-23 Infrared Emitter (85 nm) Version.2 Features: Wavelength 85nm Short switching time Good spectral match to silicon photodetectors Applications IR remote control Sensor technology Discrete optocouplers Discrete interrupters Notes Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 6825- and IEC 6247. Ordering Information ype: Radiant Intensity Ordering Code I e [mw/sr] I F = ma, t p = 2 ms 2 ( 6.3) Q65A635 Note: Measured at a solid angle of Ω =. sr 25-2-23
Maximum Ratings ( A = 25 C) Parameter Symbol Values Unit Operation and storage temperature range op ; stg -4... C Reverse voltage V R 5 V Forward current I F ma Surge current (t p 2 µs, D = ) Characteristics ( A = 25 C) I FSM A Power consumption P tot 2 mw ESD withstand voltage (acc. to ANSI/ ESDA/ JEDEC JS- - HBM) V ESD 2 kv hermal resistance junction - ambient ) page 8 R thja 35 K / W hermal resistance junction - soldering point R thjs 5 K / W Parameter Symbol Values Unit Peak wavelength (I F = ma, t p = 2 ms) Centroid wavelength (I F = ma, t p = 2 ms) Spectral bandwidth at 5% of I max (I F = ma, t p = 2 ms) (typ) λ peak 86 nm (typ) λ centroid 85 nm (typ) λ 3 nm Half angle (typ) ϕ ± 7 Dimensions of active chip area (typ) L x W.3 x.3 mm x mm Rise and fall time of I e ( % and 9% of I e max ) (I F = ma, R L = 5 Ω) Forward voltage (I F = ma, t p = 2 ms) Forward voltage (I F = A, t p = µs) Reverse current (V R = 5 V) otal radiant flux (I F = ma, t p =2 ms) (typ) t r, t f 2 ns (typ (max)) V F.7 ( 2) V (typ (max)) V F 3.6 ( 4.6) V I R not designed for reverse operation µa (typ) Φ e 7 mw 25-2-23 2
Parameter Symbol Values Unit emperature coefficient of I e or Φ e (I F = ma, t p = 2 ms) emperature coefficient of V F (I F = ma, t p = 2 ms) emperature coefficient of wavelength (I F = ma, t p = 2 ms) Grouping ( A = 25 C) (typ) C I -.3 % / K (typ) C V -.6 mv / K (typ) C λ.3 nm / K Group Min Radiant Intensity Max Radiant Intensity yp Radiant Intensity I F = ma, t p = 2 ms I F = ma, t p = 2 ms I F = A, t p = µs I e, min [mw / sr] I e, max [mw / sr] I e, typ [mw / sr] SFH 4356 P-Q 6.3 2.5 4 SFH 4356 P-R 2 6 Note: measured at a solid angle of Ω =. sr Only one group in one packing unit (variation lower 2:). Relative Spectral Emission I rel = f(λ), A = 25 C I rel % 8 2) page 8 OHF432 2) page 8 Radiant Intensity I e / I e ( ma) = f(i F ), single pulse, t p = µs, A = 25 C Ι e Ι e ( ma) OHF564 6 4-2 -2 7 75 8 85 nm λ 95-3 2 ma I F 3 25-2-23 3
Max. Permissible Forward Current I F, max = f( A ), R thja = 35 K / W I F 2 ma OHF5655 2) page 8 Forward Current I F = f(v F ), single pulse, t p = µs, A = 25 C I F ma 3 OHF5645 8 6 2 5 4 2 5 2 4 6 8 C A 2 3 V 4 V F Permissible Pulse Handling Capability I F = f(t p ), A = 25 C, duty cycle D = parameter OHF5656. t A P I t F D P = IF.9 Permissible Pulse Handling Capability I F = f(t p ), A = 85 C, duty cycle D = parameter OHF5657. t A P I t F D P = IF.9.8.7.6.5.4.3.2 D =.5..2.5..2.5.8.7.6.5.4.3.2 D =.5..2.5..2.5.. -5-4 -3-2 - t p s 2-5 -4-3 -2 - t p s 2 25-2-23 4
Radiation Characteristics I rel = f(ϕ), A = 25 C 4 3 2) page 8 2 OHF5668 5 ϕ..8 6.6 7.4 8.2 9. Package Outline.8.6.4 2 4 6 8 2 Dimensions in mm. Package 3mm Radial ( ), Epoxy, black 25-2-23 5
Approximate Weight:.2 g Note Packing information is available on the internet (online product catalog). Recommended Solder Pad Dimensions in mm. Note: pad : cathode 25-2-23 6
W Soldering IEC-676- W 3 C 25 2 5 235 C - 26 C First wave Preheating 3 C 2 C C s max., max. contact time 5 s per wave < 5 K Second wave ypical OHA4645 Continuous line: typical process Dotted line: process limits Cooling ca. 3.5 K/s typical ca. 2 K/s ca. 5 K/s 5 Disclaimer 2 4 6 8 2 4 6 8 2 22 s 24 Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! he information describes the type of component and shall not be considered as assured characteristics. erms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the Internet. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components* may only be used in life-support devices** or systems with the express written approval of OSRAM OS. *) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or system. **) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health and the life of the user may be endangered. t 25-2-23 7
Glossary ) hermal resistance: junction -ambient, lead length between package bottom and PC-board max. mm 2) ypical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. hese do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 25-2-23 8
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