EE130: Integrated Circuit Devices (online at http://webcast.berkeley.edu) Instructor: Prof. Tsu-Jae King (tking@eecs.berkeley.edu) TA s: Marie Eyoum (meyoum@eecs.berkeley.edu) Alvaro Padilla (apadilla@eecs.berkeley.edu) Web page: Newsgroup: http://www-inst.eecs.berkeley.edu/~ee130/ ucb.class.ee130 Course Outline 1. Semiconductor Fundamentals 3 weeks 2. Metal-Semiconductor Contacts 1 week 3. P-N Junction Diode 3 weeks 4. Bipolar Junction Transistor 3 weeks 5. MOS Capacitor 1 week 6. MOSFET 4 weeks Gate Source Drain Substrate
Introduction Integrated-Circuit Devices Power4 µp 4004 µp
Planar Process Technology starting substrate + *planar processing steps = multiple devices monolithically integrated Si wafer n-channel MOSFET *sequence of additive and subtractive steps with lateral patterning oxidation deposition ion implantation etching lithography IC Technology Advancement Rapid advances in IC technology have been achieved primarily by scaling down transistor lateral dimensions Technology Scaling Investment Better Performance/Cost 100 ITRS 2001 Projection Market Growth GATE LENGTH (nm) 10 LOW POWER HIGH PERFORMANCE 1 2000 2005 2010 2015 2020 YEAR
Benefit of Transistor Scaling Moore s Law # transistors/chip doubles every 1.5 to 2 years 1,000,000,000 100,000,000 10,000,000 1,000,000 100,000 10,000 1970 1980 1990 2000 2010 1,000 Example: Microprocessor Evolution Generation: 1.5µ 1.0µ 0.8µ 0.6µ 0.35µ 0.25µ Intel386 DX Processor Intel486 DX Processor Pentium Processor Pentium II Processor
Semiconductor Fundamentals OUTLINE General material properties Crystal structure Bond model Read: Chapter 1 What is a Semiconductor? Low resistivity => conductor High resistivity => insulator Intermediate resistivity => semiconductor conductivity lies between that of conductors and insulators generally crystalline in structure for IC devices In recent years, however, non-crystalline semiconductors have become commercially very important polycrystalline amorphous crystalline
Semiconductor Materials Elemental: Compound: Alloy: From Hydrogen to Silicon # of Electrons 1 2 3 Z Name 1s 2s 2p 3s 3p 3d Notation 1H 1 1s 1 2He 2 1s 2 3Li 2 1 1s 2 2s 1 4Be 2 2 1s 2 2s 2 5 B 2 2 1 1s 2 2s 2 2p 1 6 C 2 2 2 1s 2 2s 2 2p 2 7 N 2 2 3 1s 2 2s 2 2p 3 8 O 2 2 4 1s 2 2s 2 2p 4 9 F 2 2 5 1s 2 2s 2 2p 5 10 Ne 2 2 6 1s 2 2s 2 2p 6 11 Na 2 2 6 1 1s 2 2s 2 2p 6 3s 1 12 Mg 2 2 6 2 1s 2 2s 2 2p 6 3s 2 13 Al 2 2 6 2 1 1s 2 2s 2 2p 6 3s 2 3p 1 14 Si 2 2 6 2 2 1s 2 2s 2 2p 6 3s 2 3p 2 15 P 2 2 6 2 3 1s 2 2s 2 2p 6 3s 2 3p 3 16 S 2 2 6 2 4 1s 2 2s 2 2p 6 3s 2 3p 4 17 Cl 2 2 6 2 5 1s 2 2s 2 2p 6 3s 2 3p 5 18 Ar 2 2 6 2 6 1s 2 2s 2 2p 6 3s 2 3p 6
The Silicon Atom 14 electrons occupying the 1st 3 energy levels: 1s, 2s, 2p orbitals filled by 10 electrons 3s, 3p orbitals filled by 4 electrons To minimize the overall energy, the 3s and 3p orbitals hybridize to form 4 tetrahedral 3sp orbitals Each has one electron and is capable of forming a bond with a neighboring atom The Si Crystal Each Si atom has 4 nearest neighbors lattice constant = 5.431Å diamond cubic lattice
Compound Semiconductors Ga As zincblende structure III-V compound semiconductors: GaAs, GaP, GaN, etc. important for optoelectronics and high-speed ICs Crystallographic Notation Miller Indices: Notation ( h k l ) { h k l } [ h k l ] < h k l > Interpretation crystal plane equivalent planes crystal direction equivalent directions h: inverse x-intercept of plane k: inverse y-intercept of plane l: inverse z-intercept of plane (Intercept values are in multiples of the lattice constant; h, k and l are reduced to 3 integers having the same ratio.)
Crystallographic Planes and Si Wafers Silicon wafers are usually cut along the (100) plane with a flat or notch to orient the wafer during IC fabrication: (011) flat (100) plane Crystallographic Planes in Si Unit cell: lattice constant = 5.431Å 5 x 10 22 atoms/cm 3 View in <111> direction View in <100> direction View in <110> direction
Electronic Properties of Si Silicon is a semiconductor material. Pure Si has a relatively high electrical resistivity at room temperature. There are 2 types of mobile charge-carriers in Si: Conduction electrons are negatively charged; Holes are positively charged. The concentration (#/cm 3 ) of conduction electrons & holes in a semiconductor can be modulated in several ways: 1. by adding special impurity atoms ( dopants ) 2. by applying an electric field 3. by changing the temperature 4. by irradiation Bond Model of Electrons and Holes Si Si Si 2-D representation: Si Si Si Si Si Si When an electron breaks loose and becomes a conduction electron, a hole is also created. Si Si Si Si Si Si Si Si Si
What is a Hole? Mobile positive charge associated with a half-filled covalent bond Treat as positively charged mobile particle in the semiconductor Fluid analogy: The Hole as a Positive Mobile Charge
Pure Si conduction n i 10 10 cm -3 at room temperature Crystalline Si: Summary 4 valence electrons per atom diamond lattice: each atom has 4 nearest neighbors 5 x 10 22 atoms/cm 3 In a pure Si crystal, conduction electrons and holes are formed in pairs. Holes can be considered as positively charged mobile particles which exist inside a semiconductor. Both holes and electrons can conduct current.